The elastic properties, elastic models and elastic perspectives of metallic glasses

The available experimental data for the density and viscosity of liquid cadmium, cobalt, gallium, indium, mercury, silicon, thallium, and zinc have been critically examined with the intention of establishing both a density and a viscosity standard. All experimental data have been categorized into primary and secondary data according to the quality of measurement, the technique employed and the presentation of the data, as specified by a series of criteria. The proposed standard reference correlations for the density of liquid cadmium, cobalt, gallium, indium, silicon, thallium, and zinc are characterized by percent deviations at the 95% confidence level of 0.6, 2.1, 0.4, 0.5, 2.2, 0.9, and 0.7, respectively. In the case of mercury, since density reference values already exist, no further work was carried out. The standard reference correlations for the viscosity of liquid cadmium, cobalt, gallium, indium, mercury, silicon, thallium, and zinc are characterized by percent deviations at the 95% confidence level of 9.4, 14.0, 13.5, 2.1, 7.3, 15.7, 5.1, and 9.3, respectively.

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Reference Data for the Density and Viscosity of Liquid Cadmium, Cobalt, Gallium, Indium, Mercury, Silicon, Thallium, and Zinc

Various eutectic systems have been proposed and studied over the past few decades. Most of the studies have focused on three typical types of eutectics: eutectic metals, eutectic salts, and deep eutectic solvents. On the one hand, they are all eutectic systems, and their eutectic principle is the same. On the other hand, they are representative of metals, inorganic salts, and organic substances, respectively. They have applications in almost all fields related to chemistry. Their different but overlapping applications stem from their very different properties. In addition, the proposal of new eutectic systems has greatly boosted the development of cross-field research involving chemistry, materials, engineering, and energy. The goal of this review is to provide a comprehensive overview of these typical eutectics and describe task-specific strategies to address growing demands.

Eutectics: formation, properties, and applications

With the implementation of legislations on inhibiting the usage of Sn–Pb solder in consumer electronic products, Sn–Ag–Cu series solder has been gotten the most application. However, there are some stimulations from electronic manufacturers to adopt low temperature soldering such as the economic driver from the reduction in manufacturing assembly cost and the reliability driver to avoid the dynamic warpage of area array components caused from Sn–Ag–Cu solder. Sn–Bi series solder is one of the promising candidates, which met the requirements for low melting point, low cost and environment friendly. However, the disadvantage of brittleness characteristic prevented its wide practical application. In order to promote the better application of Sn–Bi based solders, many efforts have been made to improve the wettability, mechanical properties and reliability of Sn–Bi based solders. This paper will summarize the related results about Sn–Bi solder alloys from wettability, interfacial reaction, mechanical properties of Sn–Bi solder and reliabilities of Sn–Bi solder joints. Moreover, in order to improve the properties of Sn–Bi solders, researchers have done lots of works on effect of addition of element dopants. The corresponding works of effect of alloying elements on the properties of Sn–Bi solder were also focused. According to the existing research results, it provides an important basis of understanding the current development of Sn–Bi solders.

Recent progress on the development of Sn–Bi based low-temperature Pb-free solders

In this work trace lanthanum hexaboride (LaB6) and elemental boron are alloyed with Ti-6Al-4V and their effects on the microstructure, tensile properties (including anisotropy) and melt pool shape during Additive Manufacturing (AM) are investigated. During the melting process, the LaB6 scavenges oxygen and decomposes into La2O3 and TiB. The presence of the rare earth element drastically changes the apparent surface tension and shape of the deposited layers. This is attributed to the Heiple-Roper effect and could have benefits during AM in producing components with unsupported overhangs. The formation of eutectic TiB during the final stages of solidification results in highly directional TiB needles in between columnar grains that are aligned with the build direction. The slow cooling rate during deposition of approximately 90–100 °C s−1 produces very large TiB particles which can exceed 50 µm in length. Although improving strength by up to 10%, under tensile stress the high aspect ratio TiB particles are sites for crack opening which leads to a decline in ductility in the longitudinal test direction and a corresponding increase in anisotropy over unmodified Ti-6Al-4V.

Effect of trace lanthanum hexaboride and boron additions on microstructure, tensile properties and anisotropy of Ti-6Al-4V produced by additive manufacturing

Some physical properties (kinematic viscosity, surface tension and magnetic susceptibility) of some Fe-based metallic melts of easily glass-forming alloys have been measured during heating and subsequent cooling. The results indicate that molten liquid metallic alloys undergo a number of structural transformations ranging from the initial microheterogeneous state formed after melting up to the true solution state. Studies by small angle neutron scattering on a eutectic SnPb melt confirm this conclusion in that two families of different sizes have been seen, one in the range 1 to 2 nm and one of size larger than 100 nm. Both kind of particles have relatively sharp interfaces and the size of the smaller particles is found to depend on temperature.

Structure and properties of some glass-forming liquid alloys

The magnetic susceptibility of Al3R and Al11R3 (R = Ce, Pr, Sm, Gd, Dy, Ho, Yb) compounds is investigated over wide temperature (300–1900 K) and field (0.2–1.2 T) ranges. It is found that microinclusions of Al2R can exist in the samples. They are not detectable in ordinary X-ray diffraction but give a significant contribution to the magnetic properties. The average effective magnetic moment per rare-earth atom changes through the rare-earth metals line reaching its maximum for holmium but rather lower than for the pure rare-earth metals. It means that rare-earth elements form covalent bonds with aluminum. These bonds remain in the liquid phase and begin to break down after melting point of Al2R only. The transition into a true solution state of the melt is somewhere above 1900 K.

Magnetic studies of intermetallic compounds Al3R (Al11R3) both in the solid and liquid states

The miscibility gap of the Ga–Pb system has been investigated by different experimental methods and techniques. Viscosity, acoustic and electrical conductivity measurements were carried out through the entire immiscibility region. Possible reasons of revealed discrepancies in the absolute values of the phase separation temperatures are discussed in relation with peculiarities of the experimental methods employed. The shape of the miscibility gap has been analysed.

Investigation of the miscibility gap region in liquid Ga-Pb alloys

Magnetic susceptibility of Al2RE compounds in crystal and liquid states

The effect of silver content on structure and properties of Sn 100− x Bi 10 Ag x ( x =3–10 at%) lead-free solder and Cu–solder–Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553–673 K in air and deoxidizing gas (N 2 +10%H 2 ) at atmospheric pressure. Cu–solder–Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag 3 Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu 3 Sn, which is adjacent to the substrate, and a Cu 6 Sn 5 phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N 2 +10H 2 gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N 2 +10H 2 is more apparent.

The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

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