Ulrich Eitner
Fraunhofer Society
65 Papers
332 Citations
Ulrich Eitner is an academic researcher from Fraunhofer Society. The author has contributed to research in topics: Soldering & Solar cell. The author has an hindex of 15, co-authored 65 publications.
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Papers
Spatial and orientational distribution of cracks in crystalline photovoltaic modules generated by mechanical load tests
TL;DR: In this paper, the authors present a statistical analysis on the crack formation in 27 crystalline silicon PV modules caused by a standard mechanical load test according to IEC 61215 10.16.
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Unified methodology for determining CTM ratios: Systematic prediction of module power☆
TL;DR: In this article, a unified methodology for predicting module power and efficiency from material and geometry data for several cell, interconnection and module designs is presented, which consists of analyzing photovoltaic inactive module areas, optical effects such as reflection, absorption and electrical losses.
92
Thermal Stress and Strain of Solar Cells in Photovoltaic Modules
Ulrich Eitner,Sarah Kajari-Schröder,Marc Köntges,Holm Altenbach +3 more
- 01 Jan 2011
TL;DR: In this article, the authors quantify the thermomechanical stresses by performing a Finite-Element analysis of a 60 cell module during thermal cycling, and they find that the solar cells are under high compressive stress of up to 76 MPa as they are sandwiched between the stiff front glass and the strongly contracting plastic back sheet.
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Use of digital image correlation technique to determine thermomechanical deformations in photovoltaic laminates: Measurements and accuracy
TL;DR: In this article, a stereo camera system was used to measure the deformation of solar cells in transparent PV modules by viewing through the transparent back sheet of the laminate, and the gap between two solar cells was found to deform 66.3±2μm between 79.6 and −17.1°C.
56
Intermetallic Phase Growth and Reliability of Sn-Ag-Soldered Solar Cell Joints
TL;DR: In this paper, the authors show the growth of different intermetallic phases, investigate their detrimental effects on the long term stability and compare them to a standard leaded solder, and show that the failure mode and the adhesion are depending on the amount of diffused tin into the metallization.
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