Data centers are increasingly important for global societal and economic advancement. The reliable operation of data centers depends on robust thermal management systems for information and communication technology (ICT-TM), which cover individual chips, servers, and overall infrastructures. Effective thermal management at the chip scale is crucial due to the rising integration and power density of chips driven by semiconductor technology advancements. This study summarizes recent progress in chip-scale thermal management, identifies challenges, and proposes solutions. Through a comprehensive review of approximately 400 studies, this article briefly compiles the latest research findings across three main areas: chip cooling mechanisms, developments in cooling technologies, and focal points for further research. The latest research outcomes concerning heat dissipation principles, influencing factors, and improvement methods have been summarized for nine key technologies: air cooling, microchannel cooling, embedded cooling, immersion cooling, spray cooling, jet cooling, heat pipe, thermoelectric cooling, and electrocaloric cooling. This study outlines six research priorities: reducing contact thermal resistance, developing novel materials, addressing hotspot thermal issues, chip temperature sensing, upgrading packaging processes, and implementing multi-scale collaborative thermal management. This paper informs research in chip-scale thermal management and provides valuable insights and references for researchers and engineers in related fields. 

Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management

The demand for lightweight heat dissipation devices in aerospace and various other fields has spurred the development of aluminum-based vapor chambers. However, the surface of the aluminum particles is covered by a dense alumina layer, which poses a challenge in preparing the aluminum-based porous wick structure by sintering aluminum powder. In this study, two aluminum-based vapor chambers (60 mm × 50 mm × 4 mm) with distinct wick structures were integrated with the container utilizing 3D technology. The wicks of the vapor chamber included an aluminum-based grooved wick structure (GVC) and an aluminum-based grooved-porous composite wick structure (GPVC). A comprehensive experiment was conducted to evaluate the heat transfer characteristics of the vapor chamber, including startup performance, temperature uniformity, and thermal resistance, under different filling ratios and wick structure parameters. The working fluid was acetone. The results indicated that the GPVC demonstrated excellent startup performance under both low and high heat loads. The startup time of the GPVC was found to be 230 s, 30.3% less than that of the GVC under a heat load of 80 W. Furthermore, at a 60% filling ratio, the GPVC demonstrated lower thermal resistance and better temperature uniformity compared to the GVC. The GPVC achieved a minimum thermal resistance of 0.033 K/W with a maximum temperature difference of only 4.51 °C. This resulted in a reduction of thermal resistance by 47.5% and an improvement in temperature uniformity by 69%. The findings of this study provide valuable insights to the application of 3D printing technology to the production of aluminum-based composite porous wick structures. 

Enhancing heat transfer performance in 3D-printed integrated vapor chamber using composite structures

Heat transfer performance analysis of an ultra-thin aluminum vapor chamber with serrated microgrooves

In the present study, free and forced vibration analysis of sandwich smart magneto-electro-elastic (MEE) nanoplates with functionally graded material porous (FGMP) of linearly or parabolically varying thickness core layer under initial external electric and magnetic potentials is studied using the first-order shear deformation theory (FSDT) and nonlocal strain gradient theory (NSGT). NSGT is perfected with softening and hardening material effects, which can significantly improve the precision of results. Three states of porosity distribution patterns, i

https://www.espublisher.com/uploads/article_pdf/es918_JustAccepted.pdf

Free and Forced Vibration of Sandwich FGM Porous Variable Thickness Nanoplates Integrated with Magneto-Electro-Elastic Layers Via Nonlocal Strain Gradient Theory

Given the lightweight nature and excellent thermal conductivity of aluminum, it offers significant potential for light-weighting of phase-change cooling components. To further enhance the thermal performance of aluminum-based vapor chambers, this study utilized selective laser melting (SLM) to design and integrally manufacture the slightly oleophilic wick for the condenser of the aluminum-based vapor chamber, along with three different superoleophilic wick structures for the evaporator: the gyroid bionic composite porous wick vapor chamber (GBCPVC), the groove composite porous wick vapor chamber (GCPVC), and the uniform porous wick vapor chamber (UPVC). A water-cooling experimental setup was established, and the effects of wick structure, cooling water flow rate, and cooling water temperature on the maximum heat load, temperature uniformity, and thermal resistance of vapor chambers were systematically investigated. The results indicated that the gyroid bionic porous wick structure significantly enhanced the thermal performance of the vapor chamber. Under the same conditions, GBCPVC exhibited lower thermal resistance and superior temperature uniformity, achieving a higher heat load than GCPVC and UPVC. When the cooling water temperature was decreased, its maximum heat load significantly increased. Specifically, at 15 °C, the maximum heat load for GBCPVC reached 300 W, an increase of 33.33 % and 53.33 % compared to 25 °C and 35 °C, respectively. Conversely, a rise in cooling water temperature enhanced the temperature uniformity and reduced thermal resistance of CBCPVC. At 35 °C and a heat load of 120 W, GBCPVC achieved a minimum thermal resistance of 0.034 K/W and a maximum temperature difference of 1.46 °C. Additionally, an increased flow rate enhanced the maximum heat load of GBCPVC, and under high heat loads, it could also reduce the thermal resistance and improve temperature uniformity. This study provides new insights and solutions for the thermal management of phase-change cooling components in aerospace electronic devices. 

Enhancing heat transfer performance of aluminum-based vapor chamber with a novel bionic wick structure fabricated using additive manufacturing

Experimental study on the heat transfer performance of a vapour chamber with porous wick structures printed via metallic additive manufacturing

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Experimental study on the heat transfer performance of a vapour chamber with porous wick structures printed via metallic additive manufacturing