Conference
Electronic Components and Technology Conference
About: Electronic Components and Technology Conference is an academic conference. The conference publishes majorly in the area(s): Flip chip & Soldering. Over the lifetime, 9147 publications have been published by the conference receiving 102861 citations.
Papers published on a yearly basis
Papers
21 May 2000
TL;DR: In this paper, the crack initiation and growth constants are recalculated using ANSYS/sup TM/5.2 finite element code used in the model and several other model related issues are explored with respect to the crack growth correlations.
Abstract: A generalized solder joint fatigue life model for surface mount packages was previously published by the author. The model is based on correlation to measured crack growth data on BGA joints during thermal cycling. It was subsequently discovered by Anderson et. al. that the ANSYS/sup TM/ 5.2 finite element code used in the model had an error in its method for calculating plastic work. It was shown that significant error in life prediction could result by using a recent version of the code where the bug has been fixed. The error comes about since the original crack growth constants were derived based on plastic work calculations that had the bug. In this paper, crack initiation and growth constants are recalculated using ANSYS/sup TM/ 5.6. In addition, several other model related issues are explored with respect to the crack growth correlations. For example, 3D slice models were compared to quarter symmetry models. Anand's constitutive model was compared with Darveaux's constitutive model. It was shown that the crack growth rate dependence on strain energy density always had an exponent of 1.10+/-0.15. This is in the range of the original correlation, so the accuracy of relative predictions should still be within+/-25%. However, the accuracy of absolute predictions could be off by a factor of 7 in the worst case, if the analyst uses a modeling procedure that is not consistent with that used for the crack growth correlation. The key to good accuracy is to maintain consistency in the modeling procedure.
586 citations
18 May 1992
TL;DR: In this article, extensive data on 62Sn36Pb2Ag, 60Sn40Pb, 96.5Sn3.5Ag, 97.5Pb5Sn, and 95Pb6Sn solder assemblies were collected to properly account for the effects of grain size and intermetallic compound distribution.
Abstract: Extensive data on 62Sn36Pb2Ag, 60Sn40Pb, 96.5Sn3.5Ag, 97.5Pb2.5Sn, and 95Pb5Sn solder are presented. All of the data were collected on soldered assemblies to properly account for the effects of grain size and intermetallic compound distribution. Tensile and shear loading were employed in the strain rate range between 10/sup -8/ and 10/sup -1/ s/sup -1/ and the temperature range between 25 and 135 degrees C. It is remarkable to note that all of the data can be fit to the same general form of constitutive relations; i.e., only the constants depend on the solder alloy. The derived constitutive relations are used to predict solder joint response under thermal cycling. Based on the calculated hysteresis loops, it is apparent that each solder will have a different acceleration factor between field use cycling and accelerated test cycling. >
495 citations
30 May 2003
TL;DR: In this paper, the effect of different solder interconnect alloys (Sn59Pb40Agl and Sn95.5Ag3.8Cu0.7) on the fatigue life of solders under thermal cycle conditions was investigated.
Abstract: In recent years, many solder fatigue models have been developed to predict the fatigue life of solder joints under thermal cycle conditions. While a variety of life prediction models have been proposed for near eutectic SnPb(Ag)-solder joints in the literature, not enough work has been reported in extending these models to lead-free soldered assemblies. The development of lie prediction models requires a deep insight into failure modes, constitutive models for the themnomechanical behavior of solders and an experimental reliability database. This is needed for the correlation of experimentally determined cycles-to-failure to simulation results by fmiteelement analysis. This paper describes in detail the life-prediction models of SnPh(Ag) and SnAgCu solder joints for thermal cycle conditions. To obtain reliable FEM input and to verify simulation results, a variety of material testing and experimental fatigue data is necessary. The accuracy of lieprediction tools has also become critically important, as the designs need to he evaluated and improved with a high degree of reliability, not through relative comparison but by providing absolute numbers. This work deals with the effect of different solder interconnect alloys (Sn59Pb40Agl and Sn95.5Ag3.8Cu0.7) and the effect of different package types (PBGAs, CSPs, Flip Chip on FR-4 with and without underfill) on the fatigue life. Different temperature cycling conditions are applied.
431 citations
1 Jun 2004
TL;DR: In this paper, the authors describe in detail the life prediction models for SnAgCu solder joints, which are based on published constitutive equations for this alloy and thermal cycle fatigue data on actual components.
Abstract: Pb free solder is fast becoming a reality in electronic manufacturing due to marketing and legislative pressures. The industry has pretty much concluded that various versions of SnAgCu solder alloy offer the best alternative for eutectic Sn/Pb solder currently in use. With the current trend of cheaper, faster, and better electronic equipment, it has become increasingly important to evaluate the package and system performance very early in the design cycle using simulation tools. This requires life prediction models for new solder alloy systems so that the package-to-board interconnect reliability can be predicted for various environmental and field conditions. This paper describes in detail the life prediction models for SnAgCu solder joints. The models are based on published constitutive equations for this alloy and thermal cycle fatigue data on actual components. The approach uses advanced finite element modeling and analysis techniques and is based on mechanics of deformation. Both accumulated creep strain and creep strain energy density based models are developed. The model has been correlated with a number of data points and predicts life within 25% in most cases. The framework of modeling and prediction methodology described here is fully compatible with the framework used for SnPb solder previously.
397 citations
TSMC1
TL;DR: Comparison of InFO packages on package with several other previously proposed 3D package solutions shows that InFO_PoP has more optimized overall results on system performance, leakage power and area than others, to meet the ever-increasing system requirements of mobile computing.
Abstract: A powerful integrated fan-out (InFO) wafer level system integration (WLSI) technology has been developed to integrate application processor chip with memory package for smart mobile devices. This novel InFO technology is the first high performance Fan-Out Wafer Level Package (FO_WLP) with multi-layer high density interconnects proposed to the industry. In this paper we present the detailed comparison of InFO packages on package (InFO_PoP) with several other previously proposed 3D package solutions. Result shows that InFO_PoP has more optimized overall results on system performance, leakage power and area (form factor) than others, to meet the ever-increasing system requirements of mobile computing. InFO technology has been successfully qualified on package level with robust component and board level reliability. It is also qualified at interconnect level with high electromigration resistance. With its high flexibility and strong capability of multi-chips integration for both homogeneous and heterogeneous sub-systems, InFO technology not only provides a system scaling solution but also complements the chip scaling and helps to sustain the Moore's Law for the smart mobile as well as internet of things (IoT) applications.
257 citations
Performance Metrics
| Year | Papers |
|---|---|
| 2022 | 2 |
| 2021 | 312 |
| 2020 | 342 |
| 2019 | 344 |
| 2018 | 359 |
| 2017 | 331 |