Showing papers in "Electronics & Packaging in 2005"
Journal Article•
TL;DR: In this paper, the characteristic and application scope and bonding process of three flip-chip bonding technology is introduced and three flip chip bonding technologies are discussed. But the application scope is not discussed.
Abstract: Flip-chip bonding technology is a potential process in the electronic packaging Now there are C4 , Thermosonic flip-chip bonding and Conducting adhesive bonding process and so on This paper introduces characteristic and application scope and bonding process of three flip-chip bonding technology
3 citations