Showing papers in "Electronics & Packaging in 2003"
Journal Article•
TL;DR: The progress of metal matrix composites for electronic packaging is sum marized in this article, where the up-to-date trends are discussed and the future research directions are suggested, and the status and progress on A1/SiCp in the world and China are also reviewed.
Abstract: The rapid development of microelectronic technology has been giving impetus to the development of new electronic packaging materials.The progress of metal matrix composites for electronic packaging is sum marized in this paper.Status and progress on A1/ SiCp in the world and China are also reviewed.The up-to -date trends are discussed and the future research directions are suggested.
3 citations
Journal Article•
TL;DR: In this article, the essential process and design of multiplayer ceramic packages, selecting of major original materials, and its some questions in the research, and production are described and discussed in detail.
Abstract: This article describes essential process and design of multiplayer ceramic packages, selecting of major original materials, and its some questions in the research, and production.
3 citations
Journal Article•
TL;DR: In this article, the characteristics, types and process of BGA technology are discussed, and the cost to property ratio of several conventional BGA is discussed and the reliability of the BGA products in also introduced.
Abstract: This paper discusses the characteristics, types and process of BGA technology. Wire bond and flip chip,which are the two methods used for chip connection in BGA, are discussed. The cost to property ratio of several conventional BGA is discussed and the reliability of BGA products in also introduced. Some advices on how to develop BGA technology in our country are postulated in the end of the article.
2 citations
Journal Article•
TL;DR: In this article, double exposure holograms and real-time holographic interference are applied to test a aviation apparatus and the results show that the out-of-plane displacement distribution and the full-motion video-images of the displacement under different power and fixing conditions, through deposing the two different pattern stripe.
Abstract: In this paper,double exposure holograms and real-time holographic Interferometry are applied to test a aviation apparatus.The results show that the out-of-plane displacement distributing and the full-motion video-images of the out-of-plane displacement under different power and fixing conditions,through deposing the two different pattern stripe,The results show that the out-of-plane displacement of PCB increase with the power increasing and the out-of-plane displacement distributing is different under the different fixing conditions and the conduction and restriction,the out-of-plane displacement if district of resistance vary quickly and larely.
1 citations