Abstract: The current IC wafer ling width characteristics is micronanoelectronic scaleThe microminiaturization process of electronic products and electronic systems will depend on the advanced packaging technologyIt has increasingly become a focus of the semiconductor industryNovel packaging technology with larger market value around home and abroad in recent years are introducedBasic structures and fabrication processes of some typical packaging are bescribed in detailFurthermore,it is pointed out current status a nd development trend of packaging technologyIn the recent years,endless varieties of packagings are proposedIt implements a new and higher level of packaging integration with higher assemble density,more strong features,better performance,smalles size,lower power consumption,faster speed,smaller delay,cost reduction,etcResearches and process of packaging cannot be ignoredIt has a great market potential and development in the days to comeAdvanced packaging technology are forcing semiconductor industry access the More-than-Moore era

Abstract: To meet the growing trend of Moore’s Law,chip technology has come "More than Moore" era of 3D integration.Further miniaturization of electronic systems and performance,3D integration solution is needed more and more.As for the demand-driven,the through-silicon vias(TSV)interconnect technology emerged as the three-dimensional integration and it is one of key techniques for 3D integration and waferlevel packaging.TSV integration is compared with raditional assembly methods,there are several advantages to adopt this technology.The main ones are: reduction of interconnects length,electrical performance improvement induced and wider range of possibilities for heterogeneous integration.3D integration would then allow to build systems including several families of components usually hardly compatible,like RF devices,memory,logic and MEMS.In this paper,nearly two years of foreign literature about 3D-TSV integrated interconnect technology and processes are summarized,the future trend of technology is discussed.

Abstract: The paper describes a 600bps speech coder based on MELP(enhanced mixed excitation linear prediction) algorithm.Consecutive three speech frames are grouped into super-frame and are jointly quantized by utilizing inter-frame redundancy in coder.The LSF vector is quantized with multi-mode predictive and multistage matrix quantization that handle mode transition by predictive coefficient and different mode in super-frames.The efficiency of the quantization is improved by joint quantization of pitch and gain.All of that make the quality of the synthetic voice better ever at 600bps.

Abstract: In this paper,the COB(Chip On Board) packaging technology is adopted in LED products to meet the requirements of high efficiency and low power dissipation.The optical features of LEDs are analyzed first.Subsequently,different packaging technology and materials are introduced to make a comparison between each other's effects on the flux,luminous efficiency and color temperature.Finally,the COB packaging technology is presented.After the introduction of its structure,advantages and practical utility,experiments are conducted.The experimental results show that the COB packaging not only has the capability of protecting the LED chips,but improves the efficiency and achieves specific optical distribution.Consequently,the proposed packaging technique achieves an increase on the luminous efficiency and adjusting of color temperature.

Abstract: In space environment,electronic devices are affected by total ionizing dose radiation.This paper investigates the total ionizing dose radiation effects of SRAM based field programmable gate array(FPGA),which is invented by us.The results show that:(1)The consumption current augments linearly with total does,but the FPGA can still run normally when the radiation effect can be endured.(2)The SRAM based FPGA can’t be configured immediately after radiation experiment,since the configuration needs a large transient current.(3)The power current can be regarded as a sensitive parameter to judge the invalidation of the device in the total dose radiation experiment.This work supplies a good technologic base for designing FPGA in the future.

Abstract: As one of the most important indexes of microwave module inspecting,the voltage standing wave ratio(VSWR) comprehensively represents of the level of circuit design and fabrication,and the values of VSWR determine the quality of products.In the microwave circuit that is used as a parameter distribution circuit,the wavelength of signal is much longer than the length of microstrip line.The interaction of the incident and reflect wave in signal line results in forming the standing wave.As the ratio of maximum voltage and minimum voltage of transmission line,VSWR reflects the signal energy of reflecting to source end under different conditions.The VSWR of microwave module is mainly affected by the factors including module parameters,the cascade matching of devices,and assembly technology.In this paper,the three primary factors that affect VSWR during the microwave module assembling process,grounding effect,assembly gap,and interconnection technology,were chosen to conduct a series of experiments.By applying the theory analysis and comparing the experimental results,the optimum assembly method of microwave module to achieve a better VSWR was obtained.

Abstract: This paper presents the designing of main circuit for 10kV voltage multifunction voltage disturbance generator,which using the topology of cascaded H bridges.The device is directly connected in a line in series,forming a voltage disturbance source.Combined with the main circuit topology of device,by using the PSCAD/EMTDC software,the steady-state performance of the device is simulated and the simulation results show the good feasibility of main circuit design for device.

Abstract: A gateway of wireless sensor net is designed in this paper.The gateway has a capability to access mullti-network.It offers four kinds of different network access methods for Ethernet,CDMA,WiFi and ZigBee and can realize the interconnection between those networks.The gateway hardware is divided into two parts: the core board and the bottom board to designe.The core board is one of the smallest embedded system,including processor and memory,where the Samsung S3C6410,maximum speed up to 667MHz.And the bottom board integrated a variety of device interface to facilitate connection with the different peripherals.The application software of gateway is programmed in C language and is based on the platform of Linux operation system.