Wei-Chen Li
Yuan Ze University
11 Papers
64 Citations
Wei-Chen Li is an academic researcher from Yuan Ze University. The author has contributed to research in topics: Wafer & Anisotropic diffusion. The author has an hindex of 8, co-authored 11 publications. Previous affiliations of Wei-Chen Li include Chung Hua University.
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Papers
Defect detection of solar cells in electroluminescence images using Fourier image reconstruction
TL;DR: In this paper, a self-reference scheme based on the Fourier image reconstruction technique is proposed for defect detection of solar cells with electroluminescence (EL) images, where the target defects appear as line- or bar-shaped objects in the EL image.
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Defect Inspection in Low-Contrast LCD Images Using Hough Transform-Based Nonstationary Line Detection
Wei-Chen Li,Du-Ming Tsai +1 more
TL;DR: A Hough transform-based method to identify low-contrast defects in unevenly illuminated images, and especially focus on the inspection of mura defects in liquid crystal display (LCD) panels, is proposed.
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A fast regularity measure for surface defect detection
Du-Ming Tsai,Ming-Chun Chen,Wei-Chen Li,Wei-Yao Chiu +3 more
- 01 Sep 2012
TL;DR: Experimental results on a variety of material surfaces found in industry, including textured images of plastic surfaces and leather and non-textured image of backside solar wafers and LCD backlight panels, have shown the effectiveness of the proposed regularity measure for surface defect detection.
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Defect detection in multi-crystal solar cells using clustering with uniformity measures
TL;DR: An automatic defect detection scheme based on Haar-like feature extraction and a new clustering technique that is effective and efficient to detect various defects in solar cells is proposed.
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Flaw detection of cylindrical surfaces in PU-packing by using machine vision technique
Yih-Chih Chiou,Wei-Chen Li +1 more
TL;DR: In this paper, a machine-vision-based system for detecting flaws occurred in PU-packings is developed, which consists of three inspection stations: the first station uses area-scan cameras to check the top and bottom surfaces of a packing.
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