Review of silver nanoparticle based die attach materials for high power/temperature applications

Low-temperature sintering of Ag nanoparticles for high-performance thermoelectric module design

The microstructure, thickness, porosity, and shear performance of the silver (Ag) sintering layers under different sintering pressures were investigated. Experimental results demonstrated that the thickness and the porosity of the sintering layer decreased when the sintering pressure varied from 5 MPa to 30 MPa. This densification phenomenon facilitated the enhancement of the Ag sintering layers. The shear strength was improved significantly from 44.19 MPa to 69.41 MPa when the sintering pressure increased from 5 MPa to 10 MPa. When the sintering pressure ranged from 10 MPa to 30 MPa, the shear strength presented a slow increase from 69.41 MPa to 73.38 MPa. According to the results of the failure analysis, fracture mode transformation was considered as the basic reason for this phenomenon. The increasing sintering pressure promoted the bonding of the nano-Ag particles during the sintering process. Consequently, the fracture of the sintered-Ag layer transformed from brittle fracture to ductile fracture because of the increasing sintering pressure. The delamination area between Cu and Ni layers coated on the bottom Mo plate was clearly enlarged with the increasing sintering pressure. The delamination between Cu and Ni layers coated on the bottom Mo plate turned to be the main failure mode when the sintering pressure was higher than 10 MPa.

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Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding

A silver (Ag) composite paste was fabricated based on Ag nanoparticles (NPs) and Ag microflakes (MFs). Robust interconnections were achieved after sintering in the temperature range of 150–225 °C. The shear strengths of the Ag MF + NP joints before and after thermal shock from − 50 to 150 °C for 1000 cycles were 155.7 ± 14.5 MPa and 78.4 ± 20.8 Mpa, respectively. The results show that the Ag composite paste not only has similar sintering properties to the Ag NP pastes but also exhibited superior mechanical reliability due to the addition of the Ag MFs. In addition, the sintered properties of different Ag pastes were discussed in terms of the coating organics, thermal behaviour and microstructure. The fracture modes after the shearing tests were analysed in detail. The Ag composite paste provides a potential solution for high-temperature applications.

Ag microflake-reinforced nano-Ag paste with high mechanical reliability for high-temperature applications

An insight into β-Zn4Sb3 from its crystal structure, thermoelectric performance, thermal stability and graded material

Interface evolution analysis of graded thermoelectric materials joined by low temperature sintering of nano-silver paste

Interfacial evolution behavior of AgSbTe2.01/nanosilver/Cu thermoelectric joints

The invention discloses a preparation method of tin-based silver graphene lead-free composite solder. The method comprises the steps that a certain amount of graphene and lauryl sodium sulfate are mixed, then a certain amount of dimethylformamide is added, ultrasonic treatment is performed for 2 h, a certain amount of silver nitrate is added into a mixed solution, ultrasonic treatment is performed continuously, and finally a self-made silver graphene nanosheets are obtained; and required solder matrix powder is weighed according to different graphene mass fractions and poured into a ball milling tank for ball milling for 5 h, the powder is placed into a stainless steel mold after being dried and placed under a hydraulic machine to be pressed and molded at the pressure of 500 Mpa, and then a cylinder obtained through cold pressing is placed into a high-vacuum tubular resistance furnace for vacuum sintering for 2 h at the temperature of 175 DEG C and placed under the hydraulic machine after being cooled to the room temperature to obtain a cylinder through impact extrusion. According to the preparation method, Ag-particle-modified graphene is selected as a strengthening material so as to improve load transmitting between the nano-silver-modified graphene and a Sn matrix, and therefore the better strengthening effect is achieved.

Preparation method for tin-based silver graphene lead-free composite solder

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Papers

Interface evolution analysis of graded thermoelectric materials joined by low temperature sintering of nano-silver paste

Interfacial evolution behavior of AgSbTe2.01/nanosilver/Cu thermoelectric joints

Preparation method for tin-based silver graphene lead-free composite solder