Abstract: Various software and hardware faults can destroy data transmission on the network, so it is essential to study fault-tolerant methods of Network-on-Chip(No C). In the paper, a modified fault-tolerant routing algorithm is proposed based on the XY algorithm, which can achieve an efficient route way by resetting the route rule when error occurred on the path of chain or between the nodes. The simulation results of the fault-tolerant routing algorithm based on FPGA are compared with the current commonly used routing algorithms on the applicable topology, whether to prevent deadlocks and so on; the simulation results show that the performance and feasibility of proposed modified fault-tolerant routing algorithm are both well.

Abstract: Soldered ball and copper interconnect are two main interconnect structures in the flip-chip package. Following the increase of clock frequencies of digital circuits, the differential signal has become the most commonly used in high-speed digital circuit. In the study, the HFSS full-wave simulation method is used to research the high-speed differential signal transmission characteristics of the differential soldered ball and copper interconnect structures in the flip chip package. First, the differential soldered ball is modeled under ideal circumstances to analyze the impact of differential signal transmission characteristics of the ball size and pitch parameters of soldered ball array. Under the assumption that the ball pitch is twice the size of ball diameter, smaller ball size and pitch could achieve better transmission performance over a wide frequency range when the diameter of the often used ball is between 0.1 mm and 1.27 mm. Second, parallel, inside-non-parallel and outside-non-parallel copper interconnect structures are compared. Parallel copper structure is observed to be better than inside-non-parallel copper structure, and inside-non-parallel copper structure is better than outside-non-parallel copper structure.

Abstract: Lighttools stimulation tools were utilized for the study of phosphors scatter properties. Transparent flat borosilicate glasses with≥95% light transmittance were applied as board materials. The reserve scattering energy of phosphors was 29% under the typical size and particle size distribution of phosphors. Using high transparent glass as substrates could improve the utilizing of the reverse light. Then double-sides light emitting structure of white strip-type LEDs with high light extraction efficiency was fabricated and their performance and reliability were characterized. The resulting warm white LEDs with correlated color temperature(CCT) of 3000 K exhibited a high luminous efficiency of 180 lm/W. The irritation angle was about 250 degree. Color tolerance is less than 6 SCDM. The reliability was good. The light extraction increased by about 15%, compared with ceramic board and aluminum board COB LED. The results are valuable and may be used for the application of the high power LED package.

Abstract: As a high reliability hermetic sealing technology, parallel seam sealing has more and more important applications in ceramic packaging industry. It will induce high residual thermal stresses by instantaneous large energy when during sealing process. And this maybe will affect the reliability of device after the subsequent test. The article introduces the theory and parallel seam sealing process parameters, and focuses on studying the thermal effects of process parameters by using the ANSYS simulation.