Advances in laser assisted machining of hard and brittle materials

Precision is one of the most important aspects of manufacturing. High precision creates high quality, high performance, exchangeability, reliability, and added value for industrial products. Over the past decades, remarkable advances have been achieved in the area of high-precision manufacturing technologies, where the form accuracy is approaching the nanometer level and surface roughness the atomic level. These extremely high precision manufacturing technologies enable the development of high-performance optical elements, semiconductor substrates, biomedical parts, and so on, thereby enhancing the ability of human beings to explore the macro- and microscopic mysteries and potentialities of the natural world. In this paper, state-of-the-art high-precision material removal manufacturing technologies, especially ultraprecision cutting, grinding, deterministic form correction polishing, and supersmooth polishing, are reviewed and compared with insights into their principles, methodologies, and applications. The key issues in extreme precision manufacturing that should be considered for future R&D are discussed.

https://iopscience.iop.org/article/10.1088/2631-7990/ab1ff1/pdf

Manufacturing technologies toward extreme precision

Micro- and nano-machining technology has been applied in industry to generate high-precision parts with micro/nano-metric accuracy or feature size in the recent decades. Cutting is one of the most powerful manufacturing processes, and the material removal mechanism is urgently demanded by the industry to understand and improve the micro/nano-machining process efficiently at a low cost. This paper presents the recent advances in cutting mechanism and its applicability for predicting the surface generation and chip formation, especially when material is removed in micro- and nanoscale. In addition to the industry-concerned performance parameters, fundamental physical parameters such as stresses, strains, temperatures, phase transformation, minimum uncut chip thickness and size effects are discussed in this paper for the in-depth understanding of the micro/nano-cutting process.

Recent Advances in Micro/Nano-cutting: Effect of Tool Edge and Material Properties

Sculpturing of single crystal silicon microstructures by elliptical vibration cutting

Subsurface damage and phase transformation in laser-assisted nanometric cutting of single crystal silicon

Experimental Work on Micro Laser-Assisted Diamond Turning of Silicon (111)

A wide range of materials including metals and alloys, ceramics, glasses, semiconductors and composites are manufactured to meet service requirements to a given geometry, accuracy, finish and surface integrity. Metals and alloys in general are easier to machine because of their high fracture toughness, low hardness, non-directional bonding, low porosity, large strain to fracture and high impact energy. Non-metals, on the other hand, such as ceramics, semiconductors and optical crystals are characterized by covalent or ionic bonding, limited slip systems for plastic deformation, high hardness and low fracture toughness. It is due to these major differences that ceramics, semiconductors and optical crystals are considered more challenging to machine.

Micro-laser assisted machining: the future of manufacturing silicon optics

A laser-transmitting machining tool is disclosed. The laser-transmitting machining tool has a plurality of faces including an entrance face, a rake face, a flank face connected to the rake face, a rake side face extending between the entrance face and the rake face, and a flank side face extending between the entrance face and the flank face. The connection of the rake face to the flank face defines a cutting edge. The rake face extends away from the rake side face to define a rake angle. The entrance face is configured to receive and refract a laser beam to the rake face, the flank face, and the cutting edge for causing the laser beam to refract into and heat the workpiece at a compression region extending proximate at least the rake face and a tensile region extending proximate the flank face. A system for machining a workpiece is disclosed. A method for machining a workpiece is also disclosed.

Laser-Transmitting Tooling

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Papers

Experimental Work on Micro Laser-Assisted Diamond Turning of Silicon (111)

Micro-laser assisted machining: the future of manufacturing silicon optics

Laser-Transmitting Tooling