Windu Sari
Yeungnam University
5 Papers
118 Citations
Windu Sari is an academic researcher from Yeungnam University. The author has contributed to research in topics: Thin film & Transmission electron microscopy. The author has an hindex of 4, co-authored 5 publications.
Chat about Author
Papers
Low Temperature Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and O2
Tae Kwang Eom,Windu Sari,Choi Kyu Jeong,Shin Woong Chul,Jae Hyun Kim,Do-Joong Lee,Ki-Bum Kim,Hyunchul Sohn,Soo-Hyun Kim +8 more
TL;DR: Ru thin films were deposited by atomic layer deposition (ALD) through alternating exposures of a metallorganic precursor, C 16 H 22 Ru [(η6-1-isopropyl-4-methylbenzene) (η4-cyclohexa-1,3-diene)ruthenium(0)] and O 2 at 220°C.
67
Improvement of the Diffusion Barrier Performance of Ru by Incorporating a WN x Thin Film for Direct-Plateable Cu Interconnects
TL;DR: In this paper, a sputter-prepared Ru (7 nm)/WN x (8 nm) stacked layer was investigated as a diffusion barrier layer between Cu and Si for direct-plateable Cu interconnects, and its performance was compared with that of a Ru single layer with the same thickness (15 nm).
32
Plasma Enhanced Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and NH3 Plasma
TL;DR: In this paper, a 0.094 nm/cycle at the ALD temperature window was obtained, which is twice that of PEALD Ru results deposited by Cp (Cyclopentaldienyl)-based Ru precursors previously reported.
20
A bilayer diffusion barrier of Ru/WSixNy for advanced Cu interconnects
TL;DR: In this article, Bilayers of Ru (7nm)/WSi x N y (8nm) prepared by sputtering were investigated as diffusion barriers between Cu and Si for direct-platable Cu interconnects.
7
Ru/WNx Bilayers as Diffusion Barriers for Cu Interconnects
TL;DR: In this article, Bilayers of Ru (7 nm)/WNx (8 nm) prepared by sputtering were investigated as diffusion barriers between Cu and Si, and their performances were compared as a function of N2 flow rate during the deposition of WNx.
2