Universiti Malaysia Perlis

Abstract: The adsorption behavior of basic, methylene blue (MB), and reactive, remazol brilliant violet 5R (RBV), dyes from aqueous solution onto Intsia bijuga sawdust-based activated carbon (IBSAC) was executed via batch and column studies. The produced activated carbon was characterized through Brunauer-Emmett-Teller (BET) surface area and pore structural analysis, proximate and ultimate, scanning electron microscopy (SEM), and Fourier transform infrared spectroscopy (FTIR). Batch studies were performed to investigate the effects of contact time, initial concentration, and solution pH. The equilibrium data for both MB and RBV adsorption better fits Langmuir model with maximum adsorption capacity of 434.78 and 212.77 mg/g, respectively. Kinetic studies for both MB and RBV dyes showed that the adsorption process followed a pseudo-second-order and intraparticle diffusion kinetic models. For column mode, the breakthrough curves were plotted by varying the flow rate, bed height, and initial concentration and the breakthrough data were best correlated with the Yoon-Nelson model compared to Thomas and Adams-Bohart model. The adsorption activity of IBSAC shows good stability even after four consecutive cycles.

Abstract: A multiband coplanar waveguide (CPW)-fed antenna loaded with metamaterial unit cell for GSM900, WLAN, LTE-A, and 5G Wi-Fi applications is presented in this paper. The proposed metamaterial structure is a combination of various symmetric split-ring resonators (SSRR) and its characteristics were investigated for two major axes directions at (x and y-axis) wave propagation through the material. For x-axis wave propagation, it indicates a wide range of negative refractive index in the frequency span of 2–8.5 GHz. For y-axis wave propagation, it shows more than 2 GHz bandwidth of near-zero refractive index (NZRI) property. Two categories of the proposed metamaterial plane were applied to enhance the bandwidth and gain. The measured reflection coefficient (S11) demonstrated significant bandwidths increase at the upper bands by 4.92–6.49 GHz and 3.251–4.324 GHz, considered as a rise of 71.4% and 168%, respectively, against the proposed antenna without using metamaterial. Besides being high bandwidth achieving, the proposed antenna radiates bi-directionally with 95% as the maximum radiation efficiency. Moreover, the maximum measured gain reaches 6.74 dBi by a 92.57% improvement compared with the antenna without using metamaterial. The simulation and measurement results of the proposed antenna show good agreement.

Abstract: The steganography process combines mathematics and computer science. Steganography consists of a set of methods and techniques to embed the data into another media so that the contents are unreadable to anyone who does not have the authority to read these data. The main objective of the use of base64 method is to convert any file in order to achieve privacy. This paper discusses a steganography and encoding method using base64, which is a set of encoding schemes that convert the same binary data to the form of a series of ASCII code. Also, the EoF technique is used to embed encoding text performed by Base64. As an example, for the mechanisms a file is used to represent the texts, and by using the two methods together will increase the security level for protecting the data, this research aims to secure many types of files in a particular media with a good security and not to damage the stored files and coverage media that used.

Abstract: The objective of this review is to study the evolution and key findings and critical technical challenges, solutions and future trend of bonding wires used in semiconductor electronics. Evolutions of bonding wires from Au to Cu and till the most recent silver (Ag) wire (perspective over 25 years packaging technology) have been discussed in this paper. The reliability performances of Au wire bonding, technical barriers of Cu wire bonding and corrosion mechanisms of Cu ball bonds are analyzed and covered. We focus on the influence of a variety of factors that have been reported recently, including reliability performance, wear out reliability performance that determine the selection of bonding wires to reach for developing high reliability of bonded devices. In the end of this review, the evolutions and future trends of bonding wires are compared and illustrated, which have marked effect based on the materials properties as well as reliability of wire types.