In this work, a Cu coating on carbon steel with a fine crevice structure created by laser modification was produced without the use of contaminants by exploiting the super-spread wetting properties of liquid metal . The chemical composition, microstructure, bonding properties, corrosion resistance , and antibacterial activity of the Cu coating were investigated. The coating consisted of metallic Cu containing a minor fraction of Cu 2 O, with surface flakes and a dense inner layer with 0.1 % porosity and thickness of 337 ± 10 μm. Three-point bending tests showed the Cu coating had good adhesion with the carbon steel substrate. Corrosion tests demonstrated that the dense structure of the Cu coating blocked electrolyte contact with the carbon steel substrate for at least 336 h, indicating that the coating provides a barrier against galvanic corrosion . Assays of antibacterial activity and biofilm inhibition suggested that growth of Escherichia coli and Staphylococcus epidermidis on the Cu coating was 99.9 % lower than that on the substrate after 2 h surface contact, and biofilm formation on the coating was >90 % lower than that on the substrate. The combined anti-corrosive properties and antibacterial activity demonstrate the potential for the Cu coating to prevent transmission of bacterial infections in hospitals and public environments. • Development of a copper coating for using the super-spread wetting properties of liquid copper. • Copper coating microstructures are dense with low porosity. • Copper coating resisted corrosion in 3.5 wt% NaCl solution for at least ~336 h. • Copper coatings showed antibacterial and biofilm inhibition properties. 

Corrosion resistance and antibacterial activity of a surface coating created by super-spread wetting of liquid copper on laser-ablated carbon steel

In this work, a copper coating is developed on a carbon steel substrate by exploiting the superwetting properties of liquid copper. We characterize the surface morphology, chemical composition, roughness, wettability, ability to release a copper ion from surfaces, and antibacterial efficacy (against Escherichia coli and Staphylococcus aureus). The coating shows a dense microstructure and good adhesion, with thicknesses of approximately 20–40 µm. X-ray diffraction (XRD) analysis reveals that the coated surface structure is composed of Cu, Cu2O, and CuO. The surface roughness and contact angle measurements suggest that the copper coating is rougher and more hydrophobic than the substrate. Inductively coupled plasma atomic emission spectroscopy (ICP-AES) measurements reveal a dissolution of copper ions in chloride-containing environments. The antibacterial test shows that the copper coating achieves a 99.99% reduction of E. coli and S. aureus. This study suggests that the characteristics of the copper-coated surface, including the chemical composition, high surface roughness, good wettability, and ability for copper ion release, may result in surfaces with antibacterial properties.

/pdf/copper-surface-treatment-method-with-antibacterial-koiscyxu.pdf

Copper Surface Treatment Method with Antibacterial Performance Using “Super-Spread Wetting” Properties

Short-pulsed laser-induced periodic surface structures (SPLIPSSs) have the possibility to control tribology, wettability and biocompatibility. Nevertheless, the optimal structure depends on each functionality, which has not been clarified. The hybrid process with a short-pulsed laser and electrochemical machining (SPLECM) is, then, proposed to fabricate micro/nano hybrid structures and to modify the surface composition for providing high functionalities with material surfaces. Electrochemical machining is a well-established micro-elution and deposition method with noncontact between a workpiece and a tool. In this study, the effects of electrolytes on SPLIPSSs were investigated experimentally by the picosecond laser irradiation on 304 stainless steel substrates in various electrolytes. The geometry of SPLIPSSs depended on the types and the concentration of electrolytes. In the case of copper nitrate solution and copper sulfate solution, LIPSSs and spheroidization of copper were obtained. This study demonstrated the possibility of SPLECM to fabricate micro/nano structures and to control surface composition.

https://www.mdpi.com/2079-4991/11/2/327/pdf

Effects of Electrolyte on Laser-Induced Periodic Surface Structures with Picosecond Laser Pulses.

In this work, an electronic copper electroplating bath with low copper ion concentration and preeminent throwing power in through hole (TH) thickening of the printed circuit board (PCB) was successfully developed. Based upon the weak alkaline bath containing the composite complexants of citrate (Cit) and ethylenediamine (En), their synergistic effects on the preeminent bath throwing power were carefully investigated and theoretically proved. The UV-vis spectroscopy results illustrated that En exhibited a stronger coordination ability with Cu (II) ion than citrate, and the stoichiometric coordination ratio between En and Cu (II) ion was 2 : 1. The linear sweep voltammetry (LSV) results showed that the electro-reduction peak potential of Cit−Cu coordination ion was −0.55 V (vs. Hg/HgO), whereas that of En−Cu ion was at a more negative potential of −0.82 V. The in situ Fourier transform infrared (FTIR) spectroscopy revealed that the adsorptions of the Cit−Cu and En−Cu coordination ions were potential dependent on the copper electrode. The Cit−Cu coordination ion was easily adsorbed at the interior sites of through holes with lower over-potential to promote the growth of copper coating. Moreover, the En−Cu coordination ion adsorbed preferably on the surface and the edge of through hole for its higher electro-reduction overpotential, to hinder the germinating of copper nuclear. The cross-section observation of optical microscope proved that the throwing power of novel copper electroplating bath behaved surpassingly, up to 105.8 %. 

Toward Preeminent Throwing Power from a Novel Alkaline Copper Electronic Electroplating Bath with Composite Coordination agents

Directed energy deposition of aluminium bronze onto H13 steel-microstructure in multi-material additive manufacturing

/pdf/electroplating-of-copper-on-low-carbon-steel-from-alkaline-2n7nd9v91x.pdf

Electroplating of Copper on Low Carbon Steel from Alkaline Citrate Complex Baths

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Electroplating of Copper on Low Carbon Steel from Alkaline Citrate Complex Baths