The present invention relates to a pressure-sensitive adhesive composition, and more precisely, a pressure-sensitive adhesive composition containing an organic silane compound that exhibits excellent initial adhesive strength on a substrate, and does not leave any of the adhesive behind when removed because the adhesive power is not excessively increased even at high temperature or at high temperature and high humidity.

Pressure sensitive adhesive composition

The present invention provides: an adhesive agent composition obtained by mixing an isobutylene-based polymer (A), a diene-based rubber (B) having a hydroxyl group, and a cross-linking agent (C); an adhesive sheet provided with an adhesive-agent layer formed using the adhesive agent composition; and an electronic device provided with a sealant formed using the adhesive agent composition or the adhesive sheet. According to the present invention, provided are: an adhesive agent composition useful as a formation material for an adhesive-agent layer exhibiting excellent moisture barrier properties and an excellent balance between adhesive strength and holding power; an adhesive sheet provided with the adhesive-agent layer formed using the adhesive agent composition; and an electronic device provided with a sealant formed using the adhesive agent composition.

Adhesive agent composition, adhesive sheet, and electronic device

The invention relates to a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape, characterized in that the adhesive comprises a getter material which is capable of sorbing at least one permeable substance, the getter material being present in the adhesive in a proportion of not more than 2 wt%, based on the adhesive with the getter material.

Adhesive tape for encapsulating an organic electronic arrangement

Concomitant initiation of radical and cationic polymerisations using new copper complexes as photoinitiators: Synthesis and characterisation of acrylate/epoxy interpenetrated polymer networks

Provided is a urethane-based pressure-sensitive adhesive that is excellent in reworkability, initial wettability, and transparency, and is preferably excellent in adhesive residue-preventing property, that preferably has a large wetting rate, and that is preferably prevented from showing external appearance unevenness due to orange peel. Also provided is a surface protective film using such urethane-based pressure-sensitive adhesive in its pressure-sensitive adhesive layer, the surface protective film being excellent in reworkability, initial wettability, and transparency, and being preferably excellent in adhesive residue-preventing property, the surface protective film preferably having a large wetting rate, and the surface protective film being preferably prevented from showing external appearance unevenness due to orange peel. Further provided is an optical member or electronic member to which such surface protective film is attached. The urethane-based pressure-sensitive adhesive of the present invention is a urethane-based pressure-sensitive adhesive including a polyurethane-based resin, in which: the polyurethane-based resin includes a polyurethane-based resin obtained by curing a composition containing a polyol (A) and a polyfunctional isocyanate compound (B); and the polyol (A) contains a polyol (A1) having 3 OH groups and a number-average molecular weight Mn of 8,000 to 20,000.

Urethane-based pressure-sensitive adhesive and surface protective film using the pressure-sensitive adhesive

The invention relates to an adhesive substance, in particular for encapsulating an electronic assembly against permeates, said substance comprising: (a) at least one copolymer containing at least isobutene or butene as comonomer types and at least one comonomer type which, when regarded as a hypothetical homopolymer, has a softening temperature greater than 40°C; (b) at least one type of an at least partially hydrogenated adhesive resin; (c) at least one cyclic ether-based type of reactive resin with a softening temperature less than 40 °C, preferably less than 20°C; and (d) at least one type of photoinitiator for initiating cationic curing.

Adhesive substance, in particular for encapsulating an electronic assembly

Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung gegen Permeanten, umfassend (a) zumindest ein Copolymer enthaltend zumindest Isobutylen oder Butylen als Comonomersorte und zumindest eine Comonomersorte, die - als hypothetisches Homopolymer betrachtet - eine Erweichungstemperatur von groser 40°C aufweist, (b) zumindest eine Sorte eines zumindest teilhydrierten Klebharzes, (c) zumindest eine Sorte eines Reaktivharzes basierend auf cyclischen Ethern mit einer Erweichungstemperatur von kleiner 40°C, bevorzugt kleiner 20 °C, (d) zumindest eine Sorte eines Photoinitiators fur die Initiierung einer kationischen Hartung.

Klebemasse insbesondere zur kapselung einer elektronischen anordnung

The present invention relates to the use of an adhesive mass at least containing an acid-anhydride-modified vinyl aromatic block copolymer, a metal chelate, and an adhesive resin for bonding optical components, particularly optical films, wherein the adhesive mass has a transmittance greater than 86% and a haze less than 5%.

Pressure-sensitive adhesive mass

Hitzeaktivierbare
Klebstofffolie, bestehend aus einem Blend von zumindest drei synthetischen
Nitrilkautschuken S1, S2 und S3 und zumindest einem Reaktivharz,
welches zur Vernetzung mit sich selbst, mit anderen Reaktivharzen
und/oder mit den Nitrilkautschuken S1, S2 und S3 befahigt ist,
wobei a) der Blend der hitzeaktivierbaren Folie mikrophasensepariert
ist, gekennzeichnet durch zumindest drei unterschiedliche Glasubergangstemperaturen
im DSC b) der Blend der hitzeaktivierbaren Folie zumindest drei Glasubergangstemperaturen
besitzt, wobei zumindest eine Glasubergangstemperatur groser 10°C und eine
Glasubergangstemperatur
kleiner -20°C
ist c) der oder die Nitrilkautschuke S1 einen Acrylnitrilanteil von
groser/gleich
35% aufweisen d) der oder die Nitrilkautschuke S2 einen Acrylnitrilanteil von
groser 25%
und kleiner 35% aufweisen e) der oder die Nitrilkautschuke S3
einen Acrylnitrilanteil von kleiner/gleich 25% aufweisen.

Nitrilkautschuk-Blends zur Fixierung von Metallteilen auf Kunststoffen

Die Erfindung betrifft ein Klebeband mit einem Tragermaterial aus einer acrylatbasierten Schaumschicht, auf die mindestens eine Haftklebemasseschicht aufgebracht ist, wobei die Haftklebemasse The invention relates to an adhesive tape with a carrier material from an acrylate-based foam layer on at least one pressure-sensitive adhesive layer is applied, the PSA (a) sich aus einem Gemisch aus zumindest zwei unterschiedlichen Synthesekautschuken, insbesondere auf Basis von Vinylaromatenblockcopolymeren, zusammensetzt, (A) from a mixture of at least two different synthetic rubbers, especially those based on vinylaromatic, composed, (b) ein Harz enthalt, welches nicht in den die Schaumschicht bildenden Acrylaten loslich ist und (B) a resin in which the foam-forming layer is not soluble acrylates and (c) chemisch unvernetzt ist. (C) is chemically crosslinked.

Geschäumtes Klebeband zur Verklebung auf unpolaren Oberflächen Foamed adhesive tape for bonding to apolar surfaces

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