The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

Micro assembled LED displays and lighting elements

An active substrate includes a plurality of active components distributed over a surface of a destination substrate, each active component including a component substrate different from the destination substrate, and each active component having a circuit and connection posts on a process side of the component substrate. The connection posts may have a height that is greater than a base width thereof, and may be in electrical contact with the circuit and destination substrate contacts. The connection posts may extend through the surface of the destination substrate contacts into the destination substrate connection pads to electrically connect the connection posts to the destination substrate contacts.

Methods for surface attachment of flipped active components

An electronic component array includes a backplane substrate, and a plurality of integrated circuit elements on the backplane substrate. Each of the integrated circuit elements includes a chiplet substrate having a connection pad and a conductor element on a surface thereof. The connection pad and the conductor element are electrically separated by an insulating layer that exposes at least a portion of the connection pad. At least one of the integrated circuit elements is misaligned on the backplane substrate relative to a desired position thereon. A plurality of conductive wires are provided on the backplane substrate including the integrated circuit elements thereon, and the connection pad of each of the integrated circuit elements is electrically connected to a respective one of the conductive wires notwithstanding the misalignment of the at least one of the integrated circuit elements. Related fabrication methods are also discussed.

Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance

A micro-transfer printable electronic component includes one or more electronic components, such as integrated circuits or LEDs. Each electronic component has device electrical contacts for providing electrical power to the electronic component and a post side. A plurality of electrical conductors includes at least one electrical conductor electrically connected to each of the device electrical contacts. One or more electrically conductive connection posts protrude beyond the post side. Each connection post is electrically connected to at least one of the electrical conductors. Additional connection posts can form electrical jumpers that electrically connect electrical conductors on a destination substrate to which the printable electronic component is micro-transfer printed. The printable electronic component can be a full-color pixel in a display.

Micro-transfer printable electronic component

A matrix-addressed system includes a system substrate and an array of pixels arranged in rows and columns disposed on the system substrate. A column-control circuit provides information to or receives information from the pixels. The column-control circuit includes a separate column-driver circuit connected to each column of pixels that provides information in common to all of the pixels in the column or receives information in common from all of the pixels in the column. A row-select circuit likewise disposed on the system substrate includes a serial shift register having a number of row storage elements equal to or larger than the number of rows in the array of pixels. Each row storage element in the shift register has a row-select line connected to all of the pixels in a row.

Serial row-select matrix-addressed system

The present invention relates to a nitride light emitting diode (LED) package, and more specifically, to a nitride light emitting diode package which can improve light-emitting efficiency by increasing light emitting surface area, reduce operating voltage by simultaneously emitting light from six cells at once, and can increase operating current.

Light emitting diode package and method for manufacturing same

A light-emitting element comprises a semiconductor layer, a light-emitting laminated structure and a plurality of inverted pyramid structures formed in one surface of the light-emitting laminated structure. The transverse cross-sectional areas of the inverted pyramid structures decrease extending perpendicularly relative to the light-emitting laminated structure. The light-emitting element is rendered easier to produce due to the inverted pyramid structures.

Semiconductor template substrate, light-emitting element using a semiconductor template substrate, and a production method therefor

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Light emitting diode package and method for manufacturing same

Semiconductor template substrate, light-emitting element using a semiconductor template substrate, and a production method therefor