S. Gupte
Auburn University
11 Papers
291 Citations
S. Gupte is an academic researcher from Auburn University. The author has contributed to research in topics: Shock (mechanics) & Electronic packaging. The author has an hindex of 8, co-authored 11 publications.
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Papers
Solder-joint reliability in electronics under shock and vibration using explicit finite-element sub-modeling
Pradeep Lall,S. Gupte,P. Choudhary,J. Suhling +3 more
- 05 Jul 2006
TL;DR: In this article, the modeling approach for first-level solder interconnects in shock and drop of electronics assemblies has been developed without any assumptions of geometric-symmetry or loading symmetry.
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Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging
Pradeep Lall,Dhananjay Panchagade,P. Choudhary,Jeffrey C. Suhling,S. Gupte +4 more
- 20 Jun 2005
TL;DR: In this paper, a failure-envelope approach based on wavelet transforms and damage proxies has been developed to model drop and shock survivability of electronic packaging data on damage progression under transient-shock and vibration in both 955Sn40Ag05Cu and 63Sn37Pb ball-grid arrays has been presented Component types examined include flex-substrate and rigid substrate ballgrid arrays Dynamic measurements like acceleration, strain and resistance are measured and analyzed using highspeed data acquisition system capable of capturing in-situ strain, continuity and acceleration data in excess of 5 million samples per
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Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics under Shock Loads
Pradeep Lall,P. Choudhary,S. Gupte,J. Suhling,James Hofmeister +4 more
- 25 Jun 2007
TL;DR: In this paper, a new approach has been developed to monitor product-level damage during shock and vibration using the dynamic response of the electronic equipment, which is applicable at the system level for identification of impending failures to trigger repair or replacement significantly prior to failure.
Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics Under Shock Loads
TL;DR: In this article, a new approach has been developed to monitor product-level damage during shock and vibration using the dynamic response of the electronic equipment using the built-in stress test (BIST).
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Cohesive-Zone Explicit Sub-Modeling for Shock Life-Prediction in Electronics
Pradeep Lall,S. Gupte,P. Choudhary,J. Suhling,Robert Francis Darveaux +4 more
- 25 Jun 2007
TL;DR: In this article, two modeling approaches are proposed to enable life prediction under both symmetric and anti-symmetric transient deformation, and failure data obtained by solder joint array tensile tests on ball grid array packages is used as a failure proxy to predict the failure in solder interconnections modeled using Timoshenko beam elements in the global model.
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