As an increasing attention towards sustainable development of energy and environment, the power electronics (PEs) are gaining more and more attraction on various energy systems. The insulated gate bipolar transistor (IGBT), as one of the PEs with numerous advantages and potentials for development of higher voltage and current ratings, has been used in a board range of applications. However, the continuing miniaturization and rapid increasing power ratings of IGBTs have remarkable high heat flux, which requires complex thermal management. In this paper, studies of the thermal management on IGBTs are generally reviewed including analyzing, comparing, and classifying the results originating from these researches. The thermal models to accurately calculate the dynamic heat dissipation are divided into analytical models, numerical models, and thermal network models, respectively. The thermal resistances of current IGBT modules are also studied. According to the current products on a number of IGBTs, we observe that the junction-to-case thermal resistance generally decreases inversely in terms of the total thermal power. In addition, the cooling solutions of IGBTs are reviewed and the performance of the various solutions are studied and compared. At last, we have proposed a quick and efficient evaluation judgment for the thermal management of the IGBTs depended on the requirements on the junction-to-case thermal resistance and equivalent heat transfer coefficient of the test samples.

Thermal Management on IGBT Power Electronic Devices and Modules

This paper presents an experimental parametric study of the parasitic indu waveform ringing, switching loss, device stress, and electromagnetic interference. Based on the results obtained, a guideline has been established for the layout and design of high-speed switching circuits.

Experimental parametric study of the parasitic inductance influence on MOSFET switching characteristics

Characterization and Modeling of High-Switching-Speed Behavior of SiC Active Devices

Potential defects inside an insulated gate bipolar transistor (IGBT) module can be seen as precursors of being about to wear out, and are important for health monitoring of the IGBT module which is used to enhance reliability. A method for detecting defects in the IGBT module by identifying dynamic changes of the gate current is presented in this paper. It is based on the fact that parasitic elements inside the IGBT module are affected by local damage induced by aging over time, and subsequently, these influences are easily distinguished by dynamic changes of the gate current. The proposed prognostic approach is based on relevance vector machine framework, which can give accurate predictions and allow operators to observe unhealthy IGBT modules inside a power converter, and then take appropriate measures timely to avoid breakdown. The parasitic elements involved in the gate circuit are extracted, and their contributions to dynamic changes of the gate current are also discussed. Finally, a confirmatory experiment is carried out, and the correctness of the proposed method is verified.

Monitoring Potential Defects in an IGBT Module Based on Dynamic Changes of the Gate Current

A large number of factors such as the increasingly stringent pollutant emission policies, fossil fuel scarcity and their price volatility have increased the interest towards the partial or total electrification of current vehicular technologies. These transition of the vehicle fleet into electric is being carried out progressively. In the last decades, several technological milestones have been achieved, which range from the development of basic components to the current integrated electric drives made of silicon (Si) based power modules. In this context, the automotive industry and political and social agents are forcing the current technology of electric drives to its limits. For example, the U.S Department of Energy’s goals for 2020 include the development of power converter technologies with power densities higher than 14.1 kW/kg and efficiencies greater than 98%. Additionally, target price of power converters has been set below $3.3/kW. Thus, these goals could be only achieved by using advanced semiconductor technologies. Wide-bandgap (WBG) semiconductors, and, most notably, silicon carbide (SiC) based power electronic devices, have been proposed as the most promising alternative to Si devices due to their superior material properties. As the power module is one of the most significant component of the traction power converter, this work focuses on an in-deep review of the state of the art concerning such element, identifying the electrical requirements for the modules and the power conversion topologies that will best suit future drives. Additionally, current WBG technology is reviewed and, after a market analysis, the most suitable power semiconductor devices are highlighted. Finally, this work focuses on practical design aspects of the module, such as the layout of the module and optimum WBG based die parallelization, placement and Direct Bonded Copper (DBC) routing.

Power module electronics in HEV/EV applications: New trends in wide-bandgap semiconductor technologies and design aspects

A full circuit model of an insulated gate bipolar transistor (IGBT) power module tile is obtained using electro-magnetic analysis. A skin depth analysis on the copper and bonding wire interconnects shows that the commonly used low frequency RLC models are not adequate for power modules and reveals the necessity for a frequency dependent impedance. A method is adapted for the design of an f-dependent module tile design circuit for the first time. It is found that the importance of skin depth becomes vital especially for lower voltage ratings and faster edge rate devices as the Fourier transform becomes shifted towards higher frequencies. Analysis of the current sharing capability of the IGBTs as a function of the tile layout showed that an asymmetrical tile yields a faster response from the nearer IGBTs during inductive turn-off and an unbalanced sharing of the reverse recovery current during turn-on. A symmetric tile layout is developed. It is found that the faster current fall-time during turn-off is compensated by higher current tail oscillations thereby bringing no major improvement to the turn-off energy. During turn-on however, the reverse recovery and IGBT turn-on energy dissipation are equally distributed between the IGBTs. Simulating device imbalances also shows that threshold voltage variations have a significant effect on the current and energy sharing at turn-on whereas injection efficiency imbalances have a large influence on turn-off characteristics. The effect of device imbalances is found to decrease for a highly symmetric tile design. It is also shown that equally higher IGBT temperatures tend to improve current sharing so that IGBT module design emphasis should be placed rather on minimizing any differences in the IGBT junction temperatures. The model developed allows PSpice simulation of characteristics previously obtained only through measurements. The impact of the layout design on issues such as cross-talk, mutual inductance and ground bounce may be quickly and accurately assessed for an optimal current sharing capability.

The Current Sharing Optimization of Paralleled IGBTs in a Power Module Tile Using a PSpice Frequency Dependent Impedance Model

An enhanced insulated gate bipolar transistor (IGBT) model based on the Kraus model with new derivations based on an extra parameter accounting for p-i-n injection was developed to allow simulation of both trench and DMOS IGBT structures. Temperature dependence was also implemented in the model. The model was validated against steady-state and transient measurements done on an 800-A 1.7-kV Dynex IGBT module at 25/spl deg/C and 125/spl deg/C. The Spice model has also shown excellent agreement with mixed mode MEDICI simulations. The Spice model also takes into account for the first time the parasitic thyristor effect allowing the dc and dynamic temperature-dependent latchup modeling of power modules as well as their temperature-dependent safe operating area.

Advanced SPICE modeling of large power IGBT modules

A novel IGBT electro-thermal model is implemented for the first time in PSpice for the simulation of steady state and transient temperature dependent IGBT operation including self-heating and latchup. A thermal circuit representing the characteristics of the IGBT package is developed and validated against a finite element model and experimental results. A novel electrical IGBT model based on the Kraus model is developed to account for the electrical impact of instantaneous junction temperature variations due to self-heating. The resulting electro-thermal model is validated against experimental dc and transient FBSOA measurements.

Advanced electro-thermal SPICE modeling of large power IGBTs

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The Current Sharing Optimization of Paralleled IGBTs in a Power Module Tile Using a PSpice Frequency Dependent Impedance Model

Advanced SPICE modeling of large power IGBT modules

Advanced electro-thermal SPICE modeling of large power IGBTs