This paper proposes a low-power 240 frames/s 2.1 M-pixel CMOS image sensor with column-shared cyclic (CY) ADCs. Two-column shared CY-ADC architecture and two-level stacked ADC placement are employed for low-power and small pixel pitch design. The proposed CY-ADC uses only one OTA and four capacitors. Distributed clocking scheme using cascaded repeaters is proposed to reduce the required peak current. The prototype sensor was fabricated in a 0.13- μm 1P4M process with pixel pitch of 2.25 μm . The designed 10-bit ADC dissipates only 90 μW/channel with 1.5 V supply. The measured DNL and INL are +0.59/-0.83 LSB and +2.8/-3.6 LSB, respectively. The measured maximum pixel rate is 500 Mpixels/s with total power consumption of 300 mW.

A 240-frames/s 2.1-Mpixel CMOS Image Sensor With Column-Shared Cyclic ADCs

The intention of zooming in a video camera is to obtain more detailed visual information than the full frame view. The optical zooming mechanisms provide this additional information, however, when optically zoomed, the camera no longer detects the full frame view, which was detected before zooming. Digital zooming can detect the full view at all times, however, fails to provide additional visual information when zoomed. In applications such as visual surveillance and manufacturing quality measurement, it is required to detect the full frame view at all times, the camera should be capable of providing additional visual information when zoomed to the region of interest (ROI). This paper presents a video camera system incorporating an autonomous pan, tilt and zoom functionality based on ROI decided upon motion detection capability, which provides more visual information in zoomed modes while detecting the full view at all times. The intelligent ROI decision can be made not only based on motion but also shape, color, sizes etc. of targeted objects for tracking. Image sharpening and noise reduction methods are also provided within the camera system. Standard testing results indicate that this camera system can resolve up to 800 TV lines and produces comparable color quality to other CCD based CCTV surveillance cameras, especially at good lighting conditions.

Digital zoom camera with image sharpening and suppression

De evolutie van licht emitterende diodes (LED) heeft ervoor gezorgd dat het op dit moment interessant wordt om deze componenten als lichtbron te gebruiken in projectiesystemen. LED’s hebben belangrijke voordelen vergeleken met klassieke booglampen. Ze zijn compact, ze hebben een veel grotere levensduur en ogenblikkelijke schakeltijden, ze werken op lage spanningen, etc. LED’s zijn smalbandig en kunnen een groterekleurenbereik realiseren. Ze hebben momenteel echter een beperkte helderheid. Naast de lichtbron is het type van de lichtklep ook bepalend voor de kwaliteit van een projectiesysteem. Er bestaan verschillende lichtkleptechnologieen waaronder die van de reflectieve LCOS-panelen. Deze lichtkleppen kunnen zeer hoge resoluties hebben en wordenvaak gebruikt in kwalitatieve, professionele projectiesystemen. LED’s zijn echter totaal verschillend van booglampen. Ze hebben een andere vorm, package, stralingspatroon, aansturing, fysische en thermische eigenschappen, etc. Hoewel er een twintigtal optische architecturen bekend zijn voor reflectieve beeldschermen (met een booglamp als lichtbron), zijn ze niet geschikt voor LED-projectoren en moeten nieuwe optische architecturen en een elektronische aansturing ontwikkeld worden. In dit doctoraat werd er hieromtrent onderzoek gedaan. Er werd uiteindelijk een driekleurenprojector (R, G, B) met een efficient LED-belichtingssysteem gebouwd met twee LCOS-lichtkleppen. Deze LEDprojector heeft superieure eigenschappen (zeer lange levensduur, beeldkwaliteit, etc.) en een matige lichtopbrengst.

https://biblio.ugent.be/publication/3235653/file/3235699.pdf

Design of LCOS microdisplay backplanes for projection applications

On the basis of the systematic study of stitching techniques, a large area, 28.3mm × 38.8mm, 42 Mega pixels CMOS Imaging Sensor (CIS) had been demonstrated on 12 inch silicon wafer in a 0.055 μm CMOS process. By scanning a reticle across a wafer of silicon, smaller arrays can be stitched together to construct larger area sensors. Meanwhile, in order to verify the feasibility and capability of stitching, a 203mm × 179mm, 1.8 Billion pixels CIS was also created without any performance deficiency.

/pdf/systematic-experimental-study-on-stitching-techniques-of-5a103cy1h8.pdf

Systematic experimental study on stitching techniques of CMOS Image Sensors

The goal of this paper is to make a study about a simple optical images acquisition system as that one used in video mobile phones. We focus our analyses to optoelectronic aspects using Fourier optics to compute PSF (point spread function) and MTF (modulation transfer function). We use an optical sensor and a CCD (charge coupled device) image sensor to make an image acquisition sensor. Optical sensor is made by two lenses and an aperture. We compute the PSF and MTF for lenses: one with coma aberration and the other without aberrations, then for the aperture and finally PSF and MTF for CCD image sensor. We present an image at each checking point and we see how the original image is transformed as it propagates to optical and image sensors.

Simple image acquisition system optoelectronic analysis

This paper discusses a 13.89 million pixels CMOS image sensor with the same size as a 36x24 mm 2 film negative. The pitch of the 3-transistor active pixel is 8 microns. The sensor has a full well charge of 65,000 electrons and 35 electrons temporal noise, and a dynamic range of 65 dB. This Sensor can be used in a variety of applications. Especially for machine vision, the resolution, the simple operation of the device and the compatibility of 35 mm optics make it an attractive device. The paper will also address more in detail some advantages of this sensor for vision and inspection applications.

A 35 mm 13.89 Million Pixel CMOS Active Pixel Image Sensor

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A 35 mm 13.89 Million Pixel CMOS Active Pixel Image Sensor