Work function of metals

This paper presents fabrication and characterization of durable thin-film gold electrodes prepared by Au vapor deposition on glass substrates pretreated with (3-mercaptopropyl) trimethoxysilane. We characterize the electrodes with regard to (1) the Au adhesion, (2) the voltammetry of Au oxidation, and (3) the self-assembly of octadecyl mercaptan monolayers, and with regard to the extent to which they passive electrode surfaces

Application of (3-mercaptopropyl)trimethoxysilane as a molecular adhesive in the fabrication of vapor-deposited gold electrodes on glass substrates

Efficient adhesion of gold thin films on dielectric or semiconductor substrates is essential in applications and research within plasmonics, metamaterials, 2D materials, and nanoelectronics. As a consequence of the relentless downscaling in nanoscience and technology, the thicknesses of adhesion layer and overlayer have reached tens of nanometers, and it is unclear if our current understanding is sufficient. In this report, we investigated how Cr and Ti adhesion layers influence the nanostructure of 2–20 nm thin Au films by means of high-resolution electron microscopy, complemented with atomic force microscopy and X-ray photoelectron spectroscopy. Pure Au films were compared to Ti/Au and Cr/Au bilayer systems. Both Ti and Cr had a striking impact on grain size and crystal orientation of the Au overlayer, which we interpret as the adhesion layer-enhanced wetting of Au and the formation of chemical bonds between the layers. Ti formed a uniform layer under the Au overlayer. Cr interdiffused with the Au layer...

/pdf/influence-of-ti-and-cr-adhesion-layers-on-ultrathin-au-films-4yculivxkp.pdf

Influence of Ti and Cr Adhesion Layers on Ultrathin Au Films

Drastic chemical interface plasmon damping is induced by the ultrathin (∼2 nm) titanium (Ti) adhesion layer; alternatively, molecular adhesion is implemented for lithographic fabrication of plasmonic nanostructures without significant distortion of the plasmonic characteristics. As determined from the homogeneous linewidth of the resonance scattering spectrum of individual gold nanorods, an ultrathin Ti layer reduces the plasmon dephasing time significantly, and it reduces the plasmon scattering amplitude drastically. The increased damping rate and decreased plasmon amplitude are due to the dissipative dielectric function of Ti and the chemical interface plasmon damping where the conduction electrons are transferred across the metal–metal interface. In addition, a pronounced red shift due to the Ti adhesion layer, more than predicted using electromagnetic simulation, suggests the prevalence of interfacial reactions. By extending the experiment to conductively coupled ring-rod nanostructures, it is shown t...

Metallic adhesion layer induced plasmon damping and molecular linker as a nondamping alternative.

Special aspects of diffusion in thin films

The interdiffusion and subsequent compound formation was investigated in thin film couples of Ti–Au, Ti–Pd, and Ti–Pt using transmission and glancing angle electron diffraction techniques. Aging temperatures up to 500°C and times up to 8 h were considered. For all three couples, intermetallic compound formation was observed in the as-deposited films indicating substantial diffusion during deposition (= 100–150°C). For the Ti–Au couples, the TiAu2, TiAu, and Ti3Au compounds formed during diffusion. For the Ti-Pd and Ti-Pt couples the isostructural compounds TiPd, TiPt and Ti3Pd, Ti3Pt were observed. After the formation of the Ti3Pd type compound diffusion ceased for temperatures <500°C indicating that this compound was acting as a diffusion barrier. In all cases Ti was found to be the fastest diffusing species, where it was observed that the diffusion occurred principally through the Au, Pd, or Pt grain boundaries. The effective diffusion coefficient was estimated to be about 105 times larger than expected...

Diffusion in Thin Film Ti–Au, Ti–Pd, and Ti–Pt Couples

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Diffusion in Thin Film Ti–Au, Ti–Pd, and Ti–Pt Couples