Journal Article10.1002/admt.202101530
3D Interdigital Electrodes Dielectric Capacitor Array for Energy Storage Based on Through Glass Vias
Zhen Fang,Libin Gao,Hongwei Chen,Bowen Deng,Xiaobing Jili,Wenlei Li,Tianpeng Liang,Sheng Qu,Yuzhe Chen,Ke Xin Liang,Jiahua Zhang +10 more
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TL;DR: In this article , the internal structure of photosensitive glass can be transformed into multilayer interdigital electrodes structure through photolithography and laser induced processes, which can be realized through the transition from the 2D structure to the 3D inter-digital electrodes dielectric capacitor.
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Abstract: Dielectric capacitors are ideal for high power pulse system due to their high‐power density. However, the traditional dielectric capacitor cannot achieve large capacitance density and combine with the high breakdown voltage. Through this research, the internal structure of photosensitive glass can be transformed into multilayer interdigital electrodes structure through photolithography and laser induced processes. It is realized through the transition from the 2D structure to the 3D interdigital electrodes dielectric capacitor. In this case, the specific surface area electrode structure presents exponential increase and dielectric layers thickness decrease, which provide a large capacitance density. The new 3D capacitors, via reducing the roughness of the electrode surface, a uniform porous inner wall improves the breakdown strength (8.15 MV cm−1, which is 2 times to photolithographic). As a result, these highly‐density regular electrodes array effectively improve the capacitance density to 48.5 nF cm−2, which is 422 times larger than that of planar structure. Moreover, the new 3D capacitors fabricated by laser‐induce exhibit smoother inner wall surface and more rounded shape of electrode holes, achieving very large energy storage density of ≈3.4 Wh kg−1 (14.688 J cm−3) and power density of ≈6.48 × 1011 W kg−1.
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Citations
Micro-nano structural electrode architecture for high power energy storage
TL;DR: The necessity and superiorities of micro-nano structural electrodes toward high power: Electrochemical energy storage (EES) technologies as mentioned in this paper , and the necessity and superiority of EES technologies towards high power.
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Analysis and Optimization of Sidewall Roughness on Microwave Performance of Through-Glass Vias in 3-D Integrated Circuits
Zhen Fang,Jiahua Zhang,Jinxu Liu,Hongwei Chen,Libin Gao,Xiaolin Yang,Wenlei Li,Xingzhou Cai,Hua-Wei Guo +8 more
Abstract: The integrity and reliability of signal transmission in glass 3-D integrated circuits (ICs) can be improved by studying the effect of sidewall roughness of through-glass vias (TGVs) on microwave performance. Thus, in this study, the effect of different sidewall roughness of TGVs on the electrical characteristics, such as loss, delay, and impedance correction factors, are analyzed by extracting S-parameters from the CPW-TGVs-CPW model. An accurate RLGC electrical model of TGVs that considers sidewall roughness is proposed. The correction factor of inductance is verified and found to be greater than that of resistance through simulation, physical measurements, and microscopic characterization analysis. Meanwhile, the sidewall roughness was improved by controlling the laser-induced wet etching (LIWE) process of TGVs. It was greatly reduced from $1.257 \mu \text{m}$ to 25 nm. The proposed electrical model is accurately verified below 40 GHz by extracting the electrical parameters of TGVs with different sidewall roughness.
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Extracting and Analyzing the S-Parameters of Vertical Interconnection Structures in 3D Glass Packaging
TL;DR: In this article , a methodology is proposed for the extraction of precise S-parameters using the transmission matrix (T-matrix) to analyze and evaluate the insertion loss (IL) and reliability of TGV interconnections.
Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)
Zhen Fang,Jiahua Zhang,Libin Gao,Hongwei Chen,Wenlei Li,Tianpeng Liang,Xingzhou Cai,Weicong Jia,Hua-Wei Guo,Yong Li +9 more
TL;DR: In this article , the authors presented a novel design of Ka-band (33 GHz) filtering packaging antenna (FPA) that features broadband and great filtering response, and is based on glass packaging material and through-glass via (TGV) technologies.
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