1. History of Bulk Amorphous Alloys 2. High Glass-Forming Ability and its Dominant Factors 3. Compositional Dependence of the Dominant Factors for GlassFormation, Tx and Tg/Tm. 3.1. Ln-Al-(Ni,Cu) Systems 3.2. Mg-Ln-(Ni,Cu) Systems 3.3. Zr-Al-TM Systems 3.4. Pd-Cu-Ni-P System 4. Continuous Cooling Transformation Behavior of SupercooledLiquid and Critical Cooling Rate for Glass Formation 5. Preparation Methods of Bulk Amorphous Alloys. 5.1. High-Pressure Die Casting Method. 5.2. Water Quenching Method 5.3. Copper Mold Casting Method 5.4. Arc Melting Method 5.5. Unidirectional Zone Melting Method 5.6. Suction Casting Method 6. Compositional Dependence of Maximum Sample Thickness (tmax). 6.1. La-Al-(Co,Ni,Cu) Systems 6.2. Zr-Al-(Co,Ni,Cu) Systems 6.3. Zr-Al-Ni-Cu-TM (TM = Transition Metals) Systems 7. Structure of Bulk Amorphous Alloys. 7.1. Mg-La-Ni System 7.2. La-Al-Ni System 7.3. Zr-Al-Ni System 7.4. Zr-Y-Al-Ni System 8. Structural Relaxation and Thermal Stability. 8.1. Structural Relaxation 8.2. Glass Transition 8.3. Two-Stage Glass Transition 8.4. Crystallization Behavior 9. Physical Properties. 9.1. Density 9.2. Specific Heat 9.3. Viscosity 9.4. Atomic Diffusivity 9.5. Electrical Resistivity 9.6. Thermal Expansion

Bulk Amorphous Alloys : preparation and Fundamental Characteristics

Review of microstructure and properties of low temperature lead-free solder in electronic packaging.

Development of lead-free interconnection materials in electronic industry during the past decades: structure and properties

SnBi lead-free solder is widely applied in the field of low-temperature soldering due to its excellent creep resistance, relatively low melting point (139 °C) and cost. However, the frangibility and poor ductility of the SnBi low-temperature solder limits its application in the field of electronic packaging. In this paper, the research progress and development direction of SnBi low-temperature lead-free solder are discussed. To promote the application of SnBi solder, the melting characteristics, wettability, microstructure, tensile properties, shear properties, creep properties and interfacial reaction of SnBi solder are analyzed and introduced systematically. It provides an important reference of understanding the current development of SnBi solders.

Recent advances on SnBi low-temperature solder for electronic interconnections

Different weight fractions (0, 0.5, 1.0, 2.0, and 3.0 wt%) of sliver (Ag) were used to dope Sn–Bi eutectic alloys in this study. The microstructure and tensile and thermal properties of Sn–Bi eutectic alloys doped with Ag were investigated. The results indicate that the addition of Ag increases the solidification temperature and reduces the fusing latent heat of alloy, but it has no significant effect on the melting point of the alloy. According to the electron backscattered diffraction (EBSD) analysis and calculation of the disregistry between e-Ag3Sn and β-Sn, e-Ag3Sn can be used as the heterogeneous nucleation substrate of β-Sn, thus refining lamellar eutectic spacing. The orientation relationship between the e-Ag3Sn phase and the β-Sn phase was as follows: [ 0 2‾1 ]Ag3Sn//[ 0 1 2 ]β-Sn, (0 1 2)Ag3Sn//(‾1 2‾1) β-Sn, and [‾1 2 0 ]Ag3Sn//[ 0 1 2 ]β-Sn, (2 1‾1)Ag3Sn//(‾1 2‾1)β-Sn. The tensile strength of the eutectic Sn–Bi alloy with addition of 1.0 wt% Ag reached 72 MPa, which was 20% higher than that of the original alloy. The analysis showed that Ag doping increase the tensile strength of the eutectic Sn–Bi alloy, because of fine grain strengthening and second phase strengthening mechanism

Improvement of microstructure and tensile properties of Sn–Bi–Ag alloy by heterogeneous nucleation of β-Sn on Ag3Sn

Effect of P on Microstructure and Mechanical Properties of Sn-Bi Solder

Sn‐Biはんだの引張特性に及ぼすZn,Zn‐AlおよびZn‐添加の影響

As a new kind of engineering material,the metallic glass can be used widely due to its excellent properties such as high strength,hardness and elastic energy and low corrosion resistance. The size of metallic glasses is generally small,which is the main limitation for their application.How to prepare a larger size metallic glass becomes one of main targets in metallic glasses research.To prepare larger size metallic glasses,one method is to optimize their chemical compositions,and another is to join small size metallic glasses together by welding.In this paper,the Zr_(55)Al_(10)Ni_5Cu_(30) bulk metallic glass (BMG) has been successfully jointed by friction welding under the conditions of rotational speed from 4×10~3 to 5×10~3 r/min,friction pressure from 80 to 100 MPa,friction time from 0.2 to 0.4 s,upsetting pressure 200 MPa and upsetting time 2 s.The welded joint has been examined using SEM,XRD and TEM,and it is proved that the welded zone still keeps an amorphous structure.The plasticity of this metallic glass has strong temperature sensitivity near the glass transition temperature T_g.Above T_g, the metallic glass possesses a good plasticity which is necessary for friction welding of metallic glasses.

FRICTION WELDING OF Zr_(55)Al_(10)Ni_5Cu_(30) BULK METALLIC GLASS

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Effect of P on Microstructure and Mechanical Properties of Sn-Bi Solder

Sn‐Biはんだの引張特性に及ぼすZn,Zn‐AlおよびZn‐添加の影響

FRICTION WELDING OF Zr_(55)Al_(10)Ni_5Cu_(30) BULK METALLIC GLASS