Shutaro Nambu
6 Papers
2 Citations
Shutaro Nambu is an academic researcher. The author has contributed to research in topics: Thermoelectric generator & Flexible electronics. The author has an hindex of 2, co-authored 6 publications.
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Papers
Fabrication with Semiconductor Packaging Technologies and Characterization of a Large-Scale Flexible Thermoelectric Module
Tohru Sugahara,Yusufu Ekubaru,Ngo Van Nong,Noriko Kagami,Keiichi Ohata,Le Thanh Hung,Michio Okajima,Shutaro Nambu,Katsuaki Suganuma +8 more
TL;DR: In this article, a large-scale flexible thermoelectric generator (FlexTEG) module using bismuth-telluride p and n-type chips was fabricated on a flexible thin plastic substrate.
36
Effects of microstructure of Ni barrier on bonding interface diffusion behaviors of Bi–Te-based thermoelectric material
TL;DR: In this article, an Ag paste was chosen as the bonding material instead of the Sn-Ag-based solder because it has many advantages such as high-temperature stability, printability, and low electrical resistivity.
20
Patent
Thermoelectric conversion module, method for producing same, thermoelectric power generation system, and method for producing same
Nobuyuki Kohtani,Michio Okajima,Keiichi Ohata,Shutaro Nambu +3 more
- 22 Apr 2016
TL;DR: In this paper, a thermoelectric conversion module of the present invention includes two flexible substrates each made of a thin resin film and having mounting lands formed thereon, where one of the two flexible substrate has a plurality of slits to make the module easy to bend.
2
Patent
Cold insulation container
Ikemura Akihiko,Michio Okajima,Keiichi Ohata,Shutaro Nambu,Nishimura Ken +4 more
- 20 Aug 2020
TL;DR: In this article, a cold insulation container includes a cold storage including a coolant vessel, a circulating air fan that causes cold air from the coolant vessels to circulate in the cold insulation storage, and a thermoelectric generating module attached to an outer surface of the cooling vessel.
Large-scalable fabrication of improved Bi-Te-based flexible thermoelectric modules using a semiconductor manufacturing process
Kenjiro Okawa,Yasutaka Amagai,Hiroyuki Fujiki,Nobu-Hisa Kaneko,Nobuo Tsuchimine,Hiroshi Kaneko,Yuzo Tasaki,Keiichi Ohata,Michio Okajima,Shutaro Nambu +9 more
TL;DR: In this paper, Sintered Bi-Te-based modules with a large-scalable fabrication process and improved their output performance have been fabricated with a reduction in the interconnection resistance, using thick electrodes of the flexible printed circuit.