Shuji Tanaka
Tohoku University
505 Papers
2.4K Citations
Shuji Tanaka is an academic researcher from Tohoku University. The author has contributed to research in topics: Wafer & Resonator. The author has an hindex of 32, co-authored 494 publications. Previous affiliations of Shuji Tanaka include University of Tokyo & Jumonji University.
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Papers
Tactile Sensing System Module with Multiple Cmos-Mems Integrated Sensors on 16 Mbps High Speed Shared Serial Bus Line
Chenzhong Shao,Hideki Hirano,Munetaka Nomoto,Hiroshi Miyaguchi,Takahiro Nakayama,Yoshiyuki Hata,Motohiro Fujiyoshi,Masanori Muroyama,Shuji Tanaka +8 more
- 23 Jun 2019
TL;DR: This paper presented a PCB-based system module including 5 CMOS-MEMS integrated sensors for robot fingertip tactile sensing and confirmed that these 5 integrated sensors operated simultaneously on the serial bus with a high data rate up to 16 Mbps.
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Electrochemically Deposited Aluminum for MEMS Thermal Actuator
Muhammad Salman Al Farisi,Takashiro Tsukamoto,Shuji Tanaka +2 more
- 27 Apr 2021
TL;DR: In this article, a micro electro mechanical system (MEMS) thermal actuator using an electrochemically deposited thick Al is reported for the first time, due to the fine columnar shape of the grain, the electrical resistivity of the Al film was as high as 100-150 n/m, which is an order of magnitude higher than the bulk value.
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A multiple sensor platform with dedicated CMOS-LSIs for robot applications
Chenzhong Shao,Takahiro Nakayama,Yoshiyuki Hata,Travis Bartley,Yutaka Nonomura,Shuji Tanaka,Masanori Muroyama +6 more
- 01 Apr 2016
TL;DR: The first implementation results of the multiple kind sensors with the CMOS-LSIs are described, which has the temperature sensor, capacitive and resistive type force sensors.
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Vacuum-packaged micro fuel reformer for high thermal efficiency and low package temperature
A. Kasuga,Shuji Tanaka,Masayoshi Esashi +2 more
- 28 Jan 2008
TL;DR: In this article, a fully-microfabricated wafer-level vacuum package of a micro fuel reformer was designed, fabricated and tested, and the measured heat loss was 1.2 W at a reforming temperature of 240degC.
Comparison of three methods to measure the internal pressure of empty MEMS packages
B. Wang,Shuji Tanaka,J. De Coster,Simone Severi,Ann Witvrouw,Martine Wevers,I. De Wolf +6 more
- 02 Jul 2012
TL;DR: In this paper, three different measurement methods for the measurement of the pressure inside empty MEMS packages are demonstrated and discussed based on measurements of capacitance, cap resonance or cap buckling.
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