10 Papers
18 Citations
Xiaohong Hao is an academic researcher from University of Electronic Science and Technology of China. The author has contributed to research in topics: Thermal resistance & Heat sink. The author has an hindex of 5, co-authored 10 publications.
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Papers
Efficient on-chip hotspot removal combined solution of thermoelectric cooler and mini-channel heat sink
TL;DR: In this article, a combined solution of thermoelectric cooler (TEC) and mini-channel heat sink was proposed to remove the hotspot of the chip in the electronic equipment.
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Fast approach of Pareto-optimal solution recommendation to multi-objective optimal design of serpentine-channel heat sink
TL;DR: In this paper, a multi-objective structural design of a serpentine channel heat sink is presented, in which a multiobjective artificial swarm fish algorithm with a variable population size using a non-dominated sorting method (MOAFNS) has been developed to handle the optimisation.
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Thermal Analysis and Experimental Validation of Laminar Heat Transfer and Pressure Drop in Serpentine Channel Heat Sinks for Electronic Cooling
TL;DR: In this article, a thermal resistance network analytical model is proposed to investigate the thermal resistance and pressure drop in serpentine channel heat sinks with 180 deg bends, where the bend loss coefficient is obtained as a function of the Reynolds number, aspect ratios, widths of fins, and turn clearances.
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Transient thermal model of a permanent magnet synchronous planar motor considering spreading thermal resistance
TL;DR: In this paper, a thermal resistance network model is proposed to investigate the transient temperature field of PMSP motors, and the effect of thermal resistance and thermal capacitance on the maximum temperature rise is also investigated.
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Interfacial thermal conductance and thermal accommodation coefficient of evaporating thin liquid films: A molecular dynamics study
TL;DR: In this article, the effect of solid-gas binding strength and surface coverage on the interfacial thermal conductance and thermal accommodation coefficient of evaporating liquid films was investigated, and it was found that binding strength has an important role in forming the absorption layers that reduces the temperature jump and enhances the heat transfer performance.
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