T. Ivers
IBM
2 Papers
195 Citations
T. Ivers is an academic researcher from IBM. The author has contributed to research in topics: Gate oxide & Capacitance. The author has an hindex of 2, co-authored 2 publications.
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Papers
High Performance 45-nm SOI Technology with Enhanced Strain, Porous Low-k BEOL, and Immersion Lithography
Shreesh Narasimha,Katsunori Onishi,Hasan M. Nayfeh,A. Waite,M. Weybright,Jeffrey B. Johnson,Carlos A. Fonseca,D. Corliss,C. Robinson,Michael Crouse,D. Yang,C-H.J. Wu,Allen H. Gabor,Thomas N. Adam,Ishtiaq Ahsan,Michael P. Belyansky,L. Black,Shahid Butt,J. Cheng,Anthony I. Chou,G. Costrini,Christos D. Dimitrakopoulos,Anthony G. Domenicucci,P. Fisher,A. Frye,S. Gates,Stephen E. Greco,Stephan Grunow,M. Hargrove,Judson R. Holt,S.-J. Jeng,M. Kelling,B. Kim,William F. Landers,G. Larosa,D. Lea,Ming-Hsiu Lee,X. Liu,Naftali E. Lustig,A. McKnight,L. Nicholson,D. Nielsen,Karen A. Nummy,Viorel Ontalus,C. Ouyang,X. Ouyang,C. Prindle,R. Pal,Werner A. Rausch,D. Restaino,Christopher D. Sheraw,J. Sim,Andrew H. Simon,Theodorus E. Standaert,Chun-Yung Sung,Keith H. Tabakman,C. Tian,R. Van Den Nieuwenhuizen,H. van Meer,A. Vayshenker,Deepal Wehella-Gamage,J. Werking,R. C. Wong,S. Wu J. Yu,R. Augur,D. Brown,X. Chen,Daniel C. Edelstein,A. Grill,Mukesh Khare,Yujun Li,S. Luning,J. Norum,Sujatha Sankaran,Dominic J. Schepis,Richard A. Wachnik,Richard Wise,C. Wann,T. Ivers,Paul D. Agnello +79 more
- 01 Dec 2006
TL;DR: In this paper, the authors present a 45-nm SOI CMOS technology that features: i) aggressive ground-rule scaling enabled by 1.2NA/193nm immersion lithography, ii) high-performance FET response enabled by the integration of multiple advanced strain and activation techniques, iii) a functional SRAM with cell size of 0.37mum2, and iv) a porous low-k (k=2.4) dielectric for minimized back-end wiring delay.
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High performance 65 nm SOI technology with dual stress liner and low capacitance SRAM cell
Effendi Leobandung,H. Nayakama,Dan Mocuta,K. Miyamoto,M. Angyal,H.V. Meer,K. McStay,Ishtiaq Ahsan,Scott D. Allen,Atsushi Azuma,Michael P. Belyansky,R.-V. Bentum,J. Cheng,Dureseti Chidambarrao,B. Dirahoui,M. Fukasawa,M. Gerhardt,Michael A. Gribelyuk,Scott Halle,H. Harifuchi,D. Harmon,J. Heaps-Nelson,H. Hichri,K. Ida,M. Inohara,I.C. Inouc,Keith Jenkins,T. Kawamura,Byeong Y. Kim,S.-K. Ku,Mahender Kumar,S. Lane,Lars W. Liebmann,R. Logan,I. Melville,K. Miyashita,Anda Mocuta,P. O'Neil,M.-F. Ng,Takeshi Nogami,A. Nomura,Christine Norris,E. Nowak,Mizuki Ono,Siddhartha Panda,C. Penny,Carl J. Radens,Ravikumar Ramachandran,A. Ray,S.-H. Rhee,D. Ryan,T. Shinohara,G. Sudo,F. Sugaya,Jay W. Strane,Y. Tan,L. Tsou,L. K. Wang,F. Wirbeleit,S. Wu,Tenko Yamashita,H. Yan,Q. Ye,D. Yoneyama,D. Zamdmer,Huicai Zhong,Huilong Zhu,Wenjuan Zhu,Paul D. Agnello,Scott J. Bukofsky,Gary B. Bronner,Emmanuel F. Crabbe,G. Freeman,Shih-Fen Huang,T. Ivers,H. Kuroda,D. McHerron,J. Pellerin,Yoshiaki Toyoshima,S. Subbanna,N. Kepler,L. Su +81 more
- 14 Jun 2005
TL;DR: In this article, a high performance 65 nm SOI CMOS technology is presented featuring 35 nm gate length, 1.05 nm gate oxide, performance enhancement from dual stress nitride liners (DSL), and 10 wiring levels with low-k dielectric offered in the first 8 levels.
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