Wayne Johnson
Auburn University
13 Papers
198 Citations
Wayne Johnson is an academic researcher from Auburn University. The author has contributed to research in topics: Drop impact & Shock (mechanics). The author has an hindex of 8, co-authored 13 publications.
Chat about Author
Papers
Models for reliability prediction of fine-pitch BGAs and CSPs in shock and drop-impact
Pradeep Lall,Dhananjay Panchagade,Yueli Liu,Wayne Johnson,Jeffrey C. Suhling +4 more
- 01 Jun 2004
TL;DR: In this paper, explicit finite element models have been used to study the transient dynamics of printed circuit boards during drop from 6ft to 0.5ft using high-speed video at 40,000 fps per second.
138
Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages
TL;DR: In this article, the transient dynamics of printed circuit boards during drop from 6 ft. were investigated using finite element models with smeared-property formulations, including shell and solid elements.
79
A new approach to designing electronic systems for operation in extreme environments: Part II - The SiGe remote electronics unit
Troy D. England,R.M. Diestelhorst,Eleazar Walter Kenyon,John D. Cressler,V. Ramachandran,Michael L. Alles,Robert A. Reed,Richard W. Berger,R. Garbos,Benjamin J. Blalock,Alan Mantooth,M. Barlow,Fa Foster Dai,Wayne Johnson,Charles D. Ellis,Jim Holmes,C. Webber,Patrick McCluskey,M. Mojarradi,L. Peltz,R. Frampton,C. Eckert +21 more
TL;DR: In this paper, the authors presented the architecture, simulation, packaging, and over-temperature and radiation testing of a complex, 16-channel, extreme environment capable, SiGe Remote Electronics Unit containing the Remote Sensor Interface ASIC that can serve a wide variety of space-relevant needs as designed.
24
The processing and assembly of liquid crystalline polymer printed circuits
Tan Zhang,Wayne Johnson,Brian Farrell,Michael Lawrence +3 more
- 01 Jan 2002
TL;DR: In this article, the processes for manufacturing liquid crystal polymers (LCP) printed circuit boards, assembly onto LCP boards and fabrication of LCP packages were examined, and the solderability and surface insulation measurements of test coupons passed industry requirements for printed wiring boards.
17
A new approach to designing electronic systems for operation in extreme environments: Part I - The SiGe Remote Sensor Interface
R.M. Diestelhorst,Troy D. England,Richard W. Berger,R. Garbos,Chandradevi Ulaganathan,Benjamin J. Blalock,K. Cornett,Alan Mantooth,Xueyang Geng,Fa Foster Dai,Wayne Johnson,Jim Holmes,Michael L. Alles,Robert A. Reed,Patrick McCluskey,M. Mojarradi,L. Peltz,R. Frampton,C. Eckert,John D. Cressler +19 more
TL;DR: In this paper, the authors describe the modeling, circuit design, system integration, and measurement of a Remote Sensor Interface (RSI) that took place over a span of 5 years and 8 fabrication cycles.