21 Papers
52 Citations
Sha Xu is an academic researcher from City University of Hong Kong. The author has contributed to research in topics: Electromigration & Carbon nanotube. The author has an hindex of 4, co-authored 11 publications.
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Papers
Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing
TL;DR: In this article, multi-walled carbon nanotubes (MWCNTs) with various weight percentages were incorporated into Sn3.5Ag0.5Cu (SAC) solder matrix by mechanical blending followed by reflow process.
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Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection
TL;DR: In this article, an electroless Ni-P-TiO 2 (17.5% at% of P) composite coating was used as a pad finish for advanced electronic packaging, where the majority of the added TiO 2 nanoparticles were proved to be uniformly distributed in UBM by scanning electronic microscopy and X-ray diffraction (XRD).
Effect of carbon nanotubes and their dispersion on electroless Ni–P under bump metallization for lead-free solder interconnection
TL;DR: In this paper, the authors used scanning electronic microscopy (SEM) to observe the morphology and the CNTs were proved to be uniformly distributed in Ni-P-CNT composite coatings by SEM and atomic force microscopy.
Understanding Pseudocapacitance Mechanisms by Synchrotron X‐ray Analytical Techniques
Pei Tang,Wuyang Tan,Guangyang Deng,Yunting Zhang,Sha Xu,Qijun Wang,Guosheng Li,Jian Zhu,Qingyun Dou,Xingbin Yan +9 more
TL;DR: In this article , a comprehensive and systematic review of four typical characterization techniques (synchrotron X-ray diffraction, pair distribution function (PDF) analysis, soft Xray absorption spectroscopy, and hard X ray absorption spectrograms) for the study of pseudocapacitance mechanisms is presented.
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Multi-physics computer simulation of the electromigration phenomenon
Xiaoxin Zhu,Hiren Kotadia,Sha Xu,Hua Lu,Samjid H. Mannan,Y.C. Chan,Chris Bailey +6 more
- 03 Nov 2011
TL;DR: In this article, a multi-physics simulation method that combines electric, thermal, atomic diffusion, and stress analysis has been described to predict the atomic vacancy concentration distribution and void formation in metals or alloys that are subject to current loading.
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