Scott Samson
University of South Florida
24 Papers
123 Citations
Scott Samson is an academic researcher from University of South Florida. The author has contributed to research in topics: Microelectromechanical systems & Surface micromachining. The author has an hindex of 8, co-authored 24 publications. Previous affiliations of Scott Samson include SRI International.
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Papers
What you see is not what you catch: a comparison of concurrently collected net, Optical Plankton Counter, and Shadowed Image Particle Profiling Evaluation Recorder data from the northeast Gulf of Mexico
TL;DR: In this paper, high resolution images of the upper 100m of the Gulf of Mexico were used to compare mesozooplankton abundance, biomass, taxonomic composition and size distributions between simultaneously collected net samples, OPC data, and digital imagery.
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Binary Plankton Image Classification
TL;DR: This paper proposes several new shape descriptors and uses a normalized multilevel dominant eigenvector estimation method to select a best feature set for binary plankton image classification.
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Learning to recognize plankton
Tong Luo,Kurt Kramer,Dmitry B. Goldgof,Lawrence O. Hall,Scott Samson,Andrew Remsen,Thomas L. Hopkins +6 more
- 10 Nov 2003
TL;DR: A new way to assign probability after multi-class SVM classification is developed, which is more accurate on the two data sets than a C4.5 decision tree and a cascade correlation neural network at the 95% confidence level.
Fabrication of Integrated Vertical Mirror Surfaces and Transparent Window for Packaging MEMS Devices
TL;DR: In this article, a self-masking and liftoff process was developed to ensure that the vertical mirrors undergo uniform metallization while leaving a transparent window for optical probing, and the integrated mirrors and lids were then bonded to the active MEMS mirrors.
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Fabrication processes for packaged optical MEMS devices
Scott Samson,Rahul Agarwal,Sunny Kedia,Weidong Wang,Shinzo Onishi,John Bumgarner +5 more
- 24 Jul 2005
TL;DR: A new scheme for creating optically-transparent package lids, which are subsequently thermo compression bonded onto the surface micromachined parts, is also introduced, which allows creation of extremely vertical through-wafer surfaces in silicon, with minimal surface damage to the co-bonded glass lid.
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