The accurate determination of residual stresses has a crucial role in understanding the complex interactions between microstructure, mechanical state, mode(s) of failure, and structural integrity. Moreover, the residual stress management concept contributes to industrial applications, aiming to improve the product's service performance and life cycle. In this regard, the industry requests rapid, efficient, and modern methods to identify and control the residual stress state. This review article contains three main sections. The first section covers different residual stress determination methods and reports the advancements over the recent decade. The second section includes the role of residual stresses in the performance of a broad range of materials including metallic alloys, polymers, ceramics, composites, and biomaterials. This is presented by classifying different science areas dealing with residual stresses into two main groups, including “origins” and “effects” of residual stresses. The range of topics covered are “welding, machining, curing/cooling, and spray coating processes,” “medical and dental sciences,” and “fatigue and fracture mechanisms.” The third section summarizes various strategies to effectively control residual stresses through different manufacturing procedures. It is hoped that the data provided herein serves as a valuable up-to-date reference for engineers and scientists in the field of residual stress.

Residual Stress in Engineering Materials: A Review

Effects of segmented thermal-vibration stress relief process on residual stresses, mechanical properties and microstructures of large 2219 Al alloy rings

Springback control and large skin manufacturing by high-speed vibration using electromagnetic forming

The stress relief processes, such as thermal stress relief (TSR) and vibratory stress relief (VSR), are generally applied to decrease and control the residual stress in the manufacturing process. Thermal-vibratory stress relief (TVSR) is a novel stress relief method developed in recent years, which has significant advantages over traditional methods. The stress relief mechanism of TVSR and stress evolution under the coupling effect of heat and vibration still need further investigation. In this study, TSR, VSR and TVSR with different process parameters are compared to study their stress relief effect on Ti6Al4V, and corresponding FEM simulations are performed to calculate the stress evolution. The residual stress is measured using X-ray diffraction method. EBSD and TEM characterizations are carried out to investigate the influences on the phase, crystal grain and dislocation. Results show that both TVSR and TSR can eliminate over 90% of residual stress of Ti6Al4V, but the efficiency of TVSR is 4.2 times as that of TSR. The stress relief rate of TVSR is 45.04% higher than that of VSR with the same dynamic stress. Finally, the quantitative relationship between TVSR parameters and residual stress is established, and the stress relief mechanism and effective parameter region of TVSR are analyzed. 

Residual Stress and Microstructure of Ti6Al4V Treated by Thermal-vibratory Stress Relief Process

With the development of 5G communication, more demanding requirements have been specified for copper alloy strips applied in lead frames. Thin copper alloy strips with high residual stress always warp during the etching process, so they do not meet the requirements of industry. Therefore, it is essential to reduce the residual stress in these strips. In this work, a novel effective technique suitable for thin strips, the thermal-ultrasonic stress relaxation (TUSR) method, which integrates conventional thermal stress relaxation (TSR) and ultrasonic stress relaxation (USR), is proposed. The equipment used to conduct TUSR and TSR experiments on C19400 copper alloy was produced in this laboratory. The residual stress evolution was investigated using X-ray diffraction (XRD). The microstructure evolution of the strips was analyzed by using electron backscatter diffraction (EBSD) and transmission electron microscopy (TEM). The mechanism of the relaxation of residual stress was revealed. The maximum residual stress relaxation values in the transverse and rolling directions after TUSR treatment were 80.56 and 89.39%, respectively, which were better than the results obtained after TSR treatment. After TUSR treatment, the grain sizes were smaller, and the percentage of low-angle grain boundaries (LAGBs) was higher than that before the treatment. The dislocation morphology was converted to ordered dislocation cells and dislocation walls and macroscopic plastic deformation of the grains released elastic strain energy, which was the main reason for residual stress relaxation in the C19400 alloy strips. In addition, the increase in tensile strength was mainly due to the enhancement of a precipitate pinning effect and grain refinement. These findings can provide guidance for future work related to the relaxation of residual stress in copper alloy strips for lead frames. 

Effects of a thermal-ultrasonic stress relaxation process on the residual stress, mechanical properties and microstructures of C19400 copper alloy strips

Experimental and simulation investigation on thermal-vibratory stress relief process for 7075 aluminium alloy

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Experimental and simulation investigation on thermal-vibratory stress relief process for 7075 aluminium alloy