21 Papers
24 Citations
Xing Fu is an academic researcher from South China University of Technology. The author has contributed to research in topics: Electromigration & Grain boundary. The author has an hindex of 2, co-authored 18 publications.
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Papers
A paste based on Cu@Sn@Ag particles for die attachment under ambient atmosphere in power device packaging
TL;DR: In this paper, the outermost Ag layer prevents the oxidation of the Sn layer and expedites the consumption of the lowmelting point Sn phase, which shows great potential in die attachment in power device packaging.
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The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints.
TL;DR: The in-situ observation of Sn-3.0Ag-0.5Cu solder joints under electromigration was conducted to investigate the microstructure and grain orientation evolution, and it was observed that there was a grain rotation phenomenon during current stressing by in-Situ electron backscattered diffraction (EBSD).
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Ag-Sn bimetallic nanoparticles paste for high temperature service in power devices
TL;DR: High strength Cu-Cu interconnections were achieved by sintering the paste of Ag-Sn bimetallic nanoparticles at low temperature because the outer Sn coatings of the nano-Ag particles were found to be favorable for the densification of the bondline.
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Microstructure and Grain Orientation Evolution in SnPb/SnAgCu Interconnects Under Electrical Current Stressing at Cryogenic Temperature
TL;DR: This study may provide understanding of cryogenic electromigration evolution of the Cu/solder interface and provide visual data for abnormal lattice transformation at the current stressing.
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A low-temperature Cu-to-Cu interconnection method by using nanoporous Cu fabricated by dealloying electroplated Cu–Zn
TL;DR: In this article, the average resistivity, thermal conductivity, and shear strength of the bondlines were determined to be 4.12μΩ/cm, 176.49 W/m−1/K−1, and 18.78 MPa, respectively.
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