Zane J Smith
6 Papers
Zane J Smith is an academic researcher. The author has contributed to research in topics: 3D printing & Fabrication. The author has an hindex of 1, co-authored 3 publications.
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Papers
Acrylic sealants as practicable direct ink writing (DIW) 3D-printable materials
GM Fazley St. Paul Elahee,Lihan Rong,Chase Breting,José Bonilla-Cruz,Tania Ernestina Lara Ceniceros,Zane J Smith,Jin Ge,Xiang Cheng,Mingwei Xu,Matthew Yang,Erick L. Ribeiro,Eugene B. Caldona,Rigoberto C. Advincula +12 more
TL;DR: In this article, a detailed study of well-known inexpensive, commercially available polymeric thermoset elastomers as potential inks for direct ink writing 3D printing is presented, where compositional and rheological characterizations are performed to compare three commercial acrylic elastomer inks, while printability and various performance properties of the corresponding 3D-printed structures are evaluated.
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On the 3D printing of polypropylene and post-processing optimization of thermomechanical properties
Melanie Moczadlo,Qiyi Chen,Xiang Cheng,Zane J Smith,Eugene B. Caldona,Rigoberto C. Advincula +5 more
TL;DR: In this article , the effect of printing parameters and post-processing conditions on the printed polymer's thermomechanical behavior was studied and the results showed that nozzle and bed temperatures of 220 and 100°C produced a high printing quality.
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Characterization of micro-sandwich structures via direct ink writing epoxy based cores
TL;DR: In this article , a hybrid direct ink writing (DIW) and vacuum infusion process (VIP) was employed to construct composite materials with bisphenol A-based epoxy core and carbon fiber reinforced polymer (CFRP) face sheets.
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Correlating viscosity and die swell in 3D printing of polyphenylsulfone: A thermo-mechanical optimization modus operandi
Zane J Smith,Cullen J. Golias,Travis J. Vaske,Stephen A. Young,Qiyi Chen,Logan Goodbred,Lihan Rong,Xiang Chen,Dayakar Penumadu,Rigoberto C. Advincula +9 more
TL;DR: This study investigates the thermal, thermo-mechanical, and layer-by-layer build-up of polyphenylsulfone (PPSU) in 3D printing, correlating viscosity and die swell behavior with void fraction volume and mechanical properties, revealing optimal extrusion temperatures for improved mechanical integrity.
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Formulated poly (butyl vinyl ether) adhesives as alternative materials for direct ink writing (DIW) 3D printing
Anh Nguyen,GM Fazley St. Paul Elahee,Charles Patten,Lihan Rong,Chase Breting,Jose Bonilla-Cruz,Tania Ernestina Lara Ceniceros,Zane J Smith,Jin Ge,Matthew Yang,Rigoberto C. Advincula +10 more
TL;DR: Formulated poly(butyl vinyl ether) adhesives are printable for DIW 3D printing, exhibiting a moisture-cured cross-linking mechanism and thixotropic build-up.
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