Reinhold H. Dauskardt
Stanford University
429 Papers
3.5K Citations
Reinhold H. Dauskardt is an academic researcher from Stanford University. The author has contributed to research in topics: Fracture mechanics & Fracture toughness. The author has an hindex of 59, co-authored 409 publications. Previous affiliations of Reinhold H. Dauskardt include University of California, Berkeley & Center for Advanced Materials.
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Papers
Effects of Pre-Charged Hydrogen on the Mechanical and Thermal Behavior of Zr-Ti-Ni-Cu-Be Bulk Metallic Glass Alloys
TL;DR: In this article, the effects of pre-charged hydrogen on the deformation, fracture and thermal behavior of a Zr-Ti-Ni-Cu-Be bulk metallic glass were investigated.
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Degradation of thermally-cured silicone encapsulant under terrestrial UV
TL;DR: In this article, fracture mechanics based metrologies were developed to characterize the adhesion of the silicone encapsulant and its adjacent surfaces, as well as the cohesion of the encapsulants.
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Conductive Transparent TiNx/TiO2 Hybrid Films Deposited on Plastics in Air Using Atmospheric Plasma Processing
TL;DR: In this paper, the successful deposition of conductive transparent TiNx/TiO2 hybrid films on both polycarbonate and silicon substrates from a titanium ethoxide precursor is demonstrated in air using atmospheric plasma processing equipped with a high temperature precursor delivery system.
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A stability study of roll-to-roll processed organic photovoltaic modules containing a polymeric electron-selective layer
TL;DR: In this article, the stability of roll-to-roll processed organic photovoltaic modules having an inverted structure and incorporating polyethylenimine-ethoxylate (PEIE) as the electron-selective layer was investigated.
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Environmental Influence on Module Delamination Rate
TL;DR: In this paper, the role of environmental factors such as temperature and humidity on the delamination kinetics of the ethylene vinyl acetate (EVA)/silicon-photovoltaic (Si-PV) cell interface is investigated.
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