A laser beam machining head includes a dividing optical system for dividing laser light into two separate laser beams, and providing spacing therebetween; a condensing optical system for condensing the separate laser beams into condensed laser light, and projecting it onto a cutting site of an object to be cut; and an inner assist gas nozzle placed between the separate laser beams, a width of an opening of a tip portion of the inner assist gas nozzle being nearly equal to a cutting width. Or the tip opening of the inner assist gas nozzle is slender; or its tip side is inclined, and the angle of inclination is variable; or the relative positions of the inner assist gas nozzle and a workpiece, or the relative positions of the focal position of the condensing optical system and the workpiece are variable independently; or an outer assist gas nozzle surrounding the separate laser beams is provided.

Laser beam machining head

Displacement of a laser beam concentration point at an end of an object to be processed is reduced as much as possible, and simultaneously, laser processing is efficiently performed. A laser processing method has displacement acquiring steps (S06-S07) and position setting steps (S08-S09). In the displacement acquiring steps (S06-S07), a second laser beam for measuring the displacement of a main surface of an object to be processed is collected by a lens and irradiated, and the displacement between one point on a planned cutting line of the object and one end is acquired while the beam reflected by the main surface in correspondence with the irradiation is being detected. In the position setting steps (S08-S09), an initial position at which the lens is held relative to the main surface of the object based on the acquired displacement is set and the lens is held at the set initial position. With the lens held at the initial position, a first laser beam for processing is irradiated to form a reformed region at the one end of the planned cutting line, and then, with the lens released from the held state and while the position of the lens being adjusted, a reformed region is formed.

Laser processing method and device

PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus and a laser beam machining method, capable of continuing the laser beam machining without detachment of a focus servo even when an abnormal part is formed on a surface of an object OB to be machined and reducing losses of the object OB to be machined and waste of the machining time. SOLUTION: Laser beam for inspection is applied to the forward position in the machining direction of a beam spot of laser beam for machining, and any abnormal part at the position immediately before the laser beam machining is detected based on the intensity of its reflected beam. When the intensity of the reflected beam of the laser beam for inspection is reduced, the mask signal is generated by a mask signal generation circuit 67. A delay circuit 68 prepares the hold signal taking into consideration the time delay before the laser beam for machining is applied to the abnormal part, and outputs it to a conduction circuit 68. When the hold signal is input, the conduction circuit 63 sets the focus error signal to be zero, and holds the focus servo. COPYRIGHT: (C)2010,JPO&INPIT

Laser beam machining apparatus and laser beam machining method

A laser processing apparatus (1) is provided with: a first radiation means (31), which radiates a first laser beam (L1) for processing a subject to be processed; a second radiation means (21), which radiates a second laser beam (L2); a first light collecting means (33), which performs processing by forming, on the front surface (S1) or the rear surface (S2) of the subject to be processed, a first light collected area (F1), which is an area where the first laser beam is collected; a second light collecting means (24), which forms, at a predetermined position on the subject to be processed, a second light collected area (F2) where the second laser beam is collected; a light receiving means (26), which receives reflected light (L3) of the second laser beam that is reflected by the subject to be processed; focus servo means (27, 24a), which determine the position of the second light collected area on the basis of the reflected light of the second laser beam, said reflected light being received by the light receiving means; and a control means (33a), which controls the operation of the first light collecting means such that the first light collected area is formed at a position determined on the basis of the position of the second light collected area The numerical aperture of the first light collecting means is larger than that of the second light collecting means

Laser processing apparatus

PURPOSE: A laser beam splitter is provided to use selectively a laser beam by branching one laser beam into two branched paths as well as to provide a blocking function of the laser beam into the laser beam splitter. CONSTITUTION: Side walls(11,12,13,14) having a certain height are fixed at an edge portion of a lower plate(10), and an upper plate(15) is coupled at a top portion of the side walls(11,12,13,14). A laser beam(100) is introduced through a beam passing hole(11a) provided at a first side(11) and a beam splitting mirror(200) is placed at a preceding path to incline in 45 degree. At the beam splitting mirror(200), 50 % of the introduced laser beam is penetrated through a first path(101) and the remaining 50 % of the introduced laser beam is reflected through a second path(102). A first and a second connection terminals(301, 302) for coupling an optical fiber connection plug(303,304) are installed at a third side wall(13) and a fourth side wall(14) against to the first path(101) and the second path(102) in order to transmit a light. A first and a second blocking mirrors(401,402) for cutting off or passing the split laser beam passing each paths is placed in the first and the second paths(101,102) between the beam splitting mirror and the first and second connection terminals(301,302). A position of the first and second blocking mirror(401,402) is changed by the first and the second mirrors(403,404). First and second extinction portions(406,407) for absorbing and extinguishing the laser beam are placed at an opposite side of a first and a second reflection beam proceeding paths.

Dividing apparatus of laser beam

PURPOSE:To automatically adjust a focus position of laser beam by constantly measuring the distance between a machining head and work in a laser beam machine. CONSTITUTION:A machining head 20 of a laser beam machine 1 has a working part 40 and range finding part 80. The laser light beam sent from a laser oscillator 10 is separated to a laser beam light R1 for machining and a laser beam light R2 for range finding, a machining laser beam light is condensed by a condensing lens 48, focusing at the upper surface of a work 300 on a table 30 and then machining a work. The range finding laser beam light R2 is condensed by a lens 86 and reflected on a work upper surface 310. The reflected light beam is received by a photo cell 90 and transduced to an electric signal. A measuring instrument calculates the distance to the work upper surface by a signal of the photo cell 90. A controller adjusts a position of the condensing lens 54 through a stepped motor 50 in response to the variation of a position of the work upper surface.

Laser beam machine

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Laser beam machine