Metal-organic framework-based materials as an emerging platform for advanced electrochemical sensing

Innovative bimetallic MOFs offer more possibilities to further tailor the properties of MOFs, which have attracted great attention for wide applications. However, it is still a great challenge to rationally design bimetallic MOFs due to the lack of a tunable and reasonable hybrid structure architecture. Herein, a new series of bimetallic metal–organic frameworks (MOFs) with tunable pillar linkers were prepared by a one-step synthesis method. These bimetallic MOFs retain the same crystal structure when the mole fraction (based on metal) of the two metals changes from 0 to 1 and both metal ions occupy random nodal positions. The incorporation of a second metal cation has a large influence on the intrinsic properties (e.g. thermal stabilities and band gaps) of the MOFs. Furthermore, these bimetallic MOFs were used as self-sacrificial templates to prepare bimetal oxide catalysts for the oxygen evolution reaction (OER). After pyrolysis, a porous and hierarchical honeycomb-like structure with carbon network covered (bi)metal oxides is formed. Among all the bimetallic MOF-derived catalysts, CoNi1@C showed the best performance for the OER with the lowest Tafel slopes (55.6 mV dec−1) and overpotentials (335 mV on a glassy carbon electrode and 276 mV on Ni foam) at a current density of 10 mA cm−2, which is higher than those of state-of-the-art Co–Ni mixed oxide catalysts derived from MOFs for the OER. Our results indicate that the incorporation of a second metal ion is a promising strategy to tailor the properties of MOFs. More importantly, this new bimetallic MOF family with tunable linkers is expected to serve as a flexible assembly platform to offer broad possibilities for practical applications of MOFs.

/pdf/from-rational-design-of-a-new-bimetallic-mof-family-with-2wocuut5mb.pdf

From rational design of a new bimetallic MOF family with tunable linkers to OER catalysts

Copper-based metal-organic frameworks for biomedical applications.

Metal-organic frameworks based hybrid nanocomposites as state-of–the-art analytical tools for electrochemical sensing applications

The fabrication of biomimetic catalysts as substituents for enzymes is of critical interest in the field due to the problems associated with the extraction, purification, and storage of enzymes in sensing applications. Of these mimetics, hemin/coordination polymer-based nanocomposites, mainly hemin/metal-organic frameworks (MOF), have been developed for various biosensing applications because of the unique properties of each component, while trying to mimic the normal biological functions of heme within the protein milieu of enzymes. This critical review first discusses the different catalytic functions of heme in the body in the form of enzyme/protein structures. The properties of hemin dimerization are then elucidated with the supposed models of hemin oxidation. After that, the progress in the fabrication of hemin/MOF nanocomposites for the sensing of diverse biological molecules is discussed. Finally, the challenges in developing this type of composites are examined as well as possible proposals for future directions to enhance the sensing performance in this field further.

https://www.onlinelibrary.wiley.com/doi/pdf/10.1002/adma.202003883

Recent Advances in the Design and Sensing Applications of Hemin/Coordination Polymer-Based Nanocomposites

A Non-Enzymatic Electrochemical Sensing Platform Based on Hemin@MOF Composites for Detecting Hydrogen Peroxide and DNA

A Porous FeCuNi-Based Electrocatalyst Supported by Nickel Foam for Oxygen Evolution Reaction in Alkaline Conditions

This work studies the thermal stability of Cu/WSi x /p + -n and Cu/WSiN/WSi x /p + -n diodes in which the WSi x barrier layers were deposited by chemical vapor deposition to a thickness of about 50 nm using SiH 4 /WF 6 chemistry with the SiH 4 /WF 6 flow rates of 6/2 sccm, while the WSiN layers were formed by in situ N 2 plasma treatment on the chemically vapor deposited WSi x (CVD-WSi x ) surfaces. Without N 2 plasma treatment, the thermal stability of Cu/WSi x (50 nm)/p + -n junction diodes was found to reach 500°C; with N 2 plasma treatment, the resultant Cu/WSiN/WSi x (50 nm)/p + -n junction diodes were able to retain integrity of electrical characteristics up to at least 600°C. Failure mechanism of the WSiN/WSi x bilayer in the Cu/WSiN/WSi x /Si structure was closely related to the WSi x /Si interface reaction and the tungsten silicide formation of the WSi x layer. Thus, barrier capability of the WSiN/WSi x bilayer can be further improved by suppressing the WSi x /Si interface reaction and the silicidation of the WSi x layer. The thermal stability of Cu/barrier/p + -n diodes was further raised to 650°C by using a multilayer barrier structure of WSiN/WSi x (50 nm)/WSiN/WSi x (10 nm) or a WSiN/WSi y (y > 1) barrier. We conclude that the post-CVD-WSi x treatment with in situ N 2 plasma is a simple, practical, and efficient method of improving the WSi x -based barrier capability for Cu metallization.

https://ir.nctu.edu.tw:443/bitstream/11536/31427/1/000079811000057.pdf

Effective Improvement on Barrier Capability of Chemical Vapor Deposited WSi x Using N 2 Plasma Treatment

Thin-Film properties and barrier effectiveness against copper (Cu) diffusion of a thin amorphous WSi x layer were investigated. The amorphous WSi x layer was deposited by the chemical vapor deposition (CVD) method using the SiH 4 /WF 6 chemistry with the activation energy determined to be 3.0 kcal/mol. The CVD-WSi x film has a low film stress, low electrical resistivity, and excellent step coverage. The resistivity of the amorphous CVD-WSi x layer increases with the deposition temperature, but the residual stress of the layer decreases with the deposition temperature. The WSi x /Si structure is thermally stable up to at least 600°C, while the copper-contacted Cu/WSi x /Si structure with a 50 nm thick WSi x barrier is stable only up to 550°C. Moreover, the Cu/WSi x /p + -n junction diodes can sustain a 30 min thermal annealing up to 500°C without causing degradation in electrical characteristics. Barrier failure of the WSi x layer in the Cu/WSi x /Si structure at temperatures above 550°C is attributed to Cu atoms diffusion via fast paths in the WSi x layer. These fast paths were presumably developed from grain growth of the WSi x layer and/or thermal-stress-induced weak points in the WSi x layer.

https://ir.nctu.edu.tw:443/bitstream/11536/31724/1/000077171500028.pdf

Thin‐Film Properties and Barrier Effectiveness of Chemically Vapor Deposited Amorphous WSi x Film

Handle everyday research tasks with reliable, citation-backed results

Your personal Research Agent to handle research tasks with citation-backed results

Popular Tasks used by Researchers

How can I help with your research?

Meet SciSpace

Get more enhanced response by uploading the PDFs you want me to reference.

No relevant PDFs in your library

SciSpace is the AI research assistant for academics. Run systematic literature reviews on 280M+ papers, and write papers with cited sources. Trusted by 1M+ students, PhDs & researchers.

SciSpace | AI for Research

Analyze PDFs

Code & Manuscripts

Funding & Grants

Literature & Patents

Medical & Clinical Data

Systematic Review

Visualize & Present

Web & Data

Build a Google Scholar-like website for your research.

Build a website

Create charts and images for your research

Create a Chart

Write a paper for submission to a journal

Draft a manuscript

Patent Search

Design eye-catching scientific posters in minutes.

Scientific Poster Generation

Systematic Literature Review

One task is running at the moment. Your messages will be shown right after.

Drag and drop or click here to browse

Loved by <highlight>1 million+</highlight> researchers

Extract a list of specific topics and their sources from unstructured text

Topics

Compare and analyze relevant papers that matches with your search

Papers

Get insights from PDFs and bookmarked papers from your library

My library

Recent searches

Try searching for:

Catch AI-generated content in scholarly and non-scholarly content

{ai} Detector

Ai Writer

Get PDF Summaries, highlighted text explanations 

Chat with PDF

Effortlessly create in-text citations and bibliographies in APA and 2,500 other formats

Citation generator

Get explanations, summaries, and answers on academic papers

Ease up your research workflow with {scispace}'s cohort of exciting AI tools

Elevate your academic writing skills and convey your ideas the way you want

Paraphraser

Explore our range of reading and writing tools

Your file is being prepared and should be ready in a few minutes. If it's a large file, it might take a bit longer. You can close this window, and we'll email you the file when it's done.

You have reached a maximum limit of <strong>{limit}</strong> columns in the table. Remove at least <strong>1</strong> column to add or create another one.

Yawei Lin

Author Tools

Chat about Author

Papers

A Non-Enzymatic Electrochemical Sensing Platform Based on Hemin@MOF Composites for Detecting Hydrogen Peroxide and DNA

A Porous FeCuNi-Based Electrocatalyst Supported by Nickel Foam for Oxygen Evolution Reaction in Alkaline Conditions

Effective Improvement on Barrier Capability of Chemical Vapor Deposited WSi x Using N 2 Plasma Treatment

Thin‐Film Properties and Barrier Effectiveness of Chemically Vapor Deposited Amorphous WSi x Film