Tower Semiconductor Ltd.

Abstract: A method for producing a color CMOS image sensor including a matrix of pixels (e.g., CMOS APS cells) that are fabricated on a semiconductor substrate. A silicon-nitride layer is deposited on the upper surface of the pixels, and is etched using a reactive ion etching (RIE) process to form microlenses. A protective layer including a lower color transparent layer formed from a polymeric material, a color filter layer and an upper color transparent layer are then formed over the microlenses. Standard packaging techniques are then used to secure the upper color transparent layer to a glass substrate.

Abstract: A structure and method for implementing an EEPROM array using 2-bit non-volatile memory cells arranged in a plurality of rows and columns. Each memory cell has a first charge trapping region for storing a first bit and a second charge trapping region for storing a second bit. A plurality of bit lines are provided, wherein each bit line is coupled to the first charge trapping region of each memory cell in one column and to the second charge trapping region of each memory cell in an adjacent column. A memory control circuit is coupled to the bit lines, wherein the memory control circuit erases a word stored in the EEPROM array by applying an erase voltage to one or more of the bit lines. The applied erase voltage erasing all of the charge trapping regions coupled to the one or more bit lines. All of the charge trapping regions erased in response to the erase voltage represent a single word of the EEPROM array. The memory control circuit reads a word stored in the EEPROM array by sequentially accessing all of the charge trapping regions coupled to one or more of the bit lines. Similarly, the memory control circuit writes a word to the EEPROM array by sequentially programming all of the charge trapping regions coupled to one or more of the bit lines.

Abstract: A bit line control circuit for accessing an array of 2-bit non-volatile memory cells. Each memory cell has a first and a second charge trapping regions. A set of bit lines extends between the array and the bit line control circuit. The bit line control circuit includes pass transistors that selectively route pairs of bit lines to corresponding voltage control circuits in either a first order or a second (reversed) order. This enables both the first and second charge trapping regions of the memory cells to be accessed from the same voltage control circuits. In one embodiment, the bit line control circuit includes a first-level pass transistor coupled to each bit line. A second set of bit lines is coupled to the first-level pass transistors. A parallel-connected pair of second-level pass transistors is coupled to each bit line in the second set of bit lines. A third set of bit lines is coupled to the second-level pass transistors. The voltage control circuits are coupled to the third set of bit lines. The voltage control circuits apply voltages to the third set of bit lines to perform read, write and erase operations in the memory cells of the memory array. The first and second level pass transistors provide a consistent path for accessing all memory cells in the array, as well as handling the edge conditions introduced by the right-most and left-most columns of memory cells.

Abstract: A non-volatile memory (NVM) cell and array includes a control capacitor, tunneling capacitor, CMOS inverter and output circuit. The CMOS inverter includes PMOS and NMOS inverter transistors. The control capacitor, tunneling capacitor and PMOS and NMOS inverter transistors share a common floating gate, which is programmed/erased by Fowler-Nordheim tunneling. The output circuit includes PMOS and NMOS select transistors. The PMOS inverter and select transistors share a common source/drain region. Similarly, the NMOS inverter and select transistors share a common source/drain region. This configuration minimizes the required layout area of the non-volatile memory cell and allows design of arrays with smaller footprints. Alternately, the tunneling capacitor may be excluded, further reducing the required layout area of the NVM cell. In this case, the NMOS inverter transistor functions as a tunneling capacitor for programming and erasing the cell, and the PMOS inverter transistor functions as a tunneling capacitor for erasing the cell.