Copper alloys with high strength and electrical conductivity are a key focus for next-generation electronic materials. In this study, a precipitation-strengthened Cu-0.96Ni-0.22 P alloy with tensile strength, yield strength, and electrical conductivity values of 630 MPa, 614 MPa, and 64 %IACS, respectively, were designed via thermomechanical treatment. The nanoprecipitates remain in the form of the G.P zone during 450 °C aging from 30 to 120 min. Theoretical calculation results showed that the precipitation of coherent G.P zones contributes to a major strengthening to the Cu-Ni-P alloy. Coarsening of precipitates and recrystallization were the primary reasons for softening during the over-aged stage. The uniform growth of Ni2P phases was the main precipitation process during stable transformation, and the simultaneous precipitation of the Ni12P5 phase and a cube-like Ni3P phase was observed with a higher coarsening rate. 

Microstructure and properties evolution of a Cu–Ni–P alloy with high strength and high conductivity during thermomechanical treatment

Effect of Mg addition on the microstructure and mechanical properties of Cu-Ti-Zr alloy

Pre-aging treatment before cold rolling and final aging was introduced to optimize the mechanical properties and electrical conductivity properties of Cu-0.75Fe-0.35Ti alloy. The alloy was pre-aged at 540 °C for 6 h, then cold rolled with thickness reduction of 80%, followed by aging at 460 °C for 2 h (SARA). Vickers hardness, electronic conductivity and uniaxial tensile tests were conducted to measure the mechanical and electrical conductivity properties. Electron backscatter diffraction and transmission electron microscope were used to characterize the microstructural evolution. The results showed that the hardness, tensile strength and electrical conductivity of SARA were up to 198.2 ± 4.8 HV, 622.6 ± 6.3 MPa and 63.8% IACS, respectively, which were superior to those achieved without pre-aging. The enhanced mechanical properties of SARA were attributed to an increase in low angle boundaries (LABs), geometrically necessary dislocation (GND) density and volume fraction of precipitates, while the favorable electrical conductivity was ascribed to the enhancement of precipitation and resultant matrix purification. 

Optimizing strength and electrical conductivity of Cu-Fe-Ti alloy by pre-aging treatment

Microstructure and hot deformation behavior of Cu-Ti-Zr(-Mg) alloys

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Hot Deformation Behavior and Microstructure Evolution of the Cu-1.5ti-(0.5fe) Alloys

Double-peak precipitation hardening in the Cu-Fe-Ti alloy

Herein, the ultimate tensile strength and electrical conductivity of precipitation-strengthened Cu-Ni-Si alloys were simultaneously improved by utilizing a machine learning-based multiobjective design strategy. The multiobjective design strategy consists of five main steps: creating the initial dataset, generating alloy features, screening key alloy features, modeling and inversely designing, and experimental iteration. Of particular note is the constraint placed on the initial composition-properties dataset, considering the rules governing the addition of Co. This constraint ensures that the dataset adheres to the required specifications. To evaluate the optimized degree of the inverse design composition, a joint expectation improvement function was employed. This function effectively integrates the ultimate tensile strength and electrical conductivity. Through a process of five mutually reinforcing iterations of machine learning and experimentation, the combined property of the designed alloy surpasses the Pareto frontier initially formed by the collected data. Microstructure analysis further confirmed the significant precipitation strengthening effects achieved in the optimized alloy. 

Design of high performance Cu-Ni-Si alloys via a multiobjective strategy based on machine learning

Revealing the role of Cr addition on the microstructure, properties and softening resistance of a pre-aged Cu-Ni-Co-Si alloy

Effect of pre-aging on the microstructure and properties evolution of cold-rolled Cu-Ni-Co-Si during final aging

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