The invention provides an alignment precision detection method. The method comprises the following steps: step 1, carrying out aligning by using a same set of alignment marks on a test plate; step 2, carrying out primary alignment exposure by using the alignment marks for exposure of a first group of scales and then carrying out secondary alignment exposure by using the alignment marks again for exposure of a second group of scales; and step 3, subjecting the test plate to development and observing graduation lines totally aligned with the two groups of scales so as to obtain offset directions and offset amounts in an X direction and a Y direction. The invention has the following beneficial effects: the method can detect repeated alignment precision and interlaminar alignment precision of high-alignment precision laser direct imaging equipment; an alignment precision detection system has the characteristic of transfer of influence of the system itself and has a minimum precision error of 1 mu m; measurement is not needed, detection precision can be accurately acquired through direct observation, and influence of precision of measurement equipment and measurement errors are avoided.

Alignment precision detection method and system

The invention discloses a semi-automatic alignment and exposure device of a printed circuit board (PCB). The semi-automatic alignment and exposure device comprises an alignment chamber and an exposure chamber, wherein an upper slipway and a lower slipway are respectively arranged in the alignment chamber and the exposure chamber and are in parallel, an upper alignment platform is arranged in the upper slipway and comprises a first working table, a first upper cover and an alignment mechanism, the first working table can slide along the upper slipway, the first upper cover is hinged with the first working table, a signal acquisition device is arranged above the first working table and can slide along the alignment chamber, the exposure chamber comprises an exposure device, the exposure device can do vertical movement along the exposure chamber, a lower alignment platform comprises a second working table, a second upper cover and an alignment mechanism, the second working table can slide along the lower slipway, the second upper cover is hinged with the second working table, the first working table and the second working table do movement relative to each other by a driving device, the semi-automatic alignment and exposure device also comprises a control system, and the control system controls opening and closing of a partition plate, controls the first working table and the second working table to do movement relative to each other and controls the alignment mechanism to automatically align. The semi-automatic alignment and exposure device has the advantages of positioning accuracy and high positioning efficiency.

Semi-automatic alignment and exposure device of printed circuit board (PCB)

Deviation equalization counterpoint method of PCB (printed circuit board) exposure machine

The invention discloses an alignment method for an exposure machine. The alignment method comprises the following steps of taking any one of multiple alignment marks from a same alignment region as the reference alignment mark, and taking other alignment marks except the reference alignment mark as backup alignment marks; performing alignment by the reference alignment mark; choosing one of the backup alignment marks for performing alignment when the alignment is unsuccessful by the reference alignment mark; and when the alignment is also unsuccessful by the chosen backup alignment mark, repeatedly performing the operation of choosing one of the backup alignment marks for performing alignment. According to the alignment method for the exposure machine, after one time of wrong alignment occurs, the backup alignment marks are chosen automatically for performing alignment again; and therefore, the waste of production cost caused by automatic alarm and machine halt when the reference alignment is unsuccessful of the exposure machine, or the out-of-service of a substrate caused by partial failed alignment are avoided.

Alignment method for exposure machine

The invention discloses an alignment stability process for outer layer film design. The alignment stability process comprises the following steps of performing film manufacturing, alignment circle designing, verification circle designing, positioning hole drawing, film positioning hole forming, circuit board positioning hole forming, and film alignment and alignment detecting, wherein in the step1), the obtained three-dimensional data needs to satisfy dimensional and surface precision condition needed in growth amplification; in growth amplification, a two-dimensional model is subjected to transition and fusion treatment based on partial similarity of three-dimensional lines on a sample; the alignment circles of an alignment circle arrangement structure and verification circles of a verification circle arrangement structure are both linearly arranged; the alignment circles of the alignment circle arrangement structure and verification circles of the verification circle arrangement structure are both positioned on the linear initial positions; and in the step 7), for ensuring film alignment precision, expansion and shrinkage needs to be measured accurately on quadratic element. Theprocess has a simple structure, convenience in manufacturing, and capability of effectively improving film alignment precision and alignment speed and improving use convenience.

Alignment stability process for outer layer film design

Alignment verification method for exposure machine

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Alignment verification method for exposure machine