17 Papers
41 Citations
Wei Hu is an academic researcher from Guangdong University of Technology. The author has contributed to research in topics: Laser & Wafer dicing. The author has an hindex of 6, co-authored 14 publications.
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Papers
A new monitoring method for metal rust removal states in pulsed laser derusting via acoustic emission techniques
TL;DR: In this article, acoustic emission (AE) monitoring and high-speed camera were successfully integrated for reliable investigation of laser derusting mechanism, where the removal characteristics and microscopic changes of rust layer observed and analyzed using AE signals and high speed images are utilized for further improvement of the mechanism of rust removal by pulsed laser.
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Low‐Cost Fabrication of Large‐Area Broccoli‐Like Multiscale Micro‐ and Nanostructures for Metallic Super‐Hydrophobic Surfaces with Ultralow Water Adhesion and Superior Anti‐Frost Ability
Abstract: Metallic super‐hydrophobic surfaces with ultralow water adhesion are essential for a wide variety of applications, such as enhanced condensation heat transfer and anti‐icing applications. Broccoli‐like multiscale micro‐ and nanostructures composed of four different microscale and nanoscale features are fabricated on different metal surfaces by an inexpensive nanosecond laser system in this study. The surface shows high stability during evaporation, and the surface water adhesion of this structure is only 1.4 ± 0.4 µN, much lower than that of typical reported surfaces. Slight changes to the surface morphology results in an increase in the surface water adhesion, and this unique broccoli‐like surface structure shows an much better anti‐frost ability compared with similar structures with slightly higher water adhesion. The results provide a cost‐effective method to achieve large‐area metallic super‐hydrophobic surfaces with extremely low water adhesion and superior anti‐frost ability.
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Incubation effect during laser-induced backside wet etching of sapphire using high-repetition-rate near-infrared nanosecond lasers
TL;DR: In this article, the authors found that the etching rate of laser-induced backside wet etching (LIBWE) using near-infrared nanosecond laser could be increased greatly and that the processing quality deteriorated appreciably when using high-repetition-rate laser pulses.
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Internal modified structure of silicon carbide prepared by ultrafast laser for wafer slicing
TL;DR: In this article , the effect of pulse duration on the internal modification process and formation mechanism of the modified layer according to morphology and composition was studied, showing that the increase in pulse duration favors the formation of internal modified structures.
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Three dimensional material removal model of laser-induced backside wet etching of sapphire substrate with CuSO4 solutions
TL;DR: In this article, a three-dimensional thermal model is established to simulate the material removal during the laser-induced backside wet etching (LIBWE) process by considering the material data variations of temperature, enthalpy change and latent heat fusion.
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