The electrosteric stabilization of model colloidal dispersions is quantified through high-frequency rheometry and complementary techniques. Model aqueous dispersions with a poly(butyl acrylate)−pol...

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Electrosteric Stabilization of Colloidal Dispersions

Influence of particle size distribution on rheology and particle packing of silica-based suspensions

The integrated circuits industry has been continuously producing microelectronic components with ever higher integration level, packaging density, and power density, which demand more stringent requirements for heat dissipation. Electronic packaging materials are used to pack these microelectronic components together, help to dissipate heat, redistribute stresses, and protect the whole system from the environment. They serve an important role in ensuring the performance and reliability of the electronic devices. Among various packaging materials, epoxy‐based underfills are often employed in flip‐chip packaging. However, widely used capillary underfill materials suffer from their low thermal conductivity, unable to meet the growing heat dissipation required of next‐generation IC chips with much higher power density. Many strategies have been proposed to improve the thermal conductivity of epoxy, but its application as underfill materials with complex performance requirements is still difficult. In fact, optimizing the combined thermal–electrical–mechanical–processing properties of underfill materials for flip‐chip packaging remains a great challenge. Herein, state‐of‐the‐art advances that have been made to satisfy the key requirements of capillary underfill materials are reviewed. Based on these studies, the perspectives for designing high‐performance underfill materials with novel microstructures in electronic packaging for high‐power density electronic devices are provided.

Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review

A review on the rheological behavior and formulations of ceramic suspensions for vat photopolymerization

To develop new composites with suffi- ciently high thermal conductivity and suitably controlled Dk value for PCBs application, the composites were pre- pared from epoxy and AlN or BN fillers, and the effects of content, size, size distribution, and morphology of two fillers on the thermal and dielectric properties of the com- posites were investigated. The results showed that either AlN or BN fillers can greatly increase Tg and thermal con- ductivity, decreasing CTE and Df, and suitably controlling the increase of Dk. At the same filler content, BN-filled composites exhibit better thermal performance and dielec- tric properties compared to AlN-filled composites. In the case of BN-filled composites, it is found that platelet- shaped micro-BN filled composite has lower Tg and higher CTE compared with particle-shaped nano-BN filled composite, but its thermal conductivity is remarkably higher than that of nano-BN filled composite. When hybrid BN fillers are used, thermal conductivity further increases. For micro- or nano-BN filled composite, the composite shows decreased Tg and increased Dk at high fraction of BN, but hybrid BN-filled composite still has high Tg and similar Dk with epoxy even if at high fraction of BN. Compared with single-sized AlN-filled composite, it is found that hybrid-sized AlN-filled composite has higher Tg and lower CTE, but has lower thermal conduc- tivity. To predict thermal conductivity and Dk in the investigated materials system, different models reported in the literature were analyzed and compared with the experimental data. Finally, suitable models were recom- mended. V C 2010 Wiley Periodicals, Inc. J Appl Polym Sci 118: 2754-2764, 2010

Study on the properties of the epoxy‐matrix composites filled with thermally conductive AlN and BN ceramic particles

The Effect of Diameter Ratio and Volume Ratio on the Viscosity of Bimodal Suspensions of Polymer Latices

Minimising the viscosity of concentrated dispersions by using bimodal particle size distributions

The effect of particle size on the layer thickness of a stabilising polymer adsorbed onto two different classes of polymer latex, as determined from rheological experiments

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The Effect of Diameter Ratio and Volume Ratio on the Viscosity of Bimodal Suspensions of Polymer Latices

Minimising the viscosity of concentrated dispersions by using bimodal particle size distributions

The effect of particle size on the layer thickness of a stabilising polymer adsorbed onto two different classes of polymer latex, as determined from rheological experiments