Stefan Kaessner
Bosch
5 Papers
25 Citations
Stefan Kaessner is an academic researcher from Bosch. The author has contributed to research in topics: Ceramic & Power module. The author has an hindex of 3, co-authored 5 publications. Previous affiliations of Stefan Kaessner include University of Tübingen.
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Papers
Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging
Stefan Kaessner,Stefan Kaessner,Markus G. Scheibel,Stefan Behrendt,Bianca Boettge,Christoph Berthold,Klaus G. Nickel +6 more
TL;DR: In this article, the authors proposed enhancements on power electronic systems with reduced chip area and miniaturized passive components are subject of several research activities in academics and industry. To realize such fu...
22
Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density
Bianca Boettge,Falk Naumann,S. Behrendt,M. G. Scheibel,Stefan Kaessner,Sandy Klengel,Matthias Petzold,Klaus G. Nickel,G. Hejtmann,A. Z. Miric,R. Eisele +10 more
- 01 May 2018
TL;DR: In this article, the authors introduce novel phosphate cement-and calcium aluminate cement-based material systems with enhanced thermal, mechanical and thermomechanical properties for the encapsulation of power electronic devices and modules.
18
Simulative Comparison of Polymer and Ceramic Encapsulation on SiC-MOSFET Power Modules under Thermomechanical Load
Felix Wagner,Youssef Maniar,Martin Rittner,Stefan Kaessner,Michael Guyenot,Lukas Lang,Bernhard Wunderle +6 more
- 24 Mar 2019
TL;DR: In this article, the effect of organic mold compounds and ceramic compound encapsulates onto a single chip SiC power module with finite element modeling (FEM) of power cycling loads is compared.
6
Implementation of a new thermal path within the structure of inorganic encapsulated power modules
TL;DR: In this paper, a new material class is used within a power module, which is the group of inorganic materials, specifically ceramic encapsulation materials, for optimizing the heat dissipation within power modules.
6