The design and use of a simplified, highly efficient, waveguide-based wireless distribution system are provided. A low-loss waveguide is used to transport wireless signals from a signal source or sources to one or more receiver locations. One or more adjustable signal coupling devices partially insert into the waveguide at predetermined locations along the length of the system to provide variable, controlled extraction of one or more wireless signals. Low-loss impedance matching circuitry is provided between the waveguide coupling devices and output connectors to maintain high system efficiency. The system offers the capability of supplying signals of high strength and high quality to a large number of receivers in a wide wireless coverage area via a plurality of signal radiators. Some embodiments of the system are readily adaptable for wireless distribution service in HVAC plenum spaces. A system that combines the functions of fire extinguishing and waveguide wireless distribution is also disclosed.

Waveguide-based wireless distribution system and method of operation

An apparatus for 3D representation of image data, comprising: a structure identifier for identifying structures in motion within image data, and a skeleton insertion unit, which associates three-dimensional skeleton elements with the identified structures. The skeleton elements are able to move with the structures to provide a three-dimensional motion and structural understanding of said image data which can be projected back onto the input data. As well as individual elements, complex bodies can be modeled by complex skeletons having multiple elements. The skeleton elements themselves can be used to identify the complex objects.

System and method for 3d space-dimension based image processing

By wafer holder including a chuck top for mounting a wafer and a supporter supporting the chuck top and having flatness of at most 0.1 mm, a heater unit for a wafer prober and the wafer prober using the wafer holder, a wafer holder and a wafer prober apparatus hardly deformable even under high load and capable of effectively preventing contact failure, and capable of preventing temperature increase in a driving system when a semiconductor wafer having semiconductor chips with minute circuitry that requires high accuracy is heated can be provided. In the wafer holder of the present invention, the flatness of the supporter is preferably at most 0.05 mm, and more preferably at most 0.01 mm.

Wafer holder, heater unit used for wafer prober and having wafer holder, and wafer prober

A pair of eyeglasses that includes wireless communication capabilities is disclosed. The eyeglasses are referred to herein as “wireless eyeglasses.” The eyeglasses can also include one or more operation indicators. The wireless eyeglasses can allow a user to communicate with a communication device in a wireless and hands-free manner. The one or more operation indicators that can be provided with the wireless eyeglasses can signal operational status of the wireless communication circuitry.

Eyeglasses for wireless communications

Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

Cantilever microprobes for contacting electronic components and methods for making such probes

A membrane probing assembly includes a probe card with conductors supported thereon, wherein the conductors include at least a signal conductor located between a pair of spaced apart guard conductors. A membrane assembly includes a membrane with contacts thereon, and supporting at least a signal conductor located between a pair of spaced apart guard conductors. The guard conductors of the probe card are electrically interconnected proximate the interconnection between the probe card and the membrane assembly. The guard conductors of the membrane assembly are electrically interconnected proximate the interconnection between the probe card and the membrane assembly.

Membrane probing system

A cable (30) includes an inner conductor (50), an inner dielectric (52), and a guard conductor (56), where the inner dielectric (52) is between the inner conductor (50) and the guard conductor (56). The cable also includes an outer dielectric (58), and a shield conductor (62), where the outer dielectric (58) is between the guard conductor (56) and the shield conductor (62). The cable further includes an additional layer of material between the outer dielectric and the shield conductor (30) of suitable composition for reducing triboelectric current generation between the outer dielectric (58) and the shield conductor (62) to less than that which would occur were the outer dielectric and the shield conductor to directly adjoin each other.

Probe station with low noise characteristics

A calibration structure for probing devices. A calibration substrate for calibrating a probe comprising: (a) a first conductive member supported by said substrate suitable to be electrically interconnected with a first signal path of said probe; (b) a second conductive member supported by said substrate suitable to be electrically interconnected with a second signal path of said probe; (c) a third conductive member supported by said substrate suitable to be electrically interconnected with a ground path of said probe; (d) a fourth conductive member supported by said substrate suitable to be electrically interconnected with a first signal path of another probe; (e) a fifth conductive member supported by said substrate suitable to be electrically interconnected with a second signal path of said another probe; (f) a sixth conductive member supported by said substrate suitable to be electrically interconnected with a ground path of said another probe; (g) wherein said third conductive member and said sixth conductive member arc spaced apart from one another, and a resistive material extends at least 50% of the distance between said third conductive member and said sixth conductive member.

Probe testing structure

A method of constructing a probe which includes providing a substrate and creating a first substantially asymmetrical recess within the substrate. A conductive material is located within the recess and a conductive trace is electrically connected with the conductive material. A membrane supports the conductive trace, wherein the conductive material is located between the membrane and the substrate. The substrate is removed from the conductive material.

Probe construction using a recess

A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

Membrane probing method using improved contact

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