Showing papers in "Electronics & Packaging in 2004"
Journal Article•
TL;DR: In this paper, the authors describe the advanced microelectronics packaging technology which has developed rapidly during the 1990s and introduce the concept on three level packaging, which includes BGA, CSP, WLP, 3D packaging, SIP etc.
Abstract: This paper describes the advanced microelectronics packaging technology which has developed rapidly during the 1990.The technology includes BGA, CSP, WLP, 3D packaging , SIP etc.And it introduces the concept on three level packaging.In addition it gives some considerations and suggestions for developing the advanced microelectronics packaging technology in china.
2 citations
Journal Article•
TL;DR: In this article, the authors illustrate some of the concerns in SMT processing Technology on PCB designs, offer a reference for SMT designer, and illustrate the key of surface mount technology and guarantee of SMT quality.
Abstract: Surface Mount Technology is extensively applied in the assembly of electronic components and PCB, PCB designs is the key of surface Mount Technology and guarantee of SMT quality The paper illustrates some of the concerns in SMT processing Technology on PCB designs, offer a reference for SMT designer
2 citations
Journal Article•
TL;DR: In this article, design considerations and fundamental technologies and reliability of wafer-level packages (WLP) are introduced, and applications and future directions of WLP are also described.
Abstract: Design Considerations and fundamental technologies and reliability of wafer-level packages (WLP) are introduced.applicatons and future directions of WLP are also described.
1 citations