Solid-state diffusion bonding (DB) was demonstrated for joining closed-cell aluminum foams (ALPORAS). A superplastic 5083 aluminum alloy sheet was inserted between the foams to assist the DB process. Microscopic observation revealed that the cell wall of the foams penetrated into the 5083 alloy sheet and their interface partly disappeared. Energy dispersion X-ray spectrometer(EDS) confirmed the diffusion of magnesium element from the 5083 alloy to the aluminum foam regions. The bonding strength was evaluated by four-point bend tests. The obtained bending stress was about 50% of the original foam at room temperature and was more than 60% at 423K. The advantage of the DB process in the high temperature applications was discussed comparing with the adhesive bonding of aluminum foams.

Solid-state diffusion bonding of closed-cell aluminum foams

Diffusion bonding is a solid state welding technique that has been developed in the past few decades and permits the production of high quality joints with little or no need for post-weld machining. Although diffusion bonding of material such as copper, titanium and various steels can be relatively straight forward, aluminum alloys are generally difficult to join because of their stable and tenacious oxide films, which inhibit the formation of metal to metal contact and interfacial diffusion. Acetone is used to remove the surface oxide films. Oxide films will inevitably form on the surfaces of aluminum alloys when they are exposed to the atmosphere. In this paper we presented an experimental work was carried out by using various parameters of diffusion bonding (Al 6061 / SiCp) like as temperature, pressure and time in hydraulic press. The optimization of bounding operation based on the Taguchi method with multiple performance characteristics is performed the orthogonal array, multi-response, signal-to-noise ratio and analysis of variance are employed to study the performance characteristics in bonding operations. The optimization helps in selecting the suitable values of variables, are such as temperature, pressure, and time.

Investigation and Experimental Analysis of Diffusion Bonding of Al 6061/Sicp Materials

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Investigation and Experimental Analysis of Diffusion Bonding of Al 6061/Sicp Materials