http://antonirogalski.com/wp-content/uploads/2011/12/Infrared-detectors-Status-and-trends.pdf

Infrared detectors: status and trends

A Three Dimensional Structure (3DS) Memory (100) allows for physical separation of the memory circuits (103) and the control logic circuit (101) onto different layers (103) such that each layer may be separately optimized. One control logic circuit (101) suffices for several memory circuits (103), reducing cost. Fabrication of 3DS memory (100) involves thinning of the memory circuit (103) to less than 50 microns in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections (105) are used. The 3DS memory (100) manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques.

Three dimensional structure memory

Hitherto, two distinct families of multielement detector arrays have been used for infrared (IR) imaging system applications: linear arrays for scanning systems (first generation) and two-dimensional arrays for staring systems (second generation). Nowadays, third-generation IR systems are being developed which, in the common understanding, provide enhanced capabilities such as larger numbers of pixels, higher frame rates, better thermal resolution, multicolor functionality, and/or other on-chip signal-processing functions. In this paper, fundamental and technological issues associated with the development and exploitation of third-generation IR photon detectors are discussed. In this class of detectors the two main competitors, HgCdTe photodiodes and quantum-well photoconductors, are considered. This is followed by discussions focused on the most recently developed focal plane arrays based on type-II strained-layer superlattices and quantum dot IR photodetectors. The main challenges facing multicolor devi...

Third-generation infrared photodetector arrays

Recent progress in infrared detector technologies

The Vertical System Integration (VSI) invention herein is a method for integration of disparate electronic, optical and MEMS technologies into a single integrated circuit die or component and wherein the individual device layers used in the VSI fabrication processes are preferably previously fabricated components intended for generic multiple application use and not necessarily limited in its use to a specific application. The VSI method of integration lowers the cost difference between lower volume custom electronic products and high volume generic use electronic products by eliminating or reducing circuit design, layout, tooling and fabrication costs.

Vertical system integration

“Rule 07,” a simple empirical relationship, conveniently estimates state- of-the-art HgCdTe dark current performance over 13 orders of magnitude, covering wavelength ranges form short-wave infrared (SWIR) to long-wave infrared (LWIR), from room temperature to liquid nitrogen temperatures. The best HgCdTe, in some cases, approaches the external radiative limit of performance, but is typically two to three orders of magnitude above that, being limited by defect generation centers as yet unidentified and/or by Auger mechanisms. The empirical relationship represents the range of detectors fabricated at Teledyne using our molecular beam epitaxy (MBE)-based double-layer planar heterostructure (DLPH) technology, but also appears to characterize good detectors from other laboratories.

MBE HgCdTe Technology : A Very General Solution to IR Detection, Described by Rule 07 , a Very Convenient Heuristic

We report a process to fabricate planar Hg1−yCdyTe/Hg1−xCdxTe (x<y) heterostructure photodiodes with the p‐on‐n configuration. The material used for this demonstration was grown by molecular beam epitaxy. The p‐on‐n planar devices consist of an arsenic‐doped p‐type epilayer (y=0.28) on top of a long wavelength infrared n‐type epilayer (x=0.225, λ=10 μm). The planar junctions were formed by selective pocket diffusion of arsenic deposited by ion implantation. The detailed analysis of the current‐voltage characteristics of these diodes as a function of temperature show that they have high performance and that their dark currents are diffusion limited down to 52 K. The results also show that the R0A values for these devices are highly uniform at 77 K.

Planar p‐on‐n HgCdTe heterostructure photovoltaic detectors

We recently succeeded in fabricating planar Hg1−yCdyTe/Hg1−xCdxTe (x<y) heterostructure photodiodes with the p-on-n configuration. Here we discuss early results in detail and present new results on an expanded range of infrared operation. The material used for this demonstration was grown by molecular beam epitaxy on lattice-matched CdZnTe substrates. The p-on-n planar devices consist of an arsenic-doped p-type epilayer (y∼0.28) atop a long wavelength infrared n-type epilayer (x=0.22–0.23). The planar junctions were formed by selective pocket diffusion of arsenic deposited on the surface by ion implantation. Detailed analysis of the current-voltage characteristics of these diodes as a function of temperature shows that they have high performance and that their dark currents are diffusion-limited down to 52K. Low frequency noise measurements at a reverse bias voltage of 50 mV resulted in noise current values (at 1 Hz) as low as 1×10−14 amps/Hz0.5 at 77K. Average RoA values greater than 106 Ω-cm2 at 40K were obtained for these devices with cut-off wavelength values in the 10.6 to 12 μm range. Seventy percent of these devices have RoA values greater than 105 Ω-cm2 at 40K; further studies are needed to improve device uniformity. These results represent the first demonstration that high performance long wavelength infrared devices operating at 40K can be made using HgCdTe material grown by a vapor phase epitaxy growth technique.

MBE HgCdTe heterostructure p-on-n planar infrared photodiodes

In this paper we present, results on the growth of in situ doped p‐on‐n heterojunctions on HgCdTe epilayers grown on (211)B GaAs substrates by molecular‐beam epitaxy (MBE). Long wavelength infrared (LWIR) photodiodes made with these grown junctions are of high performance. The n‐type MBE HgCdTe/GaAs alloy epilayer in these structures was grown at Ts=185 °C and it was doped with indium (high 1014 cm−3 range) atoms. This epilayer was directly followed by the growth, at Ts=165 °C, of an arsenic‐doped (1017–1018 cm−3 ) HgTe/CdTe superlattice structure which was necessary to incorporate the arsenic atoms as acceptors. After the structure was grown, a Hg annealing step was needed to interdiffuse the superlattice and obtain the arsenic‐doped p‐type HgCdTe layer above the indium‐doped layer. LWIR mesa diodes made with this material have 77 K R0A values of 5×103, 81, 8.5, and 1.1 Ω cm2 for cutoff wavelengths of 8.0, 10.2, 10.8, and 13.5 μm, respectively; the 77 K quantum efficiency values for these diodes were gre...

Molecular‐beam epitaxy growth and in situ arsenic doping of p‐on‐n HgCdTe heterojunctions

Extensive material, device, and focal plane array (FPA) reproducibility data are presented to demonstrate significant advances made in the molecular beam epitaxial (MBE) HgCdTe technology. Excellent control of the composition, growth rate, layer thickness, doping concentration, dislocation density, and transport characteristics has been demonstrated. A change in the bandgap is readily achieved by adjusting the beam fluxes, demonstrating the flexibility of MBE in responding to the needs of infrared detection applications in various spectral bands. High performance of photodiodes fabricated on MBE HgCdTe layers reflects on the overall quality of the grown material. The photodiodes were planar p-on-n junctions fabricated by As ion-implantation into indium doped, n-type, in situ grown double layer heterostructures. At 77K, diodes fabricated on MBE Hg1−xCdxTe with x ≈ 0.30 (λco
 ≈ 5.6 μm), x ≈ 0.26 (λco
 ≈ 7 μm), x ≈ 0.23 (λco ≈ 10 μm) show R0A products in excess of 1 x 106 ohm-cm2, 7 x 105 ohm-cm2, and 3 x 102 ohm-cm2, respectively. These devices also show high quantum efficiency. As a means to assess the uniformity of the MBE HgCdTe material, two-dimensional 64 x 64 and 128 x 128 mosaic detector arrays were hybridized to Si multiplexers. These focal plane arrays show an operability as high as 97% at 77K for the x ≈ 0.23 spectral band and 93% at 77K for the x ≈ 0.26 spectral band. The operability is limited partly by the density of void-type defects that are present in the MBE grown layers and are easily identified under an optical microscope.

Molecular beam epitaxial HgCdTe material characteristics and device performance: reproducibility status

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