Electromagnetic Shielding

Electromagnetic interference (EMI) issues are expected to be crucial for next-generation system-on-package (SOP) integrated high-performance digital LSIs and for radio frequency (RF) and analog circuits. Ordinarily in SOPs, high-performance digital LSIs are sources of EMI, while RF and analog circuits are affected by EMI (victims). This paper describes the following aspects of EMI in SOPs: 1) die/package-level EMI; 2) substrate-level EMI; 3) electromagnetic modeling and simulation; and 4) near electromagnetic field measurement. First, LSI designs are discussed with regard to radiated emission. The signal-return path loop and switching current in the power/ground line are inherent sources of EMI. The EMI of substrate, which work as coupling paths or unwanted antennas, is described. Maintaining the return current path is an important aspect of substrate design for suppressing EMI and for maintaining signal integrity (SI). In addition, isolating and suppressing the resonance of the DC power bus in a substrate is another important design aspect for EMI and for power integrity (PI). Various electromagnetic simulation methodologies are introduced as indispensable design tools for achieving high-performance SOPs without EMI problems. Measurement techniques for near electric and magnetic fields are explained, as they are necessary to confirm the appropriateness of designs and to investigate the causes of EMI problems. This paper is expected to be useful in the design and development of SOPs that take EMI into consideration.

/pdf/electromagnetic-interference-emi-of-system-on-package-sop-1ptkb45ery.pdf

Electromagnetic interference (EMI) of system-on-package (SOP)

The penetration of high-intensity radiated fields (HIRF) into conducting enclosures via apertures is an EMI issue that is relevant to all aviation. The stories are numerous, of disrupted communications, disabled navigation equipment, etc., due to the effects of EM sources external to the aircraft. Here, the FDTD method is used to predict the shielding effectiveness of conducting enclosures with apertures, and the numerical results are compared with measurements. Several issues related to the FDTD analysis of highly resonant and high-quality factor (high-Q) structures, such as windowing and acceleration techniques, are examined and discussed.

HIRF penetration through apertures: FDTD versus measurements

The evaluation of the shielding effectiveness (SE) of rectangular metallic enclosures having apertures in their walls and loaded with conducting bodies is the subject of this paper. The conducting objects can be either modifications of the inner part of the enclosure (e.g., simple metal plates or protrusions of the walls) or elements to be protected from external fields (e.g., printed circuit boards or metallic boxes). The SE of such enclosures is thus investigated through an efficient integral formulation based on the method of moments. The proposed approach makes use of a very fast computation of the enclosure Green's functions, based on the Ewald representation and interpolation techniques. The analysis shows that the classical SE of enclosures (calculated when a uniform plane wave impinges on the aperture of an empty enclosure) can be a very tricky figure of merit since the field inside the shield can be seriously affected by the possible presence of 2-D or 3-D conducting loads, especially in the frequency range above the first resonant frequency of the aperture-enclosure system. Comparisons with full-wave results obtained through different commercial software confirm the validity of the proposed technique and its excellent performance.

Fast MoM Analysis of the Shielding Effectiveness of Rectangular Enclosures With Apertures, Metal Plates, and Conducting Objects

The multilevel fast multipole moment method is employed to compute the electromagnetic coupling and shielding of various aperture-coupled metallic enclosures. A phenomenological study of electromagnetic coupling, due to various slot shapes and sizes, with or without the presence of wire penetration is conducted. These slots are situated on over-moded cavities and two methods are proposed to mitigate slot coupling into the cavity's interior. As part of this work, we also investigate the coupling through similar slots and apertures within a complex platform such as an automobile. The proposed methods have shown to increase shielding by as much as 5-35 dB within the frequency range of interest.

http://www1.ece.uic.edu/MURI-RF/Publications_Canta/siah_couplingstudies.pdf

Coupling studies and shielding techniques for electromagnetic penetration through apertures on complex cavities and vehicular platforms

This paper presents a detailed study of the shielding effectivity properties of metal enclosures. Measurements in anechoic chambers are compared to full-wave electromagnetic simulations. The study is not limited to the frequency range below the first resonance frequency. Different aspects are investigated such as the influence of the size, position and number of apertures, and the effect of the presence of metal plates and of absorbing materials. Where possible, the specific behavior of the shielding effectivity is explained theoretically and existing simple design rules are assessed.

Numerical and experimental study of the shielding effectiveness of a metallic enclosure

This paper focuses on the radiated EMC-behaviour of ICs and ASICs. An EMC testchip has been developed, encompassing some passive IC interconnection structures. Together with a dedicated EMC-testboard for mounting the IC, as well as a suited EMC measurement set-up, a configuration is obtained that enables one to perform an in-depth evaluation of some important EMC radiating mechanisms at chip level. The EMC-measurements have focused on the comparison between the radiation from IC-interconnects, and the radiation from well-known PCB-interconnects (such as microstrips). From this comparison, the authors observe that an on-chip interconnect may generate significantly more radiation (up to 20 dB for frequencies above 700 MHz) than a microstrip track of comparable length. Especially, packaging effects play a major role in this.

Accurate characterization of some radiative EMC phenomena at chip level, using dedicated EMC-testchips

This paper analyzes the radiated EMC-behaviour of integrated circuits. For this purpose, an active EMC testchip has been designed, focusing on some specific topics such as output driver slew-rate control, on-chip decoupling, ground-bounce reduction, and others. Together with a dedicated EMC-testboard for mounting the chip, as well as a suited EMC measurement set-up, a global configuration is obtained that enables us to perform an in-depth assessment of some important EMC radiating mechanisms at chip level. The first part of this paper describes the design of the EMC-testchip. In the second part, some first EMC-measurements on the testchip are discussed. From this study, it is quantified to what extent output signal staggering and slew-rate control can help in solving EMC-problems at chip-level.

http://ieeexplore.ieee.org/iel5/6560/17532/00810177.pdf

Design and characterization of an active, EMC-dedicated testchip

Alcatel SSD Antwerp (Belgium) has an "ecodesign toolkit" available, in order to reduce the overall environmental impacts of its telecommunications products. This toolkit contains three basic types of "tools": qualitative (guidelines and checklists); semi-quantitative (metrics); and quantitative (LCA based approaches). This paper specifically focuses on product related metrics, which indicate how well a product meets the requirements which are part of the ecodesign guidelines and checklist. This allows product designers to calculate a single value (expressed in environmental penalty points) which indicates the environmental performance of a specific product layout. In addition, the metrics reveals the key issues where environmental product improvements can be achieved. In this paper, the metrics approach is described and compared to two life cycle oriented approaches: life cycle assessment (LCA); and an eco-design analysis using software tool for quick eco-design assessments. The subject of this comparative assessment was a fan unit, a sub-assembly of a telecommunication broadband switching rack.

Metrics for telecom products: essential part of an ecodesign methodology

Handle everyday research tasks with reliable, citation-backed results

Your personal Research Agent to handle research tasks with citation-backed results

Popular Tasks used by Researchers

How can I help with your research?

Meet SciSpace

Get more enhanced response by uploading the PDFs you want me to reference.

No relevant PDFs in your library

SciSpace is the AI research assistant for academics. Run systematic literature reviews on 280M+ papers, and write papers with cited sources. Trusted by 1M+ students, PhDs & researchers.

SciSpace | AI for Research

Analyze PDFs

Code & Manuscripts

Funding & Grants

Literature & Patents

Medical & Clinical Data

Systematic Review

Visualize & Present

Web & Data

Build a Google Scholar-like website for your research.

Build a website

Create charts and images for your research

Create a Chart

Write a paper for submission to a journal

Draft a manuscript

Patent Search

Design eye-catching scientific posters in minutes.

Scientific Poster Generation

Systematic Literature Review

One task is running at the moment. Your messages will be shown right after.

Drag and drop or click here to browse

Loved by <highlight>1 million+</highlight> researchers

Extract a list of specific topics and their sources from unstructured text

Topics

Compare and analyze relevant papers that matches with your search

Papers

Get insights from PDFs and bookmarked papers from your library

My library

Recent searches

Try searching for:

Catch AI-generated content in scholarly and non-scholarly content

{ai} Detector

Ai Writer

Get PDF Summaries, highlighted text explanations 

Chat with PDF

Effortlessly create in-text citations and bibliographies in APA and 2,500 other formats

Citation generator

Get explanations, summaries, and answers on academic papers

Ease up your research workflow with {scispace}'s cohort of exciting AI tools

Elevate your academic writing skills and convey your ideas the way you want

Paraphraser

Explore our range of reading and writing tools

Your file is being prepared and should be ready in a few minutes. If it's a large file, it might take a bit longer. You can close this window, and we'll email you the file when it's done.

You have reached a maximum limit of <strong>{limit}</strong> columns in the table. Remove at least <strong>1</strong> column to add or create another one.

S. Criel

Author Tools

Chat about Author

Papers

Numerical and experimental study of the shielding effectiveness of a metallic enclosure

Accurate characterization of some radiative EMC phenomena at chip level, using dedicated EMC-testchips

Design and characterization of an active, EMC-dedicated testchip

Metrics for telecom products: essential part of an ecodesign methodology