Physical vapour deposition (PVD) is a well-known technology that is widely used for the deposition of thin films regarding many demands, namely tribological behaviour improvement, optical enhancement, visual/esthetic upgrading, and many other fields, with a wide range of applications already being perfectly established. Machining tools are, probably, one of the most common applications of this deposition technique, sometimes used together with chemical vapour deposition (CVD) in order to increase their lifespan, decreasing friction, and improving thermal properties. However, the CVD process is carried out at higher temperatures, inducing higher stresses in the coatings and substrate, being used essentially only when the required coating needs to be deposited using this process. In order to improve this technique, several studies have been carried out optimizing the PVD technique by increasing plasma ionization, decreasing dark areas (zones where there is no deposition into the reactor), improving targets use, enhancing atomic bombardment efficiency, or even increasing the deposition rate and optimizing the selection of gases. These studies reveal a huge potential in changing parameters to improve thin film quality, increasing as well the adhesion to the substrate. However, the process of improving energy efficiency regarding the industrial context has not been studied as deeply as required. This study aims to proceed to a review regarding the improvements already studied in order to optimize the sputtering PVD process, trying to relate these improvements with the industrial requirements as a function of product development and market demand.

Sputtering Physical Vapour Deposition (PVD) Coatings: A Critical Review on Process Improvement and Market Trend Demands

Thin films are ubiquitous in modern technology and highly useful in materials discovery and design. For achieving optimal extrinsic properties, their microstructure needs to be controlled in a multi-parameter space, which usually requires too high a number of experiments to map. Here, we propose to master thin film processing microstructure complexity, and to reduce the cost of microstructure design by joining combinatorial experimentation with generative deep learning models to extract synthesis-composition-microstructure relations. A generative machine learning approach using a conditional generative adversarial network predicts structure zone diagrams. We demonstrate that generative models provide a so far unseen level of quality of generated structure zone diagrams that can be applied for the optimization of chemical composition and processing parameters to achieve a desired microstructure. Controlling the microstructure of thin films is vital for tuning their properties. Here, machine learning is applied to obtain synthesis-composition-microstructure relationships in the form of structure zone diagrams for thin films, enabling microstructure prediction.

pdf/predicting-structure-zone-diagrams-for-thin-film-synthesis-4cgwdfxyfm.pdf

Predicting structure zone diagrams for thin film synthesis by generative machine learning

PVD techniques proffering avenues for fabrication of porous tungsten oxide (WO3) thin films: A review

Friction and wear usually lead to huge energy loss and failure of machine pairs, which usually causes great economic losses. Researchers have made great efforts to reduce energy dissipation and enhance durability through advanced lubrication technologies. Single-layer coatings have been applied in many sectors of engineering, but the performance of single-layer coatings still has many limitations. One solution to overcome these limitations is to use a multilayer coating that combines different components with varied physical and chemical properties. In addition, multilayer coating with alternating layers only containing two components can lead to improved performance compared to a coating with only two different layers. This paper systematically reviews the design concept and properties of different types of multilayer coatings, including transition-metal nitride coatings, diamond-like carbon-based coatings, and other multilayer coatings. The inherent functional mechanisms of the multilayer structures are also detailed and discussed.

/pdf/multilayer-coatings-for-tribology-a-mini-review-1bcr7h3c.pdf

Multilayer Coatings for Tribology: A Mini Review

Achieving on chip micro-supercapacitors based on CrN deposited by bipolar magnetron sputtering at glancing angle

In this work, TiN, ZrN and HfN thin films fabricated using glancing angle deposition (GLAD) technique are studied both experimentally and by numerical simulations. The films (~1 μm thickness) were deposited by reactive magnetron sputtering at 0.3 Pa and 300 °C on Si substrates inclined at α = 85° with respect to the target. The film morphology and crystal structure were characterized by scanning electron microscopy, atomic force microscopy and X-ray diffraction (XRD), including pole figure measurements. The wettability of these coatings was investigated using the sessile drop method with three different liquids. It is shown that TiN, ZrN and HfN films have a cubic, NaCl-type crystal structure with a [111] out-of-plane orientation and exhibit a biaxial texture. XRD pole figures reveal that the crystal habit of the grains consists of {100} facets constituting triangular-base pyramids. The films develop columnar microstructures, with typical column widths of ~100 nm. The tilt angle β of the columns is found to increase from 24.5, 31.5 to 34° for TiN, ZrN and HfN films, respectively. Atomistic computations of the growth of these nitrides at glancing angle using a kinetic Monte Carlo model reveal that the growth morphology and variation in column tilt angle is well reproduced by considering the difference in the angular distribution of the sputtered particles. This study also shows that GLAD films are hydrophilic comparatively to the same films deposited at near-normal incidence, and among the three nitrides, TiN is the more wettable coating.

/pdf/study-of-columnar-growth-texture-development-and-wettability-509m01ymvc.pdf

Study of columnar growth, texture development and wettability of reactively sputter-deposited TiN, ZrN and HfN thin films at glancing angle incidence

In this study, polycrystalline hafnium nitride (HfN) thin films were grown by oblique angle deposition (OAD) technique to investigate the relationship between column tilt angle, texture development and residual stress evolution with varying inclination angle α of the substrate. The films (~1 μm thickness) were grown at various angles (α = 5°, 25°, 35°, 65°, 75°, and 85°) with respect to the substrate normal by reactive magnetron sputtering at 0.3 Pa and 300 °C. The film morphology, crystal structure and residual stress state were characterized by scanning electron microscopy and X-ray diffraction (XRD), including pole figure and sin2ψ measurements. All HfN films had a cubic, NaCl-type crystal structure with an [111] out-of-plane orientation and exhibited a biaxial texture for α ≥ 35°. XRD pole figures reveal that the crystal habit of the grains consists of {100} facets constituting triangular-base pyramids, with a side and a corner facing the projection of the incoming particle flux (indicative of a double in-plane alignment). A columnar microstructure was formed for α ≥ 35°, with typical column widths of 100 nm. It is observed that the column tilt angle β increases monotonously for α ≥ 35°, reaching β = 34° at α = 85°. This variation at microscopic scale is correlated with the tilt angle of the (111) crystallographic planes, changing from −24.8 to 11.3° with respect to the substrate surface. The residual stress changes from strongly compressive (~−5 GPa at α = 5°) to negligible or slightly tensile for α ≥ 35°. The observed trends are compared to previous works of the literature and discussed based on existing crystal growth and stress models, as well as in light of energy and angular distribution of the incident particle flux calculated by Monte Carlo. Importantly, a decrease of the average kinetic energy of Hf particles from 22.4 to 17.7 eV is found with increasing α due to an increase number of collisions.

https://www.mdpi.com/2079-6412/9/11/712/pdf

Texture and Stress Evolution in HfN Films Sputter-Deposited at Oblique Angles

Effect of temperature on the growth of TiN thin films by oblique angle sputter-deposition: A three-dimensional atomistic computational study

https://hal.archives-ouvertes.fr/hal-01938495/document

Nanocolumnar TiN thin film growth by oblique angle sputter-deposition : Experiments vs. simulations

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Papers

Study of columnar growth, texture development and wettability of reactively sputter-deposited TiN, ZrN and HfN thin films at glancing angle incidence

Texture and Stress Evolution in HfN Films Sputter-Deposited at Oblique Angles

Effect of temperature on the growth of TiN thin films by oblique angle sputter-deposition: A three-dimensional atomistic computational study

Nanocolumnar TiN thin film growth by oblique angle sputter-deposition : Experiments vs. simulations