Damascene copper electroplating for on-chip interconnections, a process that we conceived and developed in the early 1990s, makes it possible to fill submicron trenches and vias with copper without creating a void or a seam and has thus proven superior to other technologies of copper deposition. We discuss here the relationship of additives in the plating bath to superfilling, the phenomenon that results in superconformal coverage, and we present a numerical model which accounts for the experimentally observed profile evolution of the plated metal.

Damascene copper electroplating for chip interconnections

To develop photosensitizers with high open-circuit photovoltage (Voc) is a crucial strategy to enhance the power conversion efficiency (PCE) of co-sensitized solar cells. Here, we show a judiciously tailored organic photosensitizer, coded MS5, featuring the bulky donor N-(2’,4’-bis(dodecyloxy)-[1,1’-biphenyl]-4-yl)-2’,4’-bis(dodecyloxy)-N-phenyl-[1,1’-biphenyl]-4-amine and the electron acceptor 4-(benzo[c][1,2,5]thiadiazol-4-yl)benzoic acid. Employing MS5 with a copper (II/I) electrolyte enables a dye-sensitized solar cell (DSC) to achieve a strikingly high Voc of 1.24 V, with the Voc deficit as low as 130 mV and an ideality factor of merely 1.08. The co-sensitization of MS5 with the wider spectral-response dye XY1b produces a highly efficient and stable DSC with the PCE of 13.5% under standard AM1.5 G, 100 mW cm−2 solar radiation. Remarkably, the co-sensitized solar cell (active area of 2.8 cm2) presents a record PCE of 34.5% under ambient light, rendering it very attractive as an ambient light harvesting energy source for low power electronics. Designing photo-sensitisers with high open-circuit voltage (Voc) is desirable to enhance the power conversion efficiency (PCE) of co-sensitized solar cells. Here, the authors employ a judiciously tailored organic sensitiser MS5 with copper electrolyte to achieve a Voc of 1.24 V, and recorded PCE of 34.5% under ambient light.

/pdf/a-molecular-photosensitizer-achieves-a-v-oc-of-1-24-v-1y8sly3gp9.pdf

A molecular photosensitizer achieves a V oc of 1.24 V enabling highly efficient and stable dye-sensitized solar cells with copper(II/I)-based electrolyte

The Internet of Things (IoT) provides everyday objects and environments with “intelligence” and data connectivity to improve quality of life and the efficiency of a wide range of human activities. However, the ongoing exponential growth of the IoT device ecosystem—up to tens of billions of units to date—poses a challenge regarding how to power such devices. This Progress Report discusses how energy harvesting can address this challenge. It then discusses how indoor photovoltaics (IPV) constitutes an attractive energy harvesting solution, given its deployability, reliability, and power density. For IPV to provide an eco‐friendly route to powering IoT devices, it is crucial that its underlying materials and fabrication processes are low‐toxicity and not harmful to the environment over the product life cycle. A range of IPV technologies—both incumbent and emerging—developed to date is discussed, with an emphasis on their environmental sustainability. Finally, IPV based on emerging lead‐free perovskite‐inspired absorbers are examined, highlighting their status and prospects for low‐cost, durable, and efficient energy harvesting that is not harmful to the end user and environment. By examining emerging avenues for eco‐friendly IPV, timely insight is provided into promising directions toward IPV that can sustainably power the IoT revolution.

https://onlinelibrary.wiley.com/doi/pdf/10.1002/aenm.202100698

Emerging Indoor Photovoltaic Technologies for Sustainable Internet of Things

Mechanisms and Suppression of Photoinduced Degradation in Perovskite Solar Cells

Recent progress of organic photovoltaics for indoor energy harvesting

https://onlinelibrary.wiley.com/doi/pdf/10.1002/aenm.201901980

Tailoring Triple‐Anion Perovskite Material for Indoor Light Harvesting with Restrained Halide Segregation and Record High Efficiency Beyond 36%

Study of grain size effect of Cu metallization on interfacial microstructures of solder joints

The mechanical performance of electroplated Cu plays a crucial role in next-generation Cu-to-Cu direct bonding for the three-dimension integrated circuit (3D IC). This work reports direct-current electroplated (111)-preferred and nanotwin-doped nanocrystalline Cu, of which strength is at the forefront performance compared with all reported electroplated Cu materials. Tension and compression tests are performed to present the ultrahigh ultimate strength of 977 MPa and 1158 MPa, respectively. The microstructure of nanoscale Cu grains with an average grain size around 61 nm greatly contributes to the ultrahigh strength as described by the grain refinement effect. A gap between the obtained yield strength and the Hall-Petch relationship indicates the presence of extra strengthening mechanisms. X-ray diffraction and transmission electron microscopy analysis identify the highly (111) oriented texture and sporadic twins with optimum thicknesses, which can effectively impede intragranular dislocation movements, thus further advance the strength. Via filling capability and high throughput are also demonstrated in the patterned wafer plating. The combination of ultrahigh tensile/compressive strength, (111) preferred texture, superfilling capability and high throughput satisfies the critical requirement of Cu interconnects plating technology towards the industrial manufacturing in advanced 3D IC packaging application.

Electrodeposition of (111)-oriented and nanotwin-doped nanocrystalline Cu with ultrahigh strength for 3D IC application.

https://onlinelibrary.wiley.com/doi/pdf/10.1002/aenm.201970146

Indoor Perovskite Cells: Tailoring Triple‐Anion Perovskite Material for Indoor Light Harvesting with Restrained Halide Segregation and Record High Efficiency Beyond 36% (Adv. Energy Mater. 38/2019)

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Tailoring Triple‐Anion Perovskite Material for Indoor Light Harvesting with Restrained Halide Segregation and Record High Efficiency Beyond 36%

Study of grain size effect of Cu metallization on interfacial microstructures of solder joints

Electrodeposition of (111)-oriented and nanotwin-doped nanocrystalline Cu with ultrahigh strength for 3D IC application.

Indoor Perovskite Cells: Tailoring Triple‐Anion Perovskite Material for Indoor Light Harvesting with Restrained Halide Segregation and Record High Efficiency Beyond 36% (Adv. Energy Mater. 38/2019)