ABSTRACT Owing to the incapability of the existing techniques, Electrochemical Spark Machining (ECSM) is transpiring to micro machine the glass for potential applications in micro domain. However, in ECSM, the bubble accumulation and poor flushing lead to the generation of a non-uniform gas film, resulting in the deterioration of Hole Circularity (HC) and Surface Roughness (SR). Therefore, present communication is an attempt toward the concept of Rotary-Magnet assisted ECSM (RM-ECSM) to produce the micro holes in the borosilicate glass with better quality characteristics (higher HC and lower SR), which are required for better performance of glass vias in RF-MEMS. The evolutionary algorithm and Machine Learning (ML) have been adopted for optimization. From optimization, the values of optimal input parameters were obtained as follows: Applied voltage = 43.46 V; Electrolyte-temperature = 45.93 ֯ C; Pulse on time = 3.28 ms; Magnetic rotation = 551 rpm with corresponding values of HC and SR as 79.28% and 3 um respectively. Finally, these outcomes were validated by Levenberg-Marquardt algorithm (ML).

Optimization of Rotary-Magnet assisted ECSM on borosilicate-glass using machine learning

In this paper, we present an analysis and a validation of a simulation program with integrated circuit emphasis (SPICE) model for a pulse forming circuit of a high frequency electroporation system, which can deliver square-wave sub-microsecond (100–900 ns) electric field pulses. The developed SPICE model is suggested for use in evaluation of transient processes that occur due to high frequency operations in prototype systems. A controlled crowbar circuit was implemented to support a variety of biological loads and to ensure a constant electric pulse rise and fall time during electroporation to be independent of the applied buffer bioimpedance. The SPICE model was validated via a comparison of the simulation and experimental results obtained from the already existing prototype system. The SPICE model results were in good agreement with the experimental results, and the model complexity was found to be sufficient for analysis of transient processes. As result, the proposed SPICE model can be useful for evaluation and compensation of transient processes in sub-microsecond pulsed power set-ups during the development of new prototypes.

https://www.mdpi.com/2079-9292/8/6/710/pdf

Validation of a SPICE Model for High Frequency Electroporation Systems

The sidewall roughness of through-glass vias (TGVs) at high frequencies significantly impacts the integrity and reliability of signal transmissions via the inductance and resistance-correction factors resulting from the combined effect of the skin depth and sidewall roughness. Here, to further investigate the generation and mechanism of the correction factors, a hemispherical physical model of the sidewall roughness of actual TGVs is proposed, and the <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${RL}$</tex-math> </inline-formula> model comprising the skin depth and sidewall roughness is derived; the measured results were compared with the causal hemispherical model and the multilevel causal Huray model, and it was verified that the proposed hemispherical model can calculate the <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${RL}$</tex-math> </inline-formula> parasitic parameters of TGV with high accuracy. Concurrently, the proposed hemispherical model confirms that the correction factor for internal inductance is larger than that for resistance; it can explore the main source of sidewall-roughness-induced parasitic effects. Moreover, the model offers a solution for reducing the sidewall-roughness-induced parasitic effects. 

Derivation and Analysis of a Hemispherical Physical Model and the Correction Factors for the Sidewall Roughness of Through-Glass Vias

There are many applications for glass-to-glass bonding, such as manufacturing optical devices, electronic components, and microsystem applications. This article presents a simple and effective method for glass-to-glass bonding using laser modification with Ti/Cu/Ti/TiO2 thin films. Ti/Cu/Ti thin films were prepared on glass using magnetron sputtering and then exposed to the atmosphere for 30 min at room temperature for preoxidation to obtain Ti/Cu/Ti/TiO2 thin films. The TiO2 thin film was intentionally formed to improve the bonding quality. To analyze the bonding mechanism, the energy dispersive spectroscopy (EDS) and X-ray photoelectron spectra (XPS) analyses studied the microstructural evolution. The results show that Si diffuses from the glass to the thin films by laser irradiation. The laser beam penetrated the glass and was directly absorbed by the TiO2 thin films. Ti diffuses from the oxide thin film toward the glass, forming Ti–Si covalently structured silicate (the main component is TiSi2) in the bonded region. The formation of TiSi2 is the critical process for this laser bonding. Furthermore, the bonding strengths corresponding to different contact pressures applied during the bonding process were compared and analyzed. The results show that the method achieves more robust glass/TiSi2/Ti/Cu/TiSi2/glass bond pairs with tensile strengths up to 14 MPa and low bonding defect density (< 0.05%). Note that this laser bonding technology was processed at room temperature, allowing the use of thermally sensitive materials in device manufacturing. To verify the application potential of the laser bonding technique in 3-D glass packaging, a simple coplanar waveguide (CPW)–through-glass vias (TGVs)–CPW interconnect structure was developed on three-layer glass interposers in this article. The interconnection loss was successfully measured by constructing a three-layer interconnect structure with laser bonding. The results show that the insertion loss can meet the requirements of glass-based microsystem applications.

Enhancing Glass-to-Glass Bonding at Room Temperatures Using Laser Surface Modification With Ti/Cu/Ti/TiO2 Thin Films

This article presents a design of Ka -band absorptive filtering packaging antenna (AFPA) based on through-glass vias (TGVs). Compared to other reflective filtering antennas (RFAs), the AFPA showcases a distinct design featuring dual absorptive band-edge radiation nulls and four reflective stopband radiation nulls. Additionally, the AFPA used a glass multilayer stacked 3-D package scheme that enables good microwave characteristics and high-density interconnects. The radiating patch was composed of an RFA and band-stop filter (BSF) whose reflection coefficients were almost complimentary. The RFA radiating patch and BSF unit were comprised of defect microstrip structure (DMS) and defect ground structure (DGS), corresponding dimensions were <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\lambda _{g}$ </tex-math></inline-formula> /4 and <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\lambda _{g}$ </tex-math></inline-formula> /2, respectively. The radiating patch layer was connected to the substrate-integrated waveguide (SIW) feeding structure layer through a glass transition layer with TGVs and pads, and the packaging process was accomplished using laser bonding. Then we used SIW operating in Ka -band to feed the AFPA. To validate this design, a prototype of the AFPA was fabricated and measured. The results indicate −10 dB impedance bandwidth ranging from 30 to 35 GHz, with a peak gain of 6.06 dBi and a maximum radiation efficiency of approximately 85%. The measurements reveal that the AFPA has dual absorptive band-edge radiation nulls at 30.9 and 33.5 GHz, and four reflective stopband radiation nulls at 25.9, 27.3, 35.1, and 38.4 GHz, with a suppression level exceeding 15.5 dB. 

Absorptive Filtering Packaging Antenna Design Based on Through-Glass Vias

The integrity and reliability of signal transmission in glass 3-D integrated circuits (ICs) can be improved by studying the effect of sidewall roughness of through-glass vias (TGVs) on microwave performance. Thus, in this study, the effect of different sidewall roughness of TGVs on the electrical characteristics, such as loss, delay, and impedance correction factors, are analyzed by extracting S-parameters from the CPW-TGVs-CPW model. An accurate RLGC electrical model of TGVs that considers sidewall roughness is proposed. The correction factor of inductance is verified and found to be greater than that of resistance through simulation, physical measurements, and microscopic characterization analysis. Meanwhile, the sidewall roughness was improved by controlling the laser-induced wet etching (LIWE) process of TGVs. It was greatly reduced from $1.257 \mu \text{m}$ to 25 nm. The proposed electrical model is accurately verified below 40 GHz by extracting the electrical parameters of TGVs with different sidewall roughness.

Analysis and Optimization of Sidewall Roughness on Microwave Performance of Through-Glass Vias in 3-D Integrated Circuits

[The sub-microsecond pulser applied for electroporation effect].

Handle everyday research tasks with reliable, citation-backed results

Your personal Research Agent to handle research tasks with citation-backed results

Popular Tasks used by Researchers

How can I help with your research?

Meet SciSpace

Get more enhanced response by uploading the PDFs you want me to reference.

No relevant PDFs in your library

SciSpace is the AI research assistant for academics. Run systematic literature reviews on 280M+ papers, and write papers with cited sources. Trusted by 1M+ students, PhDs & researchers.

SciSpace | AI for Research

Analyze PDFs

Code & Manuscripts

Funding & Grants

Literature & Patents

Medical & Clinical Data

Systematic Review

Visualize & Present

Web & Data

Build a Google Scholar-like website for your research.

Build a website

Create charts and images for your research

Create a Chart

Write a paper for submission to a journal

Draft a manuscript

Patent Search

Design eye-catching scientific posters in minutes.

Scientific Poster Generation

Systematic Literature Review

One task is running at the moment. Your messages will be shown right after.

Drag and drop or click here to browse

Loved by <highlight>1 million+</highlight> researchers

Extract a list of specific topics and their sources from unstructured text

Topics

Compare and analyze relevant papers that matches with your search

Papers

Get insights from PDFs and bookmarked papers from your library

My library

Recent searches

Try searching for:

Catch AI-generated content in scholarly and non-scholarly content

{ai} Detector

Ai Writer

Get PDF Summaries, highlighted text explanations 

Chat with PDF

Effortlessly create in-text citations and bibliographies in APA and 2,500 other formats

Citation generator

Get explanations, summaries, and answers on academic papers

Ease up your research workflow with {scispace}'s cohort of exciting AI tools

Elevate your academic writing skills and convey your ideas the way you want

Paraphraser

Explore our range of reading and writing tools

Your file is being prepared and should be ready in a few minutes. If it's a large file, it might take a bit longer. You can close this window, and we'll email you the file when it's done.

You have reached a maximum limit of <strong>{limit}</strong> columns in the table. Remove at least <strong>1</strong> column to add or create another one.

Xiaolin Yang

Author Tools

Chat about Author

Papers

Analysis and Optimization of Sidewall Roughness on Microwave Performance of Through-Glass Vias in 3-D Integrated Circuits

[The sub-microsecond pulser applied for electroporation effect].