The invention discloses a technological method for composite asynchronous polishing of ceramics using picosecond-nanosecond laser. The technological method comprises the steps of firstly, irradiatingthe ceramic surface to be machined through picosecond laser along a certain scanning trace, and removing micro protrusions of the ceramic surface, so that the preliminary flattening is achieved; meanwhile, generating a large number of micro-nano particles by using a removal mechanism for the electronic state of ceramic materials through picosecond laser, wherein the micro-nano particles exist at adjacent space areas of the irradiated ceramic surface; starting a low power nanosecond laser according to the preset time for tracing the scanning path of the picosecond laser, and irradiating and fusing the micro-nano particles uniformly distributed on the ceramic surface; and finally forming a compact and smooth fine-grain melted layer so that the polishing effect is achieved. According to the technological method, original pore cracks of the ceramic materials are repaired, and the shortcomings that a heat affected zone generated by traditional laser polishing is large and the material surface is liable to generate micro-cracks and pores are overcome; and low removal amount, high efficiency and accuracy and submicron-level fine polishing of the ceramic materials is achieved.

Technological method for composite asynchronous polishing of ceramics using picosecond-nanosecond laser

An ultrafast laser polishing method for ceramic matrix composite material At first, that proces sample of SiC ceramic matrix composite is fixed on the lase processing equipment, the laser processing equipment comprise an optical path system and a processing platform, the optical path system comprises a femtosecond laser, and the laser of the femtosecond laser acts on the processing platform afterpassing through a mirror, a beam expanding mirror, an aperture, a vibrating mirror and a field mirror assembly; The machining platform comprises a three-dimensional movement mechanism and a fixture inthe x, y and z axes directions relative to the worktable, an angular displacement table is installed in the three-dimensional movement mechanism, and the included angle between the y axis direction and the normal of the worktable can be changed by adjusting the angular displacement table to obtain a large incident angle of the laser beam; The laser parameters of the femtosecond laser, the scanning of the vibrating mirror and the movement of the three-dimensional moving mechanism are controlled by the computer to polish the sample. The invention utilizes the laser and the processing platform to work cooperatively, adjusts the transverse and longitudinal light spot overlap ratio according to the need, ensures the uniformity of the processing, and has high processing efficiency.

Ultrafast laser polishing method for ceramic matrix composites

The invention relates to a CO2 laser remelting and gasifying composite polishing method for an optical element. The method is characterized in that the optical element is subjected to remelting polishing and gasifying polishing alternate layered scanning by changing laser power, repetition frequency and light spot diameter in a CO2 laser parallel scanning mode, track directions of each layer of scanning are different, and efficient and high-precision polishing of the optical element is realized. The method is suitable for high-efficiency and high-precision polishing of various optical elements.

CO2 laser remelting and gasifying composite polishing method for optical element

Embodiments of the present disclosure provide methods of laser assisted modification, i.e., laser polishing, of ceramic substrates, or ceramic coated substrates, to desirably reduce the surface roughness and porosity thereof. In one embodiment, a method of laser polishing a workpiece surface includes scanning at least a portion of the workpiece surface with a pulsed laser beam. The laser beam has a pulse frequency of about 50 kHz or more and a spot size of about 10 mm2 or less and the workpiece surface comprises a ceramic material.

Laser polishing ceramic surfaces of processing components to be used in the manufacturing of semiconductor devices

The invention discloses a method for reducing the roughness of the surface of a rough material and a mold. A three-dimensional pore structure is arranged in the rough material, and the three-dimensional pore structure communicates with the surface. The method includes the steps that holes in the working surface of the rough material are filled with powder materials to make the working surface smooth; the powder materials are solidified, and the solidified powder materials form a block-shaped structure to be combined with the rough material; and through holes are formed in the block-shaped structure, and the through holes communicate with the three-dimensional pore structure inside the rough material. The method can effectively reduce the roughness of the surface of the rough material.

Method for reducing roughness of surface of rough material and mold

The invention discloses a method for repairing and polishing ceramic parts through laser. The method comprises the steps of S1, cleaning the ceramic part, and assembling the ceramic part to a three-dimensional moving platform; S2, scanning the surface contour of the ceramic part, comparing the scanned contour model with a standard model, and dividing the surface of the ceramic part into an etching region, a polishing region and a sintering region; S3, processing the etching region by using excimer laser equipment; S4, carrying out preset powder feeding on the sintering region, and carrying out sintering repair by using long-wavelength laser; S5, carrying out rough polishing on the sintering region; S6, carrying out overall polishing on the processing area; and S7, scanning the surface roughness of the ceramic part, executing the step S6 if the roughness does not meet the requirement, and completing the excimer laser polishing process if the roughness meets the requirement. The method has the advantages that the controllability is good, the automatic production can be realized conveniently, the precise processing of the micro-area can be realized, any curved surface and any part can be treated, the influence on a ceramic matrix is remarkably reduced, and the precision, the quality and the efficiency of part repairing and polishing are guaranteed.

Method for repairing and polishing ceramic part through laser

The invention discloses an excimer laser polishing and detecting method of a porous ceramic. The excimer laser polishing and detecting method of the porous ceramic comprises the following steps that surface outline of to-be-processed surface of the porous ceramic is scanned by utilizing surface roughness analyzing equipment, focusing and homogenization of an excimer laser beam are achieved by using a light beam homogenizer and a focusing lens, the defocusing distance of the excimer laser used for polishing is determined, a scanning route of the surface is planned, parameters of the excimer laser are adjusted, the ablation threshold Fth of the porous ceramic is measured, output energy of the excimer laser is adjusted to conduct polishing on the porous ceramic, the surface bulge roughness of the porous ceramic before polishing is calculated, and the surface bulge roughness of the porous ceramic after polishing is calculated. According to the excimer laser polishing and detecting method of the porous ceramic, thermal influence on the porous ceramic is little, problems of peeling off and brittle fracture of ceramic material particles do not occur, the sizes and shape of polishing materials are not required, polishing of thin films, curved faces even internal structures can be achieved, and the identification degree and precision of the polishing effect of the porous ceramic is improved.

Excimer laser polishing and detecting method of porous ceramic

The invention discloses laser processing method and equipment, relates to the technical field of laser processing, and aims to determine appropriate laser processing parameters and improve the laser processing quality during laser processing. The laser processing method is applied to laser processing of a base; the base contains at least one characteristic phase; the laser processing method includes the following steps that laser processing parameter constraint conditions of the at least one characteristic phase are determined according to the processing purpose information; the laser processing parameters are obtained from preset correspondence relations of the at least one characteristic phase according to the laser processing parameter constraint conditions; the preset correspondence relations of each characteristic phase include relative relations of multiple laser processing parameters; and the laser processing equipment processes the base according to the laser processing parameters. The laser processing method and equipment are applied to laser processing.

Laser processing method and equipment

The invention discloses a light uniformizing parameter configuration device and method as well as a stripping system and method, relates to the technical field of laser processing, and aims to optimize the uniformity of an energy light beam and improve the stripping quality of a workpiece. The light uniformizing parameter configuration device comprises a light-transmitting container, a detection module and a controller, wherein the light-transmitting container is used for containing a light uniformizing substance, the light uniformizing substance has the Tyndall effect, the detection module isused for detecting a light spot uniformity parameter of the energy light beam emitted from the light-transmitting container containing the light uniformizing substance, and the controller is in communication connection with the detection module and is used for determining a first light uniformizing parameter of the light uniformizing substance according to the light spot uniformity parameter whenthe light spot uniformity parameter meets a first threshold value. The invention further provides the light uniformizing parameter configuration method adopting the configuration device, the stripping system for configuring the light uniformizing substance by applying the configuration method, and the stripping method applying the stripping system.

Light uniformizing parameter configuration device and method as well as stripping system and method

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Method for repairing and polishing ceramic part through laser

Excimer laser polishing and detecting method of porous ceramic

Laser processing method and equipment

Light uniformizing parameter configuration device and method as well as stripping system and method